Works matching DE "THERMOCYCLING"

Results: 2263

Effects of europium doping on thermal property and failure behaviour of Gd2Zr2O7 thermal barrier coatings.

Published in:

NPJ Materials Degradation, 2025, v. 9, n. 1, p. 1, doi. 10.1038/s41529-025-00598-3

By:

Shen, Zaoyu;
Luo, Yuqing;
Liu, Guanxi;
Dai, Jianwei;
He, Limin;
Mu, Rende

Publication type:

Article

Assessing the Powder Bed Fusion–Laser Beam Potential of Glass‐Forming Alloys Using Single and Multitrack Laser Glazing Experiments.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402214

By:

Mohan, Soumya;
Holberton, Harrison;
Stebner, Aaron P.;
Hofmann, Douglas C.

Publication type:

Article

Torsional resistance of additively, subtractively, and conventionally manufactured occlusal devices.

Published in:

Clinical Oral Investigations, 2025, v. 29, n. 6, p. 1, doi. 10.1007/s00784-025-06362-w

By:

Maleki, Tina;
Coldea, Andrea;
Meinen, John;
Reymus, Marcel;
Edelhoff, Daniel;
Stawarczyk, Bogna

Publication type:

Article

Long-term stability and performance of nanostructured thermal barrier coatings deposited by magnetron sputtering on superalloys: A review.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 149, doi. 10.1177/02670844251328622

By:

Altaf, Syed Faizan;
Rahman, Atikur;
Wani, MF

Publication type:

Article

Research on microstructural and property evolution in laser cladded HAZ.

Published in:

Surface Engineering, 2021, v. 37, n. 12, p. 1514, doi. 10.1080/02670844.2021.1929737

By:

Pan, Cunliang;
Li, Xiaoqiang;
Zhang, Ruihua;
Lu, Chao;
Yang, Chao;
Yao, Dengzhi

Publication type:

Article

Characterization and oxidation behaviour of nanostructured La2(Zr0.7Ce0.3)2O7/YSZ coatings prepared by calcined precursor precipitate plasma spraying.

Published in:

Surface Engineering, 2021, v. 37, n. 7, p. 861, doi. 10.1080/02670844.2020.1860463

By:

Taleghani, Pejman Rezaei;
Valefi, Zia;
Ehsani, Naser

Publication type:

Article

Plasma-sprayed alumina coating on Inconel 600 for fast reactor neutron detector application.

Published in:

Surface Engineering, 2018, v. 34, n. 10, p. 721, doi. 10.1080/02670844.2017.1404695

By:

Ravi Shankar, A.;
Thyagarajan, K.;
Upadhyay, Chandrakanth;
Mallika, C.;
Kamachi Mudali, U.

Publication type:

Article

Preparation of the plasma-sprayed graded thermal barrier coating by co-injection of premixed powders through a single plasma torch.

Published in:

Surface Engineering, 2018, v. 34, n. 10, p. 728, doi. 10.1080/02670844.2017.1374634

By:

Ravi Shankar, A.;
Kamachi Mudali, U.

Publication type:

Article

Effect of cryogenic thermal cycling on SiC-modified C/C composites.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 237, doi. 10.1080/02670844.2016.1216053

By:

Zhang, M.-Y.;
Li, K.-Z.;
Shi, X.-H.;
Liu, N.-K.

Publication type:

Article

Influence of thermocycle boroaluminising on strength of steel C30.

Published in:

Surface Engineering, 2014, v. 30, n. 2, p. 129, doi. 10.1179/1743294413Y.0000000208

By:

Sizov, I.;
Mishigdorzhiyn, U.;
Leyens, C.;
Vetter, B.;
Fuhrmann, T.

Publication type:

Article

Modelling of Ratchet Growth in TATB‐Based Charge under Thermal Cycling.

Published in:

Propellants, Explosives, Pyrotechnics, 2022, v. 47, n. 10, p. 1, doi. 10.1002/prep.202100271

By:

Wang, Shuo;
Yan, Xilin;
Lu, Fangyun;
Lei, Siyang;
Chen, Rong

Publication type:

Article

Coefficient of Thermal Expansion Evolution during Ratchet Growth of PBX 9502 and Neat TATB.

Published in:

Propellants, Explosives, Pyrotechnics, 2022, v. 47, n. 5, p. 1, doi. 10.1002/prep.202100322

By:

Woznick, Caitlin S.;
Graff Thompson, Darla;
Scott, Sidney J.

Publication type:

Article

Coefficient of Thermal Expansion during Ratchet Growth of TATB Compactions.

Published in:

Propellants, Explosives, Pyrotechnics, 2020, v. 45, n. 12, p. 1877, doi. 10.1002/prep.202000175

By:

Graff Thompson, Darla;
Woznick, Caitlin S.;
DeLuca, Racci;
Scott, Sidney J.

Publication type:

Article

Evaluation of Mechanical Properties of Composite Solid Propellant by Genetic Engineering of Materials: Part A.

Published in:

Propellants, Explosives, Pyrotechnics, 2019, v. 44, n. 9, p. 1167, doi. 10.1002/prep.201800385

By:

Zhang, Wei;
Zhou, Xing;
Bao, Tong;
Deng, Lei;
Gao, Dong‐lei

Publication type:

Article

Thermal Cycling and Ratchet Growth of TATB and PBX 9502.

Published in:

Propellants, Explosives, Pyrotechnics, 2019, v. 44, n. 7, p. 850, doi. 10.1002/prep.201800357

By:

Thompson, Darla Graff;
Woznick, Caitlin;
DeLuca, Racci

Publication type:

Article

Time-Evolution of TATB-Based Irreversible Thermal Expansion (Ratchet Growth).

Published in:

Propellants, Explosives, Pyrotechnics, 2015, v. 40, n. 4, p. 558, doi. 10.1002/prep.201400214

By:

Graff Thompson, Darla;
Schwarz, Ricardo B.;
Brown, Geoff W.;
DeLuca, Racci

Publication type:

Article

An All-Ceramic Solid-State Rechargeable Na+-Battery Operated at Intermediate Temperatures.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 34, p. 5380, doi. 10.1002/adfm.201400773

By:

Wei, Tao;
Gong, Yunhui;
Zhao, Xuan;
Huang, Kevin

Publication type:

Article

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09590-y

By:

Chen, Huifeng;
Liu, Yang;
Zhang, Shuang;
Cao, Rongxing;
Xue, Yuxiong

Publication type:

Article

Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09488-9

By:

Wu, Jie;
Huang, Guoqiang;
Wu, Yiping;
Huang, Xiwu;
Yu, Rui;
Yang, Xuqi;
Chen, Guangyao;
Xu, Yong

Publication type:

Article

Unraveling the effect of mixed charge carrier on the electrical conductivity in MAPbBr3 perovskite due to ions incorporation.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 23, p. 18327, doi. 10.1007/s10854-022-08687-8

By:

Freitas, Andre L. M.;
Tofanello, Aryane;
Bonadio, Ariany;
Souza, Jose A.

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Early transient creep of single crystal SnAgCu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13657, doi. 10.1007/s10854-022-08300-y

By:

Das, Ronit;
Thekkut, Sanoop;
Sivasubramony, Rajesh Sharma;
Alghoul, Thaer;
Mahmood, Atif;
Joshi, Shantanu;
Arroyo, Carlos;
Sharma, Gaurav;
Borgesen, Peter

Publication type:

Article

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 1942, doi. 10.1007/s10854-021-07395-z

By:

Chen, Yinbo;
Wang, Changchang;
Gao, Yue;
Gao, Zhaoqing;
Liu, Zhi-Quan

Publication type:

Article

Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20384, doi. 10.1007/s10854-021-06549-3

By:

Liu, Yang;
Chen, Chuantong;
Kim, Dongjin;
Zhang, Zheng;
Long, Xu;
Suganuma, Katsuaki

Publication type:

Article

Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19890, doi. 10.1007/s10854-021-06513-1

By:

Takemasa, Tetsu;
Chen, Chuantong;
Suganuma, Katsuaki

Publication type:

Article

Reliability and strength of Cu–Sn0.5CuZnAl–Cu TLP bonded joints during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19264, doi. 10.1007/s10854-021-06446-9

By:

Sun, Lei;
Zhang, Yi;
Zhang, Liang;
Chen, Cong-ping

Publication type:

Article

Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17143, doi. 10.1007/s10854-021-06159-z

By:

Zhou, Guoyun;
Zhang, Xiumei;
Hong, Yan;
Wang, Yuefeng;
Wang, Chong;
He, Wei;
Wang, Shouxu;
Chen, Yuanming;
Chen, Shijin;
Han, Zhiwei;
Xu, Huan

Publication type:

Article

The rapidly reversible processes of activation and deactivation in amorphous silicon heterojunction solar cell under extensive light soaking.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 4, p. 4045, doi. 10.1007/s10854-020-05146-0

By:

Bao, Shaojuan;
Yang, Liyou;
Huang, Jin;
Bai, Yanhui;
Yang, Ji;
Wang, Jilei;
Lu, Linfeng;
Feng, Le;
Bai, Xingliang;
Ren, Fayuan;
Li, Dongdong;
Jia, Huijun

Publication type:

Article

Effect of purity of Al interlayer on stress and thermal cycling durability of die-attach Ni–Sn joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 23, p. 21389, doi. 10.1007/s10854-020-04651-6

By:

Ito, Hirofumi;
Kadoura, Hiroaki;
Kuwahara, Makoto;
Usui, Masanori

Publication type:

Article

YBCO-based non-volatile ReRAM tested in Low Earth Orbit.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16389, doi. 10.1007/s10854-020-04190-0

By:

Acha, C.;
Barella, M.;
Sanca, G. A.;
Gomez Marlasca, F.;
Huhtinen, H.;
Paturi, P.;
Levy, P.;
Golmar, F.

Publication type:

Article

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14635, doi. 10.1007/s10854-020-04026-x

By:

Gao, Runhua;
He, Siliang;
Li, Jiahui;
Shen, Yu-An;
Nishikawa, Hiroshi

Publication type:

Article

Optical and reliability properties studies of Sr4Al14O25:Eu2+ film for high-CRI white LEDs.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 16, p. 13561, doi. 10.1007/s10854-020-03912-8

By:

Wang, Li;
Wang, Wei;
Shang, Zhaojiang;
Cao, Peiyuan;
Shi, Mingming;
Yang, Bobo;
Zou, Jun

Publication type:

Article

Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 7200, doi. 10.1007/s10854-020-03292-z

By:

Wen, Li;
Xue, Songbai;
Wang, Liujue;
Liu, Han;
Wu, Jie

Publication type:

Article

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5731, doi. 10.1007/s10854-020-03141-z

By:

Wang, Jianhao;
Xue, Songbai;
Wang, Jianxin;
Zhang, Peng;
Tao, Yu;
Wang, Ziyi

Publication type:

Article

Effect of double doping, Li and Se, on the high-temperature thermoelectric properties of Cu2Te.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4129, doi. 10.1007/s10854-020-02960-4

By:

Mallick, Md. Mofasser;
Vitta, Satish

Publication type:

Article

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 3715, doi. 10.1007/s10854-020-02930-w

By:

Kim, Dongjin;
Chen, Chuantong;
Lee, Seung-Joon;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4

By:

Seo, Wonil;
Ko, Yong-Ho;
Kim, Young-Ho;
Yoo, Sehoon

Publication type:

Article

Cu-Ba0.7Sr0.3TiO3 composites for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 9022, doi. 10.1007/s10854-019-01231-1

By:

Kumar, Sanjay;
Pradeepkumar, Maurya Sandeep;
Dwivedi, Akansha;
Ahmad, Md. Imteyaz

Publication type:

Article

Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5820, doi. 10.1007/s10854-019-00880-6

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Thermal cycling aging effects on the tensile property and constitute behavior of Sn-3.0Ag-0.5Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 867, doi. 10.1007/s10854-018-0358-5

By:

Yao, Yao;
Yu, Xuemei

Publication type:

Article

Reliability of fluoride phosphor K2XF6:Mn4+ (K2SiF6:Mn4+, K2(Si,Ge)F6:Mn4+, K2TiF6:Mn4+) for LED application.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 21061, doi. 10.1007/s10854-018-0253-0

By:

Zheng, Fei;
Zou, Jun;
Yang, Bobo;
Liu, Yiming;
Zhou, Heyu;
Shi, Mingming;
Li, Mengtian;
Qian, Xinglu;
Liu, Zizhuan;
Li, Yang

Publication type:

Article

Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 17, p. 15249, doi. 10.1007/s10854-018-9667-y

By:

Surendar, A.;
Samavatian, Vahid;
Maseleno, Andino;
Ibatova, Aygul Z.;
Samavatian, Majid

Publication type:

Article

Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 12, p. 9757, doi. 10.1007/s10854-018-9014-3

By:

Sun, Lei;
Chen, Ming-he;
Wei, Chun-chun;
Zhang, Liang;
Yang, Fan

Publication type:

Article

Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 5025, doi. 10.1007/s10854-017-8464-3

By:

Zhu, Q. S.;
Gao, F.;
Ma, H. C.;
Liu, Z. Q.;
Guo, J. D.;
Zhang, L.

Publication type:

Article

Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3898, doi. 10.1007/s10854-017-8328-x

By:

Brincker, Mads;
Walter, Thomas;
Kristensen, Peter K.;
Popok, Vladimir N.

Publication type:

Article

Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12168, doi. 10.1007/s10854-017-7031-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8278, doi. 10.1007/s10854-017-6541-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Hirao, Kiyoshi;
Iwakiri, Shoji

Publication type:

Article

Enhancement of thermal stability and reliability of green LuAG phosphors by appropriate Y substitution.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 5, p. 4075, doi. 10.1007/s10854-016-6025-9

By:

Yang, Bobo;
Zou, Jun;
Shi, Mingming;
Wang, Fengchao;
Li, Yang;
Li, Wenbo;
Yang, Lei;
Lin, Yujie

Publication type:

Article

Enhancement of thermal stability and reliability of BaSrSiO:Eu phosphors by Ba doping.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13199, doi. 10.1007/s10854-016-5466-5

By:

Zou, Jun;
Yang, Bobo;
Zhu, Siman;
Li, Jierong;
Wang, Fengchao

Publication type:

Article

Properties and long-term behavior of nanoparticle based inkjet printed strain gauges.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10934, doi. 10.1007/s10854-016-5207-9

By:

Kravchuk, Oleksandr;
Reichenberger, Marcus

Publication type:

Article