Works matching DE "THERMAL stresses"

Results: 5000

Chaos Anticontrol and Switching Frequency Impact on MOSFET Junction Temperature and Lifetime.

Published in:

Actuators, 2025, v. 14, n. 5, p. 203, doi. 10.3390/act14050203

By:

Morel, Cristina;
Morel, Jean-Yves

Publication type:

Article

Electrospun Gelatin/Dextran Nanofibers from W/W Emulsions: Improving Probiotic Stability Under Thermal and Gastrointestinal Stress.

Published in:

Foods, 2025, v. 14, n. 10, p. 1725, doi. 10.3390/foods14101725

By:

Wu, Yuehan;
Yan, Ziyou;
Zhang, Shanshan;
Li, Shiyang;
Gong, Ya;
Gao, Zhiming

Publication type:

Article

Integrated Strategies for Air Quality and Thermal Comfort Improvement: The Case Study of the University Campus of Catania.

Published in:

Applied Sciences (2076-3417), 2025, v. 15, n. 10, p. 5661, doi. 10.3390/app15105661

By:

Leonardi, Salvatore;
Detommaso, Maurizio;
Liotta, Nilda Georgina;
Distefano, Natalia;
Nocera, Francesco;
Costanzo, Vincenzo

Publication type:

Article

Thermo-Mechanical Weathering in Malan Loess Under Thermal Shocks.

Published in:

Sensors (14248220), 2025, v. 25, n. 10, p. 3115, doi. 10.3390/s25103115

By:

Gong, Yangqing;
Li, Yanrong;
He, Shengdi

Publication type:

Article

XRD and TGA as methods for evaluation of structural damage of textiles on a macro scale during a household tumble drying process.

Published in:

Tekstil: Journal of Textile & Clothing Technology, 2022, v. 71, n. 4, p. 285

By:

Kurečič, Manja;
Neral, Branko;
Gorgieva, Selestina

Publication type:

Article

Spatial Impact Dynamics of the "Mountain–City–Sea" Pattern on the Urban Thermal Environment and Adaptive Zoning Regulation.

Published in:

Sustainability (2071-1050), 2025, v. 17, n. 10, p. 4459, doi. 10.3390/su17104459

By:

Ouyang, Lingyi;
Guo, Hao;
Song, Xiujin;
Hong, Tingting

Publication type:

Article

Data-driven approach for optimizing the Czochralski process and predictive modeling: A finite element and machine learning analysis.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 7, p. 3077, doi. 10.1007/s00170-025-15726-1

By:

Maurya, Swami Nath;
Dezfoli, Amir Reza Ansari;
Lin, Li-Shang

Publication type:

Article

A review of the design optimization of conformal cooling channels in injection molds.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 7, p. 2653, doi. 10.1007/s00170-025-15234-2

By:

Silva, Hugo Miguel

Publication type:

Article

Determination of Tensile Characteristics and Electrical Resistance Variation of Cables Used for Charging Electric Vehicles.

Published in:

Polymers (20734360), 2025, v. 17, n. 10, p. 1317, doi. 10.3390/polym17101317

By:

Cosau, Elena Roxana;
Goanta, Viorel;
Blanari, Igor;
Alkisswani, Layth;
Samara, Fayez

Publication type:

Article

Multiphysics-Driven Structural Optimization of Flat-Tube Solid Oxide Electrolysis Cells to Enhance Hydrogen Production Efficiency and Thermal Stress Resistance.

Published in:

Energies (19961073), 2025, v. 18, n. 10, p. 2449, doi. 10.3390/en18102449

By:

Liang, Shanshan;
Xu, Jingxiang;
Liao, Yunfeng;
Zhao, Yu;
Huo, Haibo;
Chu, Zhenhua

Publication type:

Article

Probing Phase Transitions and Interfacial Reorganization in TAPC/CBP/BPhen Organic Light-Emitting Diode Stacks by In Situ Ellipsometry.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2261, doi. 10.3390/ma18102261

By:

Aulika, Ilze;
Paulsone, Patricija;
Oras, Sven;
Butikova, Jelena;
Zommere, Margarita Anna;
Laizane, Elina;
Vembris, Aivars

Publication type:

Article

Temperature Stress Induced Phenotypic Plasticity of Spodoptera litura (Lepidoptera: Noctuidae).

Published in:

Journal of the Entomological Research Society, 2025, v. 27, n. 1, p. 89, doi. 10.51963/jers.v27i1.2694

By:

G. S., Sujatha;
J. S., Rupali;
SAGAR, Doddachowdappa;
KUMAR, Hemant;
E., Vidya Madhuri;
SABTHARISHI, Subramanian

Publication type:

Article

Anti-Aging Effects and Mechanisms of Cod Collagen Peptides (CCPs) in Caenorhabditis elegans.

Published in:

Journal of Functional Biomaterials, 2025, v. 16, n. 5, p. 150, doi. 10.3390/jfb16050150

By:

Wei, Jiale;
Zhang, Junjie;
Ding, Nan;
Liu, Yu;
Wu, Yuzhen;
Duan, Rui

Publication type:

Article

Microstructure Evolution and the Influence on Residual Stress in Metal Additive Manufacturing with Analytics †.

Published in:

Crystals (2073-4352), 2025, v. 15, n. 5, p. 435, doi. 10.3390/cryst15050435

By:

Huang, Wei;
Garmestani, Hamid;
Liang, Steven Y.

Publication type:

Article

Optimal Feeding Rates for Growth Performance, Nutrient Retention, and Heat Shock Protein 70 Expression in Fingerling Yellow Perch (Perca flavescens).

Published in:

Animals (2076-2615), 2025, v. 15, n. 10, p. 1465, doi. 10.3390/ani15101465

By:

Zhai, Shao-Wei;
Lu, Xing;
Yang, Song;
Binkowski, Fred P.;
Deng, Dong-Fang

Publication type:

Article

A Method for the Life Assessment of Aero-Engine Turbine Disks Based on a Time-Varying Load Spectrum.

Published in:

Aerospace (MDPI Publishing), 2025, v. 12, n. 5, p. 423, doi. 10.3390/aerospace12050423

By:

Yao, Shunyu;
Niu, Xuming;
Sun, Zhigang;
Song, Yingdong

Publication type:

Article

Thermal Comfort Investigation in Traditional and Modern Urban Canyons in Bandar Abbas, Iran.

Published in:

Pertanika Journal of Social Sciences & Humanities, 2013, v. 21, n. 4, p. 1491

By:

Dalman, Masoud;
Salleh, Elias;
Sapian, Abdul Razak;
Saadatian, Omidreza

Publication type:

Article

Susceptor-based rapid thermal processing for forming ultra-shallow junctions.

Published in:

Solid State Technology, 2000, v. 43, n. 4, p. 50

By:

Atanos, Ashur I.;
Daviet, Jean-Francois;
Parihar, Vijay

Publication type:

Article

The new ice age: the promise and challenges of rapid oocyte warming protocols.

Published in:

Journal of Assisted Reproduction & Genetics, 2024, v. 41, n. 11, p. 2969, doi. 10.1007/s10815-024-03315-2

By:

Bartolacci, Alessandro;
Albertini, David F.

Publication type:

Article

Study by Numerical Simulation of the Effect of Instability-Induced Defects by Illumination, Thermal, and Bias Stresses in Perovskite Solar Cells and Approaches to Reduce Their Degradation Degree: Study by Numerical Simulation of the Effect of Instability-Induced Defects by...: D. Abdallaoui et al

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1759, doi. 10.1007/s11664-024-11658-w

By:

Abdallaoui, Doua;
Meftah, Afak;
Angar, Salsabil;
Abdallaoui, Maroua;
Barkat, Sarra;
Laiadi, Widad;
Meftah, Amjad;
Sengouga, Nouredine

Publication type:

Article

SEM and TEM Image Analysis for Morphology and Phase Transition of CZTS, Sb2Se3 and Perovskite Thin Films under Thermal Stress: SEM and TEM Image Analysis for Morphology...: A. Hajjiah, N. E. Gorji.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 1, p. 523, doi. 10.1007/s11664-024-11585-w

By:

Hajjiah, Ali;
Gorji, Nima E.

Publication type:

Article

Effect of cryogenic thermal cycling on SiC-modified C/C composites.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 237, doi. 10.1080/02670844.2016.1216053

By:

Zhang, M.-Y.;
Li, K.-Z.;
Shi, X.-H.;
Liu, N.-K.

Publication type:

Article

Modified curvature method for residual thermal stress estimation in coatings.

Published in:

Surface Engineering, 2014, v. 30, n. 11, p. 866, doi. 10.1179/1743294414Y.0000000343

By:

Wu, S.;
Guo, Q.;
Zhao, C.

Publication type:

Article

Stirring effects on aluminium coatings electrodeposited in ionic liquids.

Published in:

Surface Engineering, 2014, v. 30, n. 8, p. 562, doi. 10.1179/1743294414Y.0000000278

By:

Choudhary, R. K.;
Kain, V.;
Hubli, R. C.

Publication type:

Article

Effects of hyperthermia induced crystalline aggregation on properties of TiO2 thin films.

Published in:

Surface Engineering, 2014, v. 30, n. 8, p. 600, doi. 10.1179/1743294414Y.0000000286

By:

Dong, G. Z.;
Fan, H. Q.;
Zhu, Y. N.;
Pan, X. B.;
Jiang, X. B.

Publication type:

Article

Laser treatment of silicon at nitrogen ambient: thermal stress analysis.

Published in:

Surface Engineering, 2011, v. 27, n. 6, p. 436, doi. 10.1179/174329409X409495

By:

Yilbas, B S;
Arif, A F M;
Karatas, C

Publication type:

Article

International conference diary.

Published in:: Surface Engineering, 2006, v. 22, n. 3, p. 164, doi. 10.1179/1743293406X128706
Publication type:: Article

Impact of Intermolecular Non‐Covalent Interactions in a CuI8PdII1 Discrete Assembly: Conformers' Geometries and Stimuli‐Sensitive Luminescence Properties.

Published in:

Chemistry - A European Journal, 2022, v. 28, n. 24, p. 1, doi. 10.1002/chem.202104497

By:

Moutier, Florent;
Schiller, Jana;
Lecourt, Constance;
Khalil, Ali Moustafa;
Delmas, Vincent;
Calvez, Guillaume;
Costuas, Karine;
Lescop, Christophe

Publication type:

Article

Low-Temperature N2 Binding to Two-Coordinate L2Fe0 Enables Reductive Trapping of L2FeN2− and NH3 Generation.

Published in:

Angewandte Chemie, 2015, v. 127, n. 2, p. 542, doi. 10.1002/ange.201409454

By:

Ung, Gaël;
Peters, Jonas C.

Publication type:

Article

Polymer Nanoparticle Hydrogels with Autonomous Affinity Switching for the Protection of Proteins from Thermal Stress.

Published in:

Angewandte Chemie, 2014, v. 126, n. 35, p. 9429, doi. 10.1002/ange.201404881

By:

Beierle, John M.;
Yoshimatsu, Keiichi;
Chou, Beverly;
Mathews, Michael A. A.;
Lesel, Benjamin K.;
Shea, Kenneth J.

Publication type:

Article

SpyTag/SpyCatcher Cyclization Confers Resilience to Boiling on a Mesophilic Enzyme.

Published in:

Angewandte Chemie, 2014, v. 126, n. 24, p. 6215, doi. 10.1002/ange.201402519

By:

Schoene, Christopher;
Fierer, Jacob O.;
Bennett, S. Paul;
Howarth, Mark

Publication type:

Article

Temperature dependence of in vitro Rubisco kinetics in species of Flaveria with different photosynthetic mechanisms.

Published in:

Photosynthesis Research, 2015, v. 124, n. 1, p. 67, doi. 10.1007/s11120-015-0092-2

By:

Perdomo, Juan;
Cavanagh, Amanda;
Kubien, David;
Galmés, Jeroni

Publication type:

Article

Isoprene emission protects photosynthesis in sunfleck exposed Grey poplar.

Published in:

Photosynthesis Research, 2010, v. 104, n. 1, p. 5, doi. 10.1007/s11120-010-9528-x

By:

Behnke, Katja;
Loivamäki, Maaria;
Zimmer, Ina;
Rennenberg, Heinz;
Schnitzler, Jörg-Peter;
Louis, Sandrine

Publication type:

Article

Diffuse phase transition in Nb-doped BaTi2O5 thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14424, doi. 10.1007/s10854-019-01812-0

By:

Kuang, Lingtong;
Dai, Ying;
Pei, Xinmei;
Chen, Wen

Publication type:

Article

Property comparison of flexible Cu(InGa)Se2 thin film solar cells on Ti and Ni foils without diffusion barrier.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11754, doi. 10.1007/s10854-019-01539-y

By:

Chen, Jieyi;
Zhai, Zihao;
Li, Yufang;
Lin, Yuxing;
Shen, Honglie

Publication type:

Article

Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10579, doi. 10.1007/s10854-019-01402-0

By:

Zhang, Dan;
Xu, Jing;
Mao, Shujuan;
Zhao, Chao;
Wang, Guilei;
Luo, Xue;
Li, Junfeng;
Li, Yongliang;
Wang, Wenwu;
Chen, Dapeng;
Ye, Tianchun;
Luo, Jun

Publication type:

Article

The energy distribution of trapped charges on the surface of cross-linked polyethylene thermally aged at different temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 9015, doi. 10.1007/s10854-019-01230-2

By:

Li, Huan;
Zhai, Shuang;
Hu, Libin;
Chen, Jie

Publication type:

Article

Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5820, doi. 10.1007/s10854-019-00880-6

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Degradation analysis in mixed (MAPbI3 and MAPbBr3) perovskite solar cells under thermal stress.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1354, doi. 10.1007/s10854-018-0403-4

By:

Ahmad, Zubair;
Shikoh, Ali Sehpar;
Paek, Sanghyun;
Nazeeruddin, M. K.;
Al-Muhtaseb, Shaheen A.;
Touati, Farid;
Bhadra, J.;
Al-Thani, Noora J.

Publication type:

Article

Analytical thermal stress model for a typical flip-chip (FC) package design.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2676, doi. 10.1007/s10854-017-8194-6

By:

Suhir, E.

Publication type:

Article

Preparation and characterization of CdZnTe multilayer films by repeated RF magnetron sputtering.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 5, p. 4467, doi. 10.1007/s10854-016-6079-8

By:

Gao, Xiuying;
Zhu, Xinghua;
Sun, Hui;
Yang, Dingyu;
Wangyang, Peihua;
Zhu, Shifu

Publication type:

Article

Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3585, doi. 10.1007/s10854-016-5960-9

By:

Suhir, E.;
Ghaffarian, R.;
Yi, S.

Publication type:

Article

Reliability physics behind the QFN state of stress.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 2160, doi. 10.1007/s10854-016-5781-x

By:

Suhir, E.;
Ghaffarian, R.;
Yi, S.

Publication type:

Article

Application of a niching genetic algorithm to the optimization of a SiC crystal growth system.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 269, doi. 10.1007/s10854-016-5520-3

By:

Chen, Xuejiang;
Su, Juan;
Li, Yuan

Publication type:

Article

Properties of nano-thick BaSnO/Cu/BaSnO multilayer thin films: the role of substrate temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12604, doi. 10.1007/s10854-016-5392-6

By:

Wu, Muying;
Yu, Shihui;
He, Lin;
Yang, Lei

Publication type:

Article

Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11583, doi. 10.1007/s10854-016-5289-4

By:

Liu, Baolei;
Tian, Yanhong;
Qin, Jingkai;
An, Rong;
Zhang, Rui;
Wang, Chenxi

Publication type:

Article

Electrical properties and temperature sensitivity of Li/Fe-modified NiO-based ceramics as NTC thermistors.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11902, doi. 10.1007/s10854-016-5335-2

By:

Wang, Jiaxi;
Zhang, Hong;
Sun, Xiang;
Liu, Ya;
Li, Zhicheng

Publication type:

Article

Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8325, doi. 10.1007/s10854-016-4841-6

By:

Li, Heng;
Cheng, Gong;
Xu, Gaowei;
Luo, Le

Publication type:

Article

Effect of repeated thermal cycles on thermal stress in copper paste films on alumina substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8440, doi. 10.1007/s10854-016-4858-x

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Hirao, Kiyoshi

Publication type:

Article

Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4399, doi. 10.1007/s10854-016-4310-2

By:

Suhir, E.;
Ghaffarian, R.

Publication type:

Article