Works matching DE "METAL bonding"

Results: 983

A New Methodology to Fabricate Polymer–Metal Parts Through Hybrid Fused Filament Fabrication.

Published in:

Sustainability (2071-1050), 2025, v. 17, n. 10, p. 4254, doi. 10.3390/su17104254

By:

Silva, Sofia F.;
Rosado, Pedro M. S.;
Sampaio, Rui F. V.;
Pragana, João P. M.;
Bragança, Ivo M. F.;
Assunção, Eurico;
Silva, Carlos M. A.

Publication type:

Article

Dissimilar Joining of Aluminum to High-Melting-Point Alloys by Hot Dipping.

Published in:

Coatings (2079-6412), 2025, v. 15, n. 5, p. 541, doi. 10.3390/coatings15050541

By:

Liu, Zhaoxian;
Su, Qingjia;
Wang, Pu;
Zhao, Wenzhen;
Fu, Ao;
He, Huan

Publication type:

Article

Strengthening mechanism and metal/ceramic bonding interface of cold sprayed TiN p /Al5356 deposits.

Published in:

Surface Engineering, 2016, v. 32, n. 9, p. 663, doi. 10.1179/1743294415Y.0000000089

By:

Huang, C. J.;
Li, W. Y.

Publication type:

Article

Process optimisation of cold spray Al coating on AZ91 alloy.

Published in:

Surface Engineering, 2014, v. 30, n. 5, p. 323, doi. 10.1179/1743294413Y.0000000224

By:

Wang, Q.;
Birbilis, N.;
Zhang, M.-X.

Publication type:

Article

Influence of HVOF process parameters on microstructure and bond strength of NiCrAlY coatings.

Published in:

Surface Engineering, 2012, v. 28, n. 4, p. 266, doi. 10.1179/1743294411Y.0000000024

By:

Taheri, M;
Valefi, Z;
Zangeneh-Madar, K

Publication type:

Article

Self‐Assembled Supported Ionic Liquids.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 6, p. 1, doi. 10.1002/chem.202303673

By:

Tavera‐Méndez, Cindy‐Ly;
Bergen, Alexander;
Trzeciak, Simon;
Heinemann, Frank W.;
Graf, Robert;
Zahn, Dirk;
Meyer, Karsten;
Hartmann, Martin;
Wisser, Dorothea

Publication type:

Article

Dynamically Visualized Mechano‐Responsive Supramolecular Self‐Assembly System for Small Molecule Release.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 37, p. 1, doi. 10.1002/chem.202301100

By:

Wu, Shihong;
Qi, Jiajia;
Xia, Xin;
Zhou, Ronghui;
Zhao, Hang

Publication type:

Article

Binding, Release and Functionalization of Intact Pnictogen Tetrahedra Coordinated to Dicopper Complexes.

Published in:

Chemistry - A European Journal, 2022, v. 28, n. 45, p. 1, doi. 10.1002/chem.202201144

By:

Piesch, Martin;
Nicolay, Amélie;
Haimerl, Maria;
Seidl, Michael;
Balázs, Gábor;
Don Tilley, T.;
Scheer, Manfred

Publication type:

Article

Determination of Relative Stabilities of Metal‐Peptide Bonds in the Gas Phase.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 66, p. 16401, doi. 10.1002/chem.202102385

By:

Cziferszky, Monika;
Truong, Dianna;
Hartinger, Christian G.;
Gust, Ronald

Publication type:

Article

Mapping C−H⋅⋅⋅M Interactions in Confined Spaces: (α‐ICyDMe)Au, Ag, Cu Complexes Reveal "Contra‐electrostatic H Bonds" Masquerading as Anagostic Interactions.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 31, p. 8127, doi. 10.1002/chem.202100263

By:

Passos Gomes, Gabriel;
Xu, Guangcan;
Zhu, Xiaolei;
Chamoreau, Lise‐Marie;
Zhang, Yongmin;
Bistri‐Aslanoff, Olivia;
Roland, Sylvain;
Alabugin, Igor V.;
Sollogoub, Matthieu

Publication type:

Article

Chemical Bonding in Homoleptic Carbonyl Cations [M{Fe(CO)5}2]+ (M=Cu, Ag, Au).

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 23, p. 6936, doi. 10.1002/chem.202004041

By:

Pan, Sudip;
Gorantla, Sai Manoj N. V. T.;
Parasar, Devaborniny;
Dias, H. V. Rasika;
Frenking, Gernot

Publication type:

Article

HfMnSb2: A Metal-Ordered NiAs-type Pnictide with a Conical Spin Order.

Published in:

Angewandte Chemie, 2016, v. 128, n. 34, p. 10031, doi. 10.1002/ange.201602066

By:

Murakami, Taito;
Yamamoto, Takafumi;
Tassel, Cédric;
Takatsu, Hiroshi;
Ritter, Clemens;
Ajiro, Yoshitami;
Kageyama, Hiroshi

Publication type:

Article

Alkali Metal Carbenoids: A Case of Higher Stability of the Heavier Congeners.

Published in:

Angewandte Chemie, 2016, v. 128, n. 27, p. 7843, doi. 10.1002/ange.201601356

By:

Molitor, Sebastian;
Gessner, Viktoria H.

Publication type:

Article

Der elektronische Grundzustand von [Fe(CO)3(NO)]−: eine spektroskopische und theoretische Studie.

Published in:

Angewandte Chemie, 2014, v. 126, n. 7, p. 1820, doi. 10.1002/ange.201309767

By:

Klein, Johannes E. M. N.;
Miehlich, Burkhard;
Holzwarth, Michael S.;
Bauer, Matthias;
Milek, Magdalena;
Khusniyarov, Marat M.;
Knizia, Gerald;
Werner, Hans ‐ Joachim;
Plietker, Bernd

Publication type:

Article

Synthesis of Triangular Tripalladium Cations as Noble-Metal Analogues of the Cyclopropenyl Cation.

Published in:

Angewandte Chemie, 2014, v. 126, n. 7, p. 2018, doi. 10.1002/ange.201310204

By:

Blanchard, Sébastien;
Fensterbank, Louis;
Gontard, Geoffrey;
Lacôte, Emmanuel;
Maestri, Giovanni;
Malacria, Max

Publication type:

Article

CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11151, doi. 10.1007/s10854-019-01458-y

By:

Endo, Takeshi;
Sugiura, Kazuhiko;
Tsuruta, Kazuhiro;
Iwashige, Tomohito;
Chen, Chuantong;
Nagao, Shijo;
Suganuma, Katsuaki;
Sakuma, Yuichi;
Kurosaka, Seigo;
Oda, Yukinori

Publication type:

Article

A comparative study on direct Cu-Cu bonding methodologies for copper pillar bumped flip-chips.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9347, doi. 10.1007/s10854-018-8965-8

By:

Ma, Y.;
Roshanghias, A.;
Binder, A.

Publication type:

Article

Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3800, doi. 10.1007/s10854-017-8315-2

By:

Roh, Myong-Hoon;
Nishikawa, Hiroshi;
Tsutsumi, Seiichiro;
Nishiwaki, Naruhiko;
Ito, Keiichi;
Ishikawa, Koji;
Katsuya, Akihiro;
Kamada, Nobuo;
Saito, Mutsuo

Publication type:

Article

Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13750, doi. 10.1007/s10854-017-7219-5

By:

Singh, Gurbinder;
Haseeb, A.

Publication type:

Article

Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 7, p. 5554, doi. 10.1007/s10854-016-6220-8

By:

Liu, Xiangdong;
Nishikawa, Hiroshi

Publication type:

Article

Transient liquid phase bonding of Sn-Bi solder with added Cu particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4232, doi. 10.1007/s10854-016-4287-x

By:

Mokhtari, Omid;
Nishikawa, Hiroshi

Publication type:

Article

Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4816, doi. 10.1007/s10854-016-4363-2

By:

Suhir, E.

Publication type:

Article

Low temperature chip on film bonding technology for 20 µm pitch applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7

By:

Kim, Sun-Chul;
Kim, Young-Ho

Publication type:

Article

A solid-state bonding technique of large copper wires for high power devices operating at high temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3521, doi. 10.1007/s10854-015-2864-z

By:

Chen, Yi-Ling;
Wu, Yuan-Yun;
Lee, Chin

Publication type:

Article

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2803, doi. 10.1007/s10854-013-1174-6

By:

Gan, C.;
Hashim, U.

Publication type:

Article

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1

By:

Yoon, Jeong-Won;
Lee, Jong-Gun;
Lee, Jong-Bum;
Noh, Bo-In;
Jung, Seung-Boo

Publication type:

Article

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8

By:

Pequegnat, A.;
Hang, C. J.;
Mayer, M.;
Zhou, Y.;
Moon, J. T.;
Persic, J.

Publication type:

Article

Effects of bonding frequency on Au wedge wire bondability.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7

By:

Yu Hin Chan;
Jang-Kyo Kim;
Deming Liu;
Liu, Peter C. K.;
Yiu Ming Cheung;
Ming Wai Ng

Publication type:

Article

Interface microstructure and bond shear strength of aluminum alloy AA8090/AA7072 roll clad sheets.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 24, p. 1793, doi. 10.1023/B:JMSL.0000005423.90152.a6

By:

Mallesham, P.;
Gokhale, A. A.;
Dutta, A.;
Murti, Vsr

Publication type:

Article

Effect of nitridation on the properties of Na–Zn–P–O glasses.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 24, p. 1779, doi. 10.1023/B:JMSL.0000005419.33078.39

By:

Shih, P. Y.

Publication type:

Article

Joining reaction-bonded silicon carbide using Inconel 600 superalloy.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 10, p. 759, doi. 10.1023/A:1023768414427

By:

Junqin Li;
Guangming Zhu;
Ping Xiao

Publication type:

Article

Stability Analysis of an Intense Weathered Rock Slope and Optimum Reinforcement Design.

Published in:

Geotechnical & Geological Engineering, 2018, v. 36, n. 2, p. 1049, doi. 10.1007/s10706-017-0373-y

By:

Qi, Kuan;
Tan, Zhuoying

Publication type:

Article

Crosslinking polydopamine/cellulose nanofibril composite aerogels by metal coordination bonds for significantly improved thermal stability, flame resistance, and thermal insulation properties.

Published in:

Cellulose, 2021, v. 28, n. 17, p. 10987, doi. 10.1007/s10570-021-04233-7

By:

Han, Fuyi;
Huang, Hong;
Wang, Yan;
Liu, Lifang

Publication type:

Article

Modeling the moisture and temperature dependent material behavior of adhesive bonds.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2015, v. 15, n. 1, p. 295, doi. 10.1002/pamm.201510138

By:

Goldschmidt, Florian;
Diebels, Stefan

Publication type:

Article

Effect of conventional and Gemini surfactants on the micellar-enhanced ultrafiltration process performance for the separation of Au(III) from aqueous solutions: A dissipative particle dynamics study.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2023, v. 191, p. 578, doi. 10.1016/j.cherd.2023.01.034

By:

Abdi, Sara;
Nasiri, Masoud;
Mai, Zhaohuan

Publication type:

Article

Electrocatalytic and antifouling properties of CeO-glassy carbon electrodes.

Published in:

Journal of Solid State Electrochemistry, 2016, v. 20, n. 11, p. 3125, doi. 10.1007/s10008-016-3413-2

By:

Palacios-Santander, J.M.;
Terzi, F.;
Zanardi, C.;
Pigani, L.;
Cubillana-Aguilera, L.M.;
Naranjo-Rodriguez, I.;
Seeber, Renato

Publication type:

Article

On the evaluation of a critical distance approach for failure load prediction of adhesively bonded dissimilar materials.

Published in:

Continuum Mechanics & Thermodynamics, 2020, v. 32, n. 6, p. 1647, doi. 10.1007/s00161-020-00871-7

By:

Cruz-G, C. E.;
Akhavan-Safar, A.;
da Silva, L. F. M;
Ayatollahi, M. R.

Publication type:

Article

Characterization of two proline dipeptidases (prolidases) from the hyperthermophilic archaeon Pyrococcus horikoshii.

Published in:

Applied Microbiology & Biotechnology, 2010, v. 86, n. 1, p. 177, doi. 10.1007/s00253-009-2235-x

By:

Theriot, Casey M.;
Tove, Sherry R.;
Grunden, Amy M.

Publication type:

Article

Acoustic-emission inspection of flaws during laser bonding of articles made of VT20 titanium alloy.

Published in:

Russian Journal of Nondestructive Testing, 2017, v. 53, n. 6, p. 430, doi. 10.1134/S1061830917060067

By:

Fomin, V.;
Serieznov, A.;
Stepanova, L.;
Orishich, A.;
Kabanov, S.;
Kanifadin, K.;
Malikov, A.

Publication type:

Article

CdSb, ZnSb, and Cd xZn1 − xSb low-symmetry crystals: Chemical bonding and technological aspects.

Published in:

Inorganic Materials, 2010, v. 46, n. 6, p. 574, doi. 10.1134/S0020168510060026

By:

Ashcheulov, A. A.;
Gutsul, I. V.;
Manyk, O. N.;
Manyk, T. O.;
Marenkin, S. F.

Publication type:

Article

Evaluation of charge displacement and the radii of Wigner-Seitz spheres for the components of A-Te (A = Ge, Sn, Pb) melts.

Published in:

Inorganic Materials, 2008, v. 44, n. 6, p. 572, doi. 10.1134/S0020168508060058

By:

Dolgopolova, E.

Publication type:

Article

ANALYSIS OF THE INTERFACE BETWEEN THE MATRIX AND THE REINFORCEMENT PHASE IN CERAMIC-REINFORCED MMCS.

Published in:

International Journal of Modern Manufacturing Technologies (IJMMT), 2021, v. 13, n. 1, p. 193

By:

Spasova, Daniela

Publication type:

Article

Numerical Analysis of Laser-assisted Ti to Polyimide Welding Using a Statistical Approach.

Published in:

International Journal of Laser Science: Fundamental Theory & Analytical Methods, 2018, v. 1, n. 2, p. 185

By:

SHAIKH MOHAMMAD MEIABADI, M. S.;
KAZAROONI, A.;
MORADI, M.

Publication type:

Article

Crystallographic and structural characterization of heterometallic platinum clusters Part VIII. Heteronona- and heterodecanuclear clusters.

Published in:

Open Chemistry, 2015, v. 13, n. 1, p. -1, doi. 10.1515/chem-2015-0053

By:

Melník, Milan;
Mikuš, Peter;
Holloway, Clive E.

Publication type:

Article

P-62: Silicone Adhesive Providing Protection, Waterproofing and Reworkability for Precision Assembly of Electronic Devices.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 1368, doi. 10.1002/sdtp.10128

By:

Schneider, Ryan F.;
Gordon, Glenn V.;
Kim, Sung Hyun;
Lee, Gwang Su;
Tonge, James S.

Publication type:

Article

One‐Step Synthesis of Chitosan Hydrogel as Electrochemical Chemosensor for Hydrogen Sulfide Detection in Pregnancy‐Induced Hypertension Syndrome Serum Sample.

Published in:

ChemistryOpen, 2024, v. 13, n. 10, p. 1, doi. 10.1002/open.202400107

By:

Fang, Lishan;
Li, Jinqiu;
Lin, Wei;
Zeng, Lili;
Yu, Liumin;
Chen, Zhanfei;
Shen, Jianlin;
Chen, Yu;
Chen, Zhonghui;
Lin, Zhenyu

Publication type:

Article

Superior bonding of Al/Mg interface by introducing nanocrystals via high-entropy alloy coating and ultrasonic vibration.

Published in:

2025

By:

Xu, Yuancai;
Jiang, Wenming;
Li, Qingqing;
Yu, Linghui;
Yu, Xiaopeng;
Peng, Ziwei;
Fan, Zitian

Publication type:

Report

New Insights into the Depressive Mechanism of Sodium Silicate on Bastnaesite, Parisite, and Fluorite: Experimental and DFT Study.

Published in:

Minerals (2075-163X), 2024, v. 14, n. 9, p. 870, doi. 10.3390/min14090870

By:

Wang, Jieliang;
Lu, Wenda;
Cao, Zhao;
Wu, Xu;
Wang, Peng;
Wang, Xiaoping;
Liu, Wenli

Publication type:

Article

Richardsite, Zn2CuGaS4, A New Gallium-Essential Member of the Stannite Group from the Gem Mines near Merelani, Tanzania.

Published in:

Minerals (2075-163X), 2020, v. 10, n. 5, p. 467, doi. 10.3390/min10050467

By:

Bindi, Luca;
Jaszczak, John A.

Publication type:

Article

A facile route to dual-crosslinking polymeric hydrogels with enhanced mechanical property.

Published in:

Journal of Polymer Engineering, 2021, v. 41, n. 8, p. 690, doi. 10.1515/polyeng-2021-0090

By:

Xue, Shishan;
Ye, Zhiyong;
Tang, Qiao;
Wang, Yu

Publication type:

Article