Works matching DE "COPPER surfaces"

Results: 1062

Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3870, doi. 10.1007/s11664-024-11020-0

By:

Wang, Wengan;
Zou, Guisheng;
Deng, Zhongyang;
Jia, Qiang;
Feng, Bin;
Liu, Lei

Publication type:

Article

Investigation of electrodeposited copper layer with island twinning structure on Zr substrate.

Published in:

Surface Engineering, 2023, v. 39, n. 5, p. 600, doi. 10.1080/02670844.2023.2247861

By:

Karimi, Meysam;
Hadipour, Ali;
Araghchi, Masoud;
Razazzadeh, Amir

Publication type:

Article

Formation of a nanoporous layer on the surface of silver and copper by dealloying of thermal diffusion coatings Me5Zn8 (Me=Ag, Cu) in a deep eutectic solvent.

Published in:

Surface Engineering, 2023, v. 39, n. 2, p. 198, doi. 10.1080/02670844.2023.2203440

By:

Kondina, A. I.;
Rozhentsev, D. A.;
Shurov, N. I.;
Tkachev, N. K.

Publication type:

Article

Study of the wettability of laser-built 3Cr13 stainless steel.

Published in:

Surface Engineering, 2021, v. 37, n. 12, p. 1484, doi. 10.1080/02670844.2020.1840716

By:

Zheng, Bo-yuan;
Kang, Jia-jie;
Di, Yue-lan;
Wang, Hai-dou;
Zhu, Li-na;
Lan, Ling

Publication type:

Article

Novel and facile method for fabrication of robust superhydrophobic film on copper surface and its chemical, mechanical, and corrosion performance.

Published in:

Surface Engineering, 2021, v. 37, n. 10, p. 1255, doi. 10.1080/02670844.2021.1951502

By:

Mohamed, M. E.;
Mahgoub, F. M.;
Ragheb, D. M.;
Abdel-Gaber, A.M.

Publication type:

Article

Fabrication of self-cleaning superhydrophobic silicone rubber insulator through laser texturing.

Published in:

Surface Engineering, 2021, v. 37, n. 3, p. 308, doi. 10.1080/02670844.2020.1780673

By:

Patil, Deepak;
Aravindan, Sivanandam;
Sarathi, Ramanujam;
Rao, Paruchuri Venkateswara

Publication type:

Article

Physical and electrical properties' evaluation of SnS:Cu thin films.

Published in:

Surface Engineering, 2021, v. 37, n. 2, p. 137, doi. 10.1080/02670844.2020.1754623

By:

Sebastian, S.;
Kulandaisamy, I.;
Valanarasu, S.;
Shkir, Mohd;
Ganesh, V.;
Yahia, I. S.;
Kim, Hyun-Seok;
Vikraman, Dhanasekaran

Publication type:

Article

Microstructural investigations on bonding mechanisms of cold-sprayed copper with SS316L steel.

Published in:

Surface Engineering, 2020, v. 36, n. 10, p. 1067, doi. 10.1080/02670844.2019.1698163

By:

Singh, Surinder;
Singh, Harpreet;
Buddu, Ramesh Kumar

Publication type:

Article

Performance investigation of a new carbon–silver microspheres/epoxy resin superhydrophobic coating.

Published in:

Surface Engineering, 2020, v. 36, n. 6, p. 565, doi. 10.1080/02670844.2018.1541297

By:

Zhao, Meiyun;
Tian, Sen;
Zhao, Xinze;
Wu, Yang;
Tan, Mingyi;
Xing, Jing Tang

Publication type:

Article

Preparation of a superhydrophobic aluminium alloy surface by UV laser.

Published in:

Surface Engineering, 2020, v. 36, n. 6, p. 558, doi. 10.1080/02670844.2017.1395982

By:

Huang, Chao;
Ye, Xia;
Yang, Xiaohong;
Yao, Aifei;
Fan, Zhenmin

Publication type:

Article

An investigation of the effect of pulse electrochemical deposition parameters on morphology, hardness and corrosion behaviour in the marine atmosphere.

Published in:

Surface Engineering, 2019, v. 35, n. 12, p. 1021, doi. 10.1080/02670844.2019.1609289

By:

Prasannakumar, R. S.;
Bhakyaraj, K.;
Chukwuike, V. I.;
Mohan, S.;
Barik, R. C.

Publication type:

Article

Corrosion and fouling behaviours of copper-based superhydrophobic coating.

Published in:

Surface Engineering, 2019, v. 35, n. 6, p. 542, doi. 10.1080/02670844.2018.1433774

By:

Lv, Yan;
Liu, Mingyan

Publication type:

Article

Ti and nitride surface modification of copper by pack cementation.

Published in:

Surface Engineering, 2018, v. 34, n. 3, p. 243, doi. 10.1080/02670844.2016.1274841

By:

Stathokostopoulos, D.;
Chaliampalias, D.;
Pliatsikas, N.;
Kassavetis, S.;
Pavlidou, E.;
Patsalas, P.;
Logothetidis, S.;
Chrissafis, K.;
Vourlias, G.

Publication type:

Article

Cold spray deposition to prevent fouling of polymer surfaces.

Published in:

Surface Engineering, 2018, v. 34, n. 3, p. 193, doi. 10.1080/02670844.2016.1229833

By:

Stenson, C.;
McDonnell, K. A.;
Yin, S.;
Aldwell, B.;
Meyer, M.;
Dowling, D. P.;
Lupoi, R.

Publication type:

Article

Effect of SiC concentration in electrolyte on Ni-SiC composite coating properties.

Published in:

Surface Engineering, 2013, v. 29, n. 3, p. 177, doi. 10.1179/1743294413Y.0000000113

By:

Aghaie, E;
Najafi, A;
Maleki-Ghaleh, H;
Mohebi, H

Publication type:

Article

N‐Heterocyclic Carbenes Reduce and Functionalize Copper Oxide Surfaces in One Pot.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 50, p. 11431, doi. 10.1002/chem.202002308

By:

Veinot, Alex J.;
Al‐Rashed, Abrar;
Padmos, J. Daniel;
Singh, Ishwar;
Lee, Dianne S.;
Narouz, Mina R.;
Lummis, Paul A.;
Baddeley, Christopher J.;
Crudden, Cathleen M.;
Horton, J. Hugh

Publication type:

Article

A Small Molecule Walks Along a Surface Between Porphyrin Fences That Are Assembled In Situ.

Published in:

Angewandte Chemie, 2015, v. 127, n. 24, p. 7207, doi. 10.1002/ange.201502153

By:

Haq, Sam;
Wit, Bareld;
Sang, Hongqian;
Floris, Andrea;
Wang, Yu;
Wang, Jianbo;
Pérez-García, Lluïsa;
Kantorovitch, Lev;
Amabilino, David B.;
Raval, Rasmita

Publication type:

Article

Dehydrogenative Homocoupling of Terminal Alkenes on Copper Surfaces: A Route to Dienes.

Published in:

Angewandte Chemie, 2015, v. 127, n. 15, p. 4632, doi. 10.1002/ange.201412307

By:

Qiang Sun;
Liangliang Cai;
Yuanqi Ding;
Lei Xie;
Chi Zhang;
Qinggang Tan;
Wei Xu

Publication type:

Article

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16226, doi. 10.1007/s10854-019-01991-w

By:

Chen, Yuanming;
Gao, Yali;
Jin, Xiaofeng;
Zhou, Xuan;
Wang, Shouxu;
He, Wei;
Hong, Yan;
Zhou, Guoyun;
Zhang, Weihua;
Sun, Rui;
Huang, Yunzhong;
Tang, Yao

Publication type:

Article

Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15766, doi. 10.1007/s10854-019-01962-1

By:

Yan, Huilong;
Ji, Yulong;
Yan, Jinliang

Publication type:

Article

Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12860, doi. 10.1007/s10854-019-01601-9

By:

Du, Cheng-Jie;
Li, Xin;
Mei, Yun-Hui;
Lu, Guo-Quan

Publication type:

Article

Rapid low temperature sintering in air of copper submicron particles with synergistic surface-activation and anti-oxidative protection.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12669, doi. 10.1007/s10854-019-01630-4

By:

Qi, Tianke;
Wang, Xiaocun;
Yang, Jianfu;
Xiao, Fei

Publication type:

Article

Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 864, doi. 10.1007/s10854-013-1658-4

By:

Bhat, Kiran;
Prabhu, K.;
Satyanarayan

Publication type:

Article

Wettable copper hydroxide cotton fabric for oil-water separation made by surface micro-dissolution.

Published in:

Cellulose, 2021, v. 28, n. 7, p. 4345, doi. 10.1007/s10570-021-03736-7

By:

Liu, Yiping;
Yang, Jinlong;
Sun, Yiwei;
Jia, Zhihong;
Zhang, Xiaolei;
Wu, Dayang;
Lu, Ming

Publication type:

Article

In vitro assessment of antibacterial and antiviral activity of three copper products after 200 rounds of simulated use.

Published in:

BioMetals, 2024, v. 37, n. 4, p. 849, doi. 10.1007/s10534-023-00572-z

By:

Charles, Marthe K.;
Williams, Teresa C.;
Nakhaie, Davood;
Woznow, Tracey;
Velapatino, Billie;
Lorenzo-Leal, Ana C.;
Bach, Horacio;
Bryce, Elizabeth A.;
Asselin, Edouard

Publication type:

Article

Spatial and Seasonal Structure of Bacterial Communities Within Alpine Vineyards: Trentino as a Case Study.

Published in:

Microbial Ecology, 2023, v. 85, n. 1, p. 108, doi. 10.1007/s00248-021-01948-9

By:

Guzzon, Raffaele;
Bertoldi, Daniela;
Roman, Tomas;
Zanzotti, Roberto;
Franciosi, Elena

Publication type:

Article

Smart paradigm to predict copper surface area of Cu/ZnO/Al2O3 catalyst based on synthesis parameters.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2023, v. 191, p. 604, doi. 10.1016/j.cherd.2023.01.031

By:

Saffary, Soheil;
Rafiee, Mansoureh;
Varnoosfaderani, Mohammadreza Saeidi;
Günay, M. Erdem;
Zendehboudi, Sohrab

Publication type:

Article

Laser method of microscopic sensor synthesis for liquid and gas analysis using glucose and H2S as an example.

Published in:

Journal of Solid State Electrochemistry, 2019, v. 23, n. 11, p. 3173, doi. 10.1007/s10008-019-04389-0

By:

Smikhovskaia, A. V.;
Novomlinsky, M. O.;
Fogel, A. A.;
Kochemirovskaia, S. V.;
Lebedev, D. V.;
Kochemirovsky, V. A.

Publication type:

Article

Grain boundary passivation studied by in situ scanning tunneling microscopy on microcrystalline copper.

Published in:

Journal of Solid State Electrochemistry, 2015, v. 19, n. 12, p. 3501, doi. 10.1007/s10008-015-2787-x

By:

Chen, Hu;
Maurice, Vincent;
Klein, Lorena;
Lapeire, Linsey;
Verbeken, Kim;
Terryn, Herman;
Marcus, Philippe

Publication type:

Article

Survival of bacteria on metallic copper surfaces in a hospital trial.

Published in:

Applied Microbiology & Biotechnology, 2010, v. 87, n. 5, p. 1875, doi. 10.1007/s00253-010-2640-1

By:

Mikolay, André;
Huggett, Susanne;
Tikana, Ladji;
Grass, Gregor;
Braun, Jörg;
Nies, Dietrich H.

Publication type:

Article

Microstructure, EBSD, and Corrosion Resistance of Nip Modified H63 Copper Alloy Prepared by FSSP.

Published in:

Strength of Materials, 2023, v. 55, n. 2, p. 404, doi. 10.1007/s11223-023-00534-3

By:

Song, W. W.;
Zuo, D. W.;
Shi, Y. G.;
Wang, H. F.;
Pu, J. F.

Publication type:

Article

Application of Heterogeneous Catalysis Models in Solving Problems of the Jet Flow around Copper Models for Experimental Conditions on Induction HF Plasmatron.

Published in:

Fluid Dynamics, 2024, v. 59, n. 5, p. 1540, doi. 10.1134/S0015462824604121

By:

Kroupnov, A. A.;
Pogosbekian, M. Ju.;
Sakharov, V. I.

Publication type:

Article

Experimental Studies on Heat Transfer between Dissociated Air Flow and a Flat Plate at an Angle of Attack in an HF-Plasmatron.

Published in:

Fluid Dynamics, 2022, v. 57, p. S117, doi. 10.1134/S0015462822601206

By:

Gordeev, A. N.;
Chaplygin, A. V.

Publication type:

Article

Numerical simulation of thermally and chemically nonequilibrium flows and heat transfer in underexpanded induction plasmatron jets.

Published in:

Fluid Dynamics, 2007, v. 42, n. 6, p. 1007, doi. 10.1134/S0015462807060166

By:

Sakharov, V.

Publication type:

Article

Study and Characterization of Copper and Titanium Oxides Nanostructures for Some Molecular and Biological Applications.

Published in:

Trends in Sciences, 2024, v. 21, n. 4, p. 1, doi. 10.48048/tis.2024.7402

By:

Alhamd, Omar Abdulazeez;
Ali, Ghazwan Ghazi;
Hasan Aljuboori, Mutaz Salih

Publication type:

Article

Hydrothermal Synthesis of Cu2O Films on the Surface of Metallic Copper in a NaOH Solution.

Published in:

Inorganic Materials, 2019, v. 55, n. 6, p. 582, doi. 10.1134/S0020168519060177

By:

Zimbovskii, D. S.;
Churagulov, B. R.;
Baranov, A. N.

Publication type:

Article

Molecular Dynamics Study on the Lubrication Mechanism of the Phytic Acid/Copper Interface Under Loading Condition.

Published in:

Colloids & Interfaces, 2025, v. 9, n. 2, p. 18, doi. 10.3390/colloids9020018

By:

Guan, Min;
Xie, Dong;
Wang, Xiaoting;
Jing, Fengjuan;
Wen, Feng;
Leng, Yongxiang

Publication type:

Article

CO2 ELECTROREDUCTION IN AQUEOUS AND ACETONITRILE SOLUTIONS ON POROUS CATHODE FABRICATED BY ANODE DEZINCIFICATION OF CuZn.

Published in:

Issues of Chemistry & Chemical Technology / Voprosy Khimii & Khimicheskoi Tekhnologii, 2023, n. 5, p. 55, doi. 10.32434/0321-4095-2023-150-5-55-63

By:

Kuntyi, Orest;
Zoutlya, Galyna;
Shepida, Mariana;
Mnykh, Roman;
Mazur, Artur;
Korniy, Sergiy;
Babizhetskyy, Volodymyr;
Zelinskiy, Anatoliy

Publication type:

Article

碱激发-碳养护对铜尾矿固化砖的作用机理研究.

Published in:

Bulletin of the Chinese Ceramic Society, 2023, v. 42, n. 1, p. 188

By:

徐伟;
鲁亚;
刘松柏;
肖民;
陈忠发;
魏琦;
严峻

Publication type:

Article

Study on preparation and durability of surface microstructure of copper alloy.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2022, v. 17, n. 9, p. 193, doi. 10.1049/mna2.12123

By:

Xing, Lei;
Zhang, Qiaoxin;
Cai, Xu;
Yu, Jingui;
Li, Yufa;
Gong, Xuan

Publication type:

Article

曝气气氛对镀铜电化学行为及填盲孔性能的影响.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 19, p. 63, doi. 10.19289/j.1004-227x.2023.19.010

By:

张路路;
宗高亮;
许昕莹;
肖宁

Publication type:

Article

Q235 钢表面电火花沉积铁基非晶改性层及其性能.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 3, p. 55, doi. 10.19289/j.1004-227x.2023.03.010

By:

杨岚淞;
羊思洁;
罗松;
郑丽

Publication type:

Article

巯基乙酸对电解铜箔抗氧化性的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 23, p. 1668, doi. 10.19289/j.1004-227x.2022.23.005

By:

华天宇;
王世颖;
王文昌;
明小强;
王朋举

Publication type:

Article

添加剂对 ABS 化学镀铜的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1510, doi. 10.19289/j.1004-227x.2022.21.004

By:

程熠;
宋晅;
朱皓;
赵文霞;
回凯宏;
李鑫巍;
刘欣;
陈怀军

Publication type:

Article

Fabrication of a superhydrophobic surface by electroplating copper nanowire array on tungsten--copper alloy for enhancing condensation heat transfer.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 19, p. 1371, doi. 10.19289/j.1004-227x.2022.19.006

By:

GAO Zhiqiang;
WU Feifei;
ZHONG Chen;
HONG Peng;
TAO Liangyi

Publication type:

Article

Study on oil-oil separation with super-slippery copper mesh based on liquid gating technology.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 15, p. 1082, doi. 10.19289/j.1004-227x.2022.15.007

By:

TIAN Yali;
TAO Xingyue;
TU Mengmeng

Publication type:

Article

Experimental investigation of spray cooling performance in non‐boiling zone on rough superhydrophilic/hydrophobic surfaces.

Published in:

International Journal of Energy Research, 2022, v. 46, n. 14, p. 19566, doi. 10.1002/er.8528

By:

Huang, Jiale;
Zhou, Qiang;
Yuan, Lingling;
Xue, Zhiliang;
Jin, Tao

Publication type:

Article

Exploring the catalytic activity of metal‐fullerene C58M (M = Mn, Fe, Co, Ni, and Cu) toward oxygen reduction and CO oxidation by density functional theory.

Published in:

International Journal of Energy Research, 2019, v. 43, n. 13, p. 7375, doi. 10.1002/er.4768

By:

Chen, Xin;
Ge, Fan;
Chang, Junbo;
Lai, Nanjun

Publication type:

Article

Self‐Aligned Single‐Crystalline Hexagonal Boron Nitride Arrays: Toward Higher Integrated Electronic Devices.

Published in:

Advanced Electronic Materials, 2015, v. 1, n. 11, p. 1, doi. 10.1002/aelm.201500223

By:

Tan, Lifang;
Han, Jiangli;
Mendes, Rafael G.;
Rümmeli, Mark H.;
Liu, Jinxin;
Wu, Qiong;
Leng, Xuanye;
Zhang, Tao;
Zeng, Mengqi;
Fu, Lei

Publication type:

Article

Effects of moisture content, temperature and pollutant mixture on atmospheric corrosion of copper and silver and implications for the environmental design of data centers (RP-1755).

Published in:

Science & Technology for the Built Environment, 2020, v. 26, n. 4, p. 567, doi. 10.1080/23744731.2019.1701331

By:

Zhang, Rui;
Zhang, Jianshun;
Schmidt, Roger;
Gilbert, Jeremy;
Guo, Beverly

Publication type:

Article