Works matching DE "CHEMICAL-mechanical planarization"
Results: 16
Preparation of non-spherical silica composite abrasives by lanthanum ion-induced effect and its chemical-mechanical polishing properties on sapphire substrates.
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- Journal of Materials Science, 2018, v. 53, n. 15, p. 10732, doi. 10.1007/s10853-018-2357-6
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- Article
Influence of surface roughness on Ge nanowire growth by MBE.
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- Physica Status Solidi - Rapid Research Letters, 2013, v. 7, n. 10, p. 831, doi. 10.1002/pssr.201307248
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- Article
Wafer size effect on material removal rate in copper CMP process.
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- Journal of Mechanical Science & Technology, 2017, v. 31, n. 6, p. 2961, doi. 10.1007/s12206-017-0539-9
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- Article
Design optimization of diamond disk pad conditioners.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 66, n. 9-12, p. 2041, doi. 10.1007/s00170-012-4480-x
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- Article
Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements.
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- Micromachines, 2018, v. 9, n. 11, p. 542, doi. 10.3390/mi9110542
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Motor Power Signal Analysis for End-Point Detection of Chemical Mechanical Planarization.
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- Micromachines, 2017, v. 8, n. 6, p. 177, doi. 10.3390/mi8060177
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- Article
Planarization and Processing of Metamorphic Buffer Layers Grown by Hydride Vapor-Phase Epitaxy.
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- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 873, doi. 10.1007/s11664-013-2839-x
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- Article
In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 979, doi. 10.1007/s11664-013-2486-2
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- Article
Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization.
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- Journal of Electronic Materials, 2013, v. 42, n. 1, p. 83, doi. 10.1007/s11664-012-2250-z
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- Article
Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process.
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- Journal of Electronic Materials, 2013, v. 42, n. 1, p. 97, doi. 10.1007/s11664-012-2334-9
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- Article
Effect of thermocycling in a hard denture liner and acrylic resin after different chemical and mechanical polishing.
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- RGO: Revista Gaúcha de Odontologia, 2015, v. 63, n. 4, p. 397, doi. 10.1590/1981-863720150003000043021
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Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces.
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- Lubricants (2075-4442), 2017, v. 5, n. 2, p. 15, doi. 10.3390/lubricants5020015
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Iridium-Catalyzed Reductive Carbon-Carbon Bond Cleavage Reaction on a Curved Pyridylcorannulene Skeleton.
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- Angewandte Chemie International Edition, 2015, v. 54, n. 18, p. 5351, doi. 10.1002/anie.201500819
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- Article
Synthesis of Bridged Oxafenestranes from Pleuromutilin.
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- Angewandte Chemie International Edition, 2014, v. 53, n. 37, p. 9880, doi. 10.1002/anie.201404765
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- Article
Preparation and Dispersion of Nanosize Ceria in High Electrolyte Slurry by Ball-Milling.
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- Integrated Ferroelectrics, 2015, v. 161, n. 1, p. 36, doi. 10.1080/10584587.2015.1035594
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- Article
KDP Aqueous Solution-in-Oil Microemulsion for Ultra-Precision Chemical-Mechanical Polishing of KDP Crystal.
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- Materials (1996-1944), 2017, v. 10, n. 3, p. 271, doi. 10.3390/ma10030271
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- Article