Works matching DE "ELECTRONIC packaging"

Results: 824

Mechanically Strong and Thermally Conductive Zr–BN Hybrid Filler‐Embedded Carbon Fiber‐Reinforced Epoxy Composite for Multifunctional Applications.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 12, p. 1, doi. 10.1002/adem.202403007

By:

Kuila, Chinmoy;
Maji, Animesh;
Phadikar, Ujjwal;
Mallisetty, Phani Kumar;
Murmu, Naresh Chandra;
Kuila, Tapas

Publication type:

Article

Effect of Ti Particles on Microstructural Evolution and Mechanical Properties of Ultrasonic‐Assisted Al2O3 Ceramic/Zn5Al‐xCu/2024Al Solder Joints.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 12, p. 1, doi. 10.1002/adem.202402621

By:

Chen, Chao;
Xu, Ke;
Gao, Xiaolei;
Li, Haijun

Publication type:

Article

Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network.

Published in:

Polymers (20734360), 2025, v. 17, n. 11, p. 1507, doi. 10.3390/polym17111507

By:

Ye, Minghao;
Jiang, Jing;
Zhao, Lin;
Zhu, Hongyu;
Wang, Junjie;
Sun, Zicai;
Zhang, Dewei;
Li, Ming;
Zhang, Yagang

Publication type:

Article

Advanced Manufacturing on Nano- and Microscale.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 11, p. 852, doi. 10.3390/nano15110852

By:

Zhang, Ruifeng;
Ruan, Qifeng;
Wang, Hao;
Ke, Yujie

Publication type:

Article

Preparation and Properties of Polylactic Acid‐Based Shape Memory Composites.

Published in:

Journal of Applied Polymer Science, 2025, v. 142, n. 20, p. 1, doi. 10.1002/app.56890

By:

Zheng, Yuluo;
Lin, Jianming;
Cai, Jiaxin;
Mo, Qi;
Zhang, Shuya;
Wang, Xiyue;
Wang, Beiwei;
Qin, Yafei;
Huang, Lijie

Publication type:

Article

The cybernetic border: Drones, technology, and intrusion.

Published in:

2025

By:

Topak, Özgün Erdener

Publication type:

Book Review

Antistatic, Flame‐Retardant, and Mechanically Resistant Cellulose/Carbon Black Cryogels for Electrostatic Discharge Packaging.

Published in:

Advanced Sustainable Systems, 2025, v. 9, n. 5, p. 1, doi. 10.1002/adsu.202400991

By:

Polezi, Gabriele;
Nascimento, Diego M.;
Ferreira, Elisa S.;
Bernardes, Juliana S.

Publication type:

Article

Advanced IC packaging: Markets and trends.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 44

By:

Winkler, Sandra

Publication type:

Article

Electrochemically deposited solder bumps for wafer-level packaging.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 83

By:

Solomon, Gary

Publication type:

Article

Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.

Published in:

Solid State Technology, 2001, v. 44, n. 2, p. 97

By:

Parrini, Lorenzo

Publication type:

Article

Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1592, doi. 10.1007/s11664-025-11738-5

By:

Lee, Dong-Bok;
Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Sodium Fluoroborate Glass Loaded with Fixed CoO and Variable La2O3: Fabrication, Physical, FTIR, and Dielectric Characteristics: Sodium Fluoroborate Glass Loaded with Fixed CoO and Variable La2O3: Fabrication, Physical, FTIR...: N. Alfryyan et al

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 2, p. 1467, doi. 10.1007/s11664-024-11478-y

By:

Alfryyan, Nada;
Al-Ghamdi, Hanan;
Alsaif, Norah A. M.;
Shaaban, Shaaban M.;
Shams, M. S.;
El-Refaey, Adel M.;
Elsad, R. A.;
Abdelghany, A. M.;
Abouhaswa, A. S.;
Mesalam, Yehya I.;
Rammah, Yasser S.

Publication type:

Article

Enhanced Thermal Conductivity of EP Composites by Introducing BN-Al2O3 Hybrid.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6403, doi. 10.1007/s11664-024-11285-5

By:

Tu, Xuesong;
Zhou, Hong;
Chi, Hao;
Zhou, Jian

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4410, doi. 10.1007/s11664-024-11107-8

By:

Bickel, Steffen;
Quednau, Sebastian;
Birlem, Olav;
Graff, Andreas;
Altmann, Frank;
Junghähnel, Manuela;
Panchenko, Juliana

Publication type:

Article

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z

By:

Ma, Limin;
Lu, Ziyi;
Jia, Qiang;
Cui, Ze;
Wang, Yishu;
Li, Dan;
Zhang, Hongqiang;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2703, doi. 10.1007/s11664-024-10970-9

By:

Cui, Ze;
Jia, Qiang;
Zhang, Hongqiang;
Wang, Yishu;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Trailer dash [packaging].

Published in:

Electronics Systems & Software, 2006, v. 4, n. 4, p. 12, doi. 10.1049/ess:20060402

By:

Edwards, Chris

Publication type:

Article

Recent advances in nano-materials for packaging of electronic devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13855, doi. 10.1007/s10854-019-01790-3

By:

Zhang, Shuye;
Xu, Xiangyu;
Lin, Tiesong;
He, Peng

Publication type:

Article

Microstructures and properties of Ag–Cu–Ti–In composite fillers for electronic packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11520, doi. 10.1007/s10854-019-01507-6

By:

Zhang, Shanshan;
Yan, Luchun;
Gao, Kewei;
Yang, Huisheng;
Yang, Lihang;
Wang, Yanbin;
Wan, Xiaoling

Publication type:

Article

Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9396, doi. 10.1007/s10854-019-01270-8

By:

Kuo, Bing-Hau;
Tsai, Du-Cheng;
Huang, Yen-Lin;
Hsu, Po-Chun;
Chuang, Tung-Han;
Lee, Jun-Der;
Tsai, Hsing-Hua;
Shieu, Fuh-Sheng

Publication type:

Article

Cu-Ba0.7Sr0.3TiO3 composites for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 9022, doi. 10.1007/s10854-019-01231-1

By:

Kumar, Sanjay;
Pradeepkumar, Maurya Sandeep;
Dwivedi, Akansha;
Ahmad, Md. Imteyaz

Publication type:

Article

Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4359, doi. 10.1007/s10854-019-00758-7

By:

Huang, Ru;
Ma, Haoran;
Shang, Shengyan;
Kunwar, Anil;
Wang, Yunpeng;
Ma, Haitao

Publication type:

Article

Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11421, doi. 10.1007/s10854-018-9234-6

By:

Roshanghias, Ali

Publication type:

Article

Effects of Sn grain <italic>c-</italic>axis on electromigration in Cu reinforced composite solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 7, p. 5954, doi. 10.1007/s10854-018-8568-4

By:

Wang, Yan;
Wang, Yishu;
Han, Jing;
Tan, Shihai;
Guo, Fu

Publication type:

Article

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4724, doi. 10.1007/s10854-017-8426-9

By:

Yoon, Jeong-Won;
Back, Jong-Hoon;
Jung, Seung-Boo

Publication type:

Article

Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3800, doi. 10.1007/s10854-017-8315-2

By:

Roh, Myong-Hoon;
Nishikawa, Hiroshi;
Tsutsumi, Seiichiro;
Nishiwaki, Naruhiko;
Ito, Keiichi;
Ishikawa, Koji;
Katsuya, Akihiro;
Kamada, Nobuo;
Saito, Mutsuo

Publication type:

Article

Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 11192, doi. 10.1007/s10854-017-6907-5

By:

Huang, M.;
Huang, F.;
Yang, Y.

Publication type:

Article

Electric-current-assisted sintering of nanosilver paste for copper bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 9155, doi. 10.1007/s10854-017-6649-4

By:

Mei, Yunhui;
Li, Lin;
Li, Xin;
Li, Wanli;
Yan, Haidong;
Xie, Yijing

Publication type:

Article

Recent progress of Sn-Ag-Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12729, doi. 10.1007/s10854-016-5407-3

By:

Wu, Jie;
Xue, Song-bai;
Wang, Jing-wen;
Liu, Shuang;
Han, Yi-long;
Wang, Liu-jue

Publication type:

Article

Effect of aluminum addition on the electrochemical corrosion behavior of Sn-3Ag-0.5Cu solder alloy in 3.5 wt% NaCl solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 12193, doi. 10.1007/s10854-016-5374-8

By:

Fayeka, M.;
Fazal, M.;
Haseeb, A.

Publication type:

Article

Tensile creep behavior of Sn-Ag-Cu-Ni multicomponent lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 6630, doi. 10.1007/s10854-016-4609-z

By:

Zhao, N.;
Huang, M.;
Wu, C.

Publication type:

Article

Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5563, doi. 10.1007/s10854-016-4461-1

By:

Suhir, E.

Publication type:

Article

Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5592, doi. 10.1007/s10854-016-4464-y

By:

Wu, Guanglei;
Cheng, Yonghong;
Wang, Kuikui;
Wang, Yiqun;
Feng, Ailing

Publication type:

Article

Whisker growth on SnAgCu-xPr solders in electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5618, doi. 10.1007/s10854-016-4468-7

By:

Zhang, Liang;
Yang, Fan;
Zhong, Su-juan

Publication type:

Article

Fabrication and characterization of AlN/PTFE composites with low dielectric constant and high thermal stability for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 286, doi. 10.1007/s10854-015-3752-2

By:

Pan, Chen;
Kou, Kaichang;
Wu, Guanglei;
Zhang, Yu;
Wang, Yiqun

Publication type:

Article

Improvements in thermo-mechanical and rheological properties of SiO/epoxy composites using different types of SiO.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 503, doi. 10.1007/s10854-015-3781-x

By:

Li, Gang;
Zhang, Wenjie;
Zhu, Pengli;
Lu, Daoqiang;
Zhao, Tao;
Sun, Rong

Publication type:

Article

Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9680, doi. 10.1007/s10854-015-3635-6

By:

Suhir, Ephraim;
Ghaffarian, Reza

Publication type:

Article

Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10062, doi. 10.1007/s10854-015-3688-6

By:

Suhir, Ephraim;
Ghaffarian, Reza;
Nicolics, Johann

Publication type:

Article

Development and characterization of Sn-1.3Ag-0.7Cu solder bearing Zn for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 8807, doi. 10.1007/s10854-015-3561-7

By:

El-Daly, A.;
Radwan, N.;
Abo El-Eizz, H.;
Hamza, B.

Publication type:

Article

Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 9164, doi. 10.1007/s10854-015-3606-y

By:

Sun, Lei;
Zhang, Liang;
Zhong, Su-juan;
Ma, Jia;
Bao, Li

Publication type:

Article

Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6194, doi. 10.1007/s10854-015-3202-1

By:

Zhang, Liang;
Sun, Lei;
Han, Ji-guang;
Guo, Yong-huan

Publication type:

Article

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4412, doi. 10.1007/s10854-015-2892-8

By:

Gan, Chong;
Hashim, U.

Publication type:

Article

Recent progresses on hybrid micro-nano filler systems for electrically conductive adhesives (ECAs) applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4730, doi. 10.1007/s10854-015-3016-1

By:

Meschi Amoli, Behnam;
Hu, Anming;
Zhou, Norman;
Zhao, Boxin

Publication type:

Article

Microstructure and properties of Al/Sip composites for thermal management applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4234, doi. 10.1007/s10854-015-2973-8

By:

Cai, Zhiyong;
Wang, Richu;
Zhang, Chun;
Peng, Chaoqun;
Wang, Linqian

Publication type:

Article

Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 933, doi. 10.1007/s10854-014-2485-y

By:

Huang, M.;
Yang, F.

Publication type:

Article

Stress reduction in silicon/oxidized silicon-Pyrex glass anodic bonding for MEMS device packaging: RF switches and pressure sensors.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 411, doi. 10.1007/s10854-014-2415-z

By:

Joyce, Robin;
Singh, Kulwant;
Varghese, Soney;
Akhtar, Jamil

Publication type:

Article

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4219, doi. 10.1007/s10854-014-2152-3

By:

Xue, Peng;
Xue, Song-bai;
Shen, Yi-fu;
Long, Fei;
Zhu, Hong

Publication type:

Article

Microstructure and thermo-physical properties of a SiC/pure-Al composite for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 604, doi. 10.1007/s10854-013-1474-x

By:

Zhang, Qiang;
Jiang, Longtao;
Wu, Gaohui

Publication type:

Article

Reactions and mechanical properties between AuSn20 solders and metalized Al-Si alloys for electronic packaging application.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 742, doi. 10.1007/s10854-013-1639-7

By:

Zhu, Xuewei;
Wang, Richu;
Peng, Chaoqun;
Wei, Xiaofeng;
Peng, Jian

Publication type:

Article