Works matching DE "SEMICONDUCTOR manufacturing"
Results: 1080
Chaos at Interface Brings Order into Oxide/Silicon Structure.
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- Advanced Functional Materials, 2021, v. 31, n. 36, p. 1, doi. 10.1002/adfm.202104925
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Programmable Single‐Crystalline PbI<sub>2</sub> Microplate Arrays and Their Organic/Inorganic Heterojunctions.
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- Advanced Functional Materials, 2020, v. 30, n. 43, p. 1, doi. 10.1002/adfm.202003631
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High‐Resolution Monolithic Integrated Tribotronic InGaZnO Thin‐Film Transistor Array for Tactile Detection.
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- Advanced Functional Materials, 2020, v. 30, n. 35, p. 1, doi. 10.1002/adfm.202002613
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Anhydride‐Assisted Spontaneous Room Temperature Sintering of Printed Bioresorbable Electronics.
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- Advanced Functional Materials, 2020, v. 30, n. 29, p. 1, doi. 10.1002/adfm.201905024
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Direct Patterning of Metal Chalcogenide Semiconductor Materials.
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- Advanced Functional Materials, 2020, v. 30, n. 27, p. 1, doi. 10.1002/adfm.202002685
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Enhanced Quality of Wafer‐Scale MoS<sub>2</sub> Films by a Capping Layer Annealing Process.
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- Advanced Functional Materials, 2020, v. 30, n. 11, p. 1, doi. 10.1002/adfm.201908040
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An Intrinsically Stretchable High‐Performance Polymer Semiconductor with Low Crystallinity.
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- Advanced Functional Materials, 2019, v. 29, n. 46, p. N.PAG, doi. 10.1002/adfm.201905340
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High‐Performance Monolayer MoS<sub>2</sub> Films at the Wafer Scale by Two‐Step Growth.
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- Advanced Functional Materials, 2019, v. 29, n. 32, p. N.PAG, doi. 10.1002/adfm.201901070
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Catalytic and Light‐Driven ZnO/Pt Janus Nano/Micromotors: Switching of Motion Mechanism via Interface Roughness and Defect Tailoring at the Nanoscale.
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- Advanced Functional Materials, 2019, v. 29, n. 22, p. N.PAG, doi. 10.1002/adfm.201808678
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Defect Modulation Doping.
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- Advanced Functional Materials, 2019, v. 29, n. 14, p. N.PAG, doi. 10.1002/adfm.201807906
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Shallow and Undoped Germanium Quantum Wells: A Playground for Spin and Hybrid Quantum Technology.
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- Advanced Functional Materials, 2019, v. 29, n. 14, p. N.PAG, doi. 10.1002/adfm.201807613
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- Article
CowSSL: contrastive open-world semi-supervised learning for wafer bin map.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 2163, doi. 10.1007/s10845-024-02351-0
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Virtual metrology for chemical mechanical planarization of semiconductor wafers.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 1923, doi. 10.1007/s10845-024-02335-0
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A novel joint segmentation approach for wafer surface defect classification based on blended network structure.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 1907, doi. 10.1007/s10845-024-02324-3
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Shape prior guided defect pattern classification and segmentation in wafer bin maps.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 1, p. 319, doi. 10.1007/s10845-023-02242-w
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Multi-source wafer map retrieval based on contrastive learning for root cause analysis in semiconductor manufacturing.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 1, p. 259, doi. 10.1007/s10845-023-02233-x
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Wafer map defect recognition based on multi-scale feature fusion and attention spatial pyramid pooling.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 1, p. 271, doi. 10.1007/s10845-023-02231-z
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Shapley-based explainable AI for clustering applications in fault diagnosis and prognosis.
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- Journal of Intelligent Manufacturing, 2024, v. 35, n. 8, p. 4071, doi. 10.1007/s10845-024-02468-2
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Machine learning enabled optimization of showerhead design for semiconductor deposition process.
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- Journal of Intelligent Manufacturing, 2024, v. 35, n. 2, p. 925, doi. 10.1007/s10845-023-02082-8
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Optimizing semiconductor processing open tube furnace performance: comparative analysis of PI and Mamdani fuzzy-PI controllers.
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- Journal of Intelligent Manufacturing, 2023, v. 34, n. 7, p. 3015, doi. 10.1007/s10845-022-01993-2
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Daily stepper scheduling rule in the semiconductor manufacturing for MTO products.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 54, n. 1-4, p. 323, doi. 10.1007/s00170-010-2934-6
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A capacity evaluation and trading model for semiconductor foundry manufacturing.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 54, n. 1-4, p. 1, doi. 10.1007/s00170-010-2942-6
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A hybrid fuzzy and neural approach for forecasting the book-to-bill ratio in the semiconductor manufacturing industry.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 52, n. 1-4, p. 377, doi. 10.1007/s00170-010-2712-5
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Development of a pad conditioning simulation module with a diamond dresser for CMP applications.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 1-4, p. 1, doi. 10.1007/s00170-009-2488-7
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Minimizing total weighted tardiness on a batch-processing machine with non-agreeable release times and due dates.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 48, n. 9-12, p. 1133, doi. 10.1007/s00170-009-2342-y
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Scheduling of Wet Etch and Furnace Operations with Next Arrival Control Heuristic.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 38, n. 9/10, p. 1006, doi. 10.1007/s00170-007-1146-1
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Evaluating and controlling silicon wafer slicing quality using fuzzy analytical hierarchy and sensitivity analysis.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 3/4, p. 322, doi. 10.1007/s00170-006-0831-9
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An empirical approach to modelling fluid dispensing for electronic packaging.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 1/2, p. 111, doi. 10.1007/s00170-006-0552-0
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A hybrid genetic algorithm to minimize makespan for the single batch machine dynamic scheduling problem.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 3/4, p. 350, doi. 10.1007/s00170-005-0194-7
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Position/force control with a lead compensator for PMLSM drive system.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 11/12, p. 1084, doi. 10.1007/s00170-005-0139-1
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Differentiated preemptive dispatching for automatic materials handling services in 300 mm semiconductor foundry.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 890, doi. 10.1007/s00170-005-2610-4
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A literature review, classification and simple meta-analysis on scheduling of batch processors in semiconductor.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 990, doi. 10.1007/s00170-005-2585-1
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Materials science: Semiconductors grown large and thin.
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- Nature, 2015, v. 520, n. 7549, p. 631, doi. 10.1038/520631a
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- Article
Gel-Based PVA/SiO 2 /p-Si Heterojunction for Electronic Device Applications.
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- Gels (2310-2861), 2024, v. 10, n. 8, p. 537, doi. 10.3390/gels10080537
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- Article
TiO 2 -Coated Meltblown Nonwoven Fabrics Prepared via Atomic Layer Deposition for the Inactivation of E. coli as a Model Photocatalytic Drinking Water Treatment System.
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- Environments (2076-3298), 2024, v. 11, n. 5, p. 92, doi. 10.3390/environments11050092
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ZMIANY W POLITYCE USA WZGLĘDEM CHIN W ZAKRESIE KONTROLI DOSTĘPU DO ZAAWANSOWANYCH TECHNOLOGII NA PRZYKŁADZIE CHIPS I SCIENCE ACT.
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- Economic & Political Thought / Myśl Ekonomiczna i Polityczna, 2023, v. 79, n. 4, p. 111, doi. 10.26399/meip.4(79).2023.29/b.szafranski
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- Article
Rapid single-shot parity spin readout in a silicon double quantum dot with fidelity exceeding 99%.
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- NPJ Quantum Information, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41534-024-00813-0
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- Article
Phase flip code with semiconductor spin qubits.
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- NPJ Quantum Information, 2022, v. 8, n. 1, p. 1, doi. 10.1038/s41534-022-00639-8
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- Article
High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric.
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- Advanced Electronic Materials, 2023, v. 9, n. 11, p. 1, doi. 10.1002/aelm.202300415
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- Article
Organic Charge‐Transfer Complex based Microstructure Interfaces for Solution‐Processable Organic Thin‐Film Transistors toward Multifunctional Sensing.
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- Advanced Electronic Materials, 2023, v. 9, n. 8, p. 1, doi. 10.1002/aelm.202300205
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- Article
Ultrathin Polythiophene Films Prepared by Vertical Phase Separation for Highly Stretchable Organic Field‐Effect Transistors.
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- Advanced Electronic Materials, 2021, v. 7, n. 11, p. 1, doi. 10.1002/aelm.202100591
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- Article
A Janovec‐Kay‐Dunn‐Like Behavior at Thickness Scaling in Ultra‐Thin Antiferroelectric ZrO<sub>2</sub> Films.
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- Advanced Electronic Materials, 2021, v. 7, n. 11, p. 1, doi. 10.1002/aelm.202100485
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- Article
Polycrystalline Ge Nanosheets Embedded in Metal‐Semiconductor Heterostructures Enabling Wafer‐Scale 3D Integration of Ge Nanodevices with Self‐Aligned Al Contacts.
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- Advanced Electronic Materials, 2021, v. 7, n. 5, p. 1, doi. 10.1002/aelm.202100101
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Characterization of Aerosol Deposited Cesium Lead Tribromide Perovskite Films on Interdigited ITO Electrodes.
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- Advanced Electronic Materials, 2021, v. 7, n. 3, p. 1, doi. 10.1002/aelm.202001165
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Bioelectronics on Mammalian Collagen.
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- Advanced Electronic Materials, 2020, v. 6, n. 8, p. 1, doi. 10.1002/aelm.202000391
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半導体デバイスの物理的ウエット洗浄技術.
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- Japanese Journal of Multiphase Flow, 2023, v. 37, n. 2, p. 189
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PVA ロールブラシによるウェハ洗浄.
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- Japanese Journal of Multiphase Flow, 2023, v. 37, n. 2, p. 182
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超音波水流に基づく洗浄.
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- Japanese Journal of Multiphase Flow, 2023, v. 37, n. 2, p. 174
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Two-dimensional semiconductor transistors and integrated circuits for advanced technology nodes.
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- National Science Review, 2024, v. 11, n. 3, p. 1, doi. 10.1093/nsr/nwae001
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Highly switchable and reversible dry adhesion for transfer printing.
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- National Science Review, 2020, v. 7, n. 3, p. 558, doi. 10.1093/nsr/nwz134
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- Article