Works matching Soldering
Results: 4931
Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite.
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- Materials (1996-1944), 2023, v. 16, n. 10, p. 3795, doi. 10.3390/ma16103795
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- Article
Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate.
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- Applied Sciences (2076-3417), 2024, v. 14, n. 4, p. 1504, doi. 10.3390/app14041504
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- Article
Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2014, v. 39, n. 12, p. 9101, doi. 10.1007/s13369-014-1457-0
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- Article
Ozone Generator Aluminum Electrode Soldering.
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- Chemical & Petroleum Engineering, 2018, v. 53, n. 11/12, p. 711, doi. 10.1007/s10556-018-0409-z
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- Article
Sn-Zn系无铅焊料在波峰焊中的应用.
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- Electronic Components & Materials, 2018, v. 37, n. 7, p. 8, doi. 10.14106/j.cnki.1001-2028.2018.07.002
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MMaJIC, an Experimental Chamber for Investigating Soldering and Brazing in Microgravity.
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- Gravitational & Space Research, 2017, v. 5, n. 2, p. 28, doi. 10.2478/gsr-2017-0008
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DAMAGE MECHANISM ANALYSIS OF DEVICE FOR THE WAVE SOLDERING.
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- Annals of DAAAM & Proceedings, 2011, p. 1019
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- Article
The Need for a New Approach to Soldering in High Pressure Die Casting.
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- International Journal of Metalcasting, 2021, v. 15, n. 2, p. 391, doi. 10.1007/s40962-020-00504-4
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- Article
Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder.
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- AIMS Materials Science, 2020, v. 7, n. 1, p. 24, doi. 10.3934/matersci.2020.1.24
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The Interfacial Reaction Between Sn-Ag-Cu (SAC)/Cu During Laser Soldering.
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- Lasers in Engineering (Old City Publishing), 2021, v. 51, n. 6, p. 333
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- Article
Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration (Adv. Funct. Mater. 36/2023).
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- Advanced Functional Materials, 2023, v. 33, n. 36, p. 1, doi. 10.1002/adfm.202370214
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- Article
Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration.
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- Advanced Functional Materials, 2023, v. 33, n. 36, p. 1, doi. 10.1002/adfm.202303286
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- Article
Reducing the Cost of the Production Process. Selective Soldering -- Continuous Improvement.
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- Journal of Computer Science & Control Systems, 2015, v. 8, n. 1, p. 11
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- Article
Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper.
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- Metals (2075-4701), 2021, v. 11, n. 4, p. 624, doi. 10.3390/met11040624
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- Article
Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination.
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- Metals (2075-4701), 2021, v. 11, n. 1, p. 27, doi. 10.3390/met11010027
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- Article
Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper.
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- Metals (2075-4701), 2018, v. 8, n. 4, p. 274, doi. 10.3390/met8040274
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- Article
The effects of soldering flux type on corrosion properties of electrical wires.
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- International Journal of Materials & Engineering Technology (TIJMET), 2023, v. 6, n. 2, p. 46
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- Article
Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 4, p. 1755, doi. 10.3390/app11041755
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- Article
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3
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- Article
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3383, doi. 10.1007/s11664-020-08030-z
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Fluxless soldering.
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- International Materials Reviews, 2006, v. 51, n. 5, p. 313, doi. 10.1179/174328006X102547
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Thermophysical Characteristics of the Protective Coating of the Soldering Rod.
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- Journal of Engineering Physics & Thermophysics, 2015, v. 88, n. 1, p. 146, doi. 10.1007/s10891-015-1176-8
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Temperature Drop Over the Soldering Rod Length.
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- Journal of Engineering Physics & Thermophysics, 2014, v. 87, n. 3, p. 729, doi. 10.1007/s10891-014-1066-5
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- Article
基于 EKF 的热压焊温度控制方法建模与仿真.
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- Journal of South China University of Technology (Natural Science Edition), 2023, v. 51, n. 9, p. 11, doi. 10.12141/jissn.1000-565X.220826
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- Article
Comparison of Implant-Abutment Interface Misfits After Casting and Soldering Procedures.
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- Journal of Oral Implantology, 2014, v. 40, n. 2, p. 129, doi. 10.1563/AAID-JOI-D-11-00070
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Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process.
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- Mathematics (2227-7390), 2022, v. 10, n. 17, p. 3055, doi. 10.3390/math10173055
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Metallurgical Soldering of Duplex CrN Coating in Contact with Aluminum Alloy.
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- Coatings (2079-6412), 2020, v. 10, n. 3, p. 303, doi. 10.3390/coatings10030303
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Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven.
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- Symmetry (20738994), 2023, v. 15, n. 9, p. 1739, doi. 10.3390/sym15091739
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MAIN INCOMPATIBILITIES OF SOLDERING PROCESS IN AUTOMOTIVE INDUSTRY.
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- Transport Problems: an International Scientific Journal, 2019, v. 14, n. 2, p. 19, doi. 10.20858/tp.2019.14.2.2
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New Product Development of a Robotic Soldering Cell Using Lean Manufacturing Methodology.
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- Sustainability (2071-1050), 2022, v. 14, n. 21, p. 14057, doi. 10.3390/su142114057
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Use of contact-reactive soldering in production of power semiconductor devices.
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- Welding International, 2012, v. 26, n. 1, p. 45, doi. 10.1080/09507116.2011.592712
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Strength and corrosion resistance of a solder joint in ultrasonic soldering of aluminium using quasi-melting solder.
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- Welding International, 2009, v. 23, n. 12, p. 879, doi. 10.1080/09507110902836960
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- Article
High-precision optomechanical lens system for space applications assembled by a local soldering technique.
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- Optical Engineering, 2016, v. 55, n. 6, p. 1, doi. 10.1117/1.OE.55.6.065101
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- Article
The Effect of Preceramic Soldering on Fracture Resistance of 4‐Unit Zirconia Fixed Dental Prostheses.
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- Journal of Prosthodontics, 2022, v. 31, n. 9, p. 815, doi. 10.1111/jopr.13488
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Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1975, doi. 10.1007/s11664-006-0302-y
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- Article
Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1161, doi. 10.1007/s11664-004-0118-6
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Data-based thermodynamic model and feedforward-PI control method for laser soldering.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 11/12, p. 5249, doi. 10.1007/s00170-023-12553-0
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- Article
Obtaining a low-temperature paste based on eutectic silumin for soldering special-purpose products.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3857, doi. 10.1007/s00170-021-08619-6
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- Article
Lead Titanate Granulometric Composition Effect on CLTE of Low-Melting Glass-Composition Materials for Vacuum-Tight Low-Temperature Soldering of Corundum Parts.
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- Glass & Ceramics, 2017, v. 74, n. 5/6, p. 176, doi. 10.1007/s10717-017-9956-6
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- Article
SOLDERING HIGH-PURITY MATERIALS WITH CU SUBSTRATE.
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- Annals of DAAAM & Proceedings, 2011, p. 1011
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- Article
EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE.
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- Suranaree Journal of Science & Technology, 2022, v. 29, n. 2, p. 1
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- Article
Evaluation of Die-Soldering and Erosion Resistance of High Velocity Oxy-Fuel Sprayed MoB-Based Cermet Coatings.
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- Journal of Thermal Spray Technology, 2011, v. 20, n. 5, p. 1022, doi. 10.1007/s11666-010-9610-0
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- Article
Exogenous bFGF or TGFβ accelerates healing of reconstructed dura by CO laser soldering in minipigs.
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- Lasers in Medical Science, 2014, v. 29, n. 3, p. 1165, doi. 10.1007/s10103-013-1466-3
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- Article
Quality Control of Soldering of Side Walls of Clamps in Current-Carrying Connections of Electric Machines Taking into Account the Influence of Their Sizes.
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- Russian Journal of Nondestructive Testing, 2022, v. 58, n. 12, p. 1142, doi. 10.1134/S1061830922700140
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Eddy Current Quality Control of Soldering in Superconducting Current-Carrying Joints with Allowance for the Effect of Cross Section Variations on Testing Results.
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- Russian Journal of Nondestructive Testing, 2019, v. 55, n. 9, p. 654, doi. 10.1134/S106183091909002X
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Improving the Reliability of Eddy-Current Quality Control of Soldering in Current-Carrying Copper Joints and Expanding the Nomenclature of Inspected Joints in Energy Equipment.
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- Russian Journal of Nondestructive Testing, 2018, v. 54, n. 11, p. 784, doi. 10.1134/S1061830918110049
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Eddy-current quality control of soldering of current-carrying joints in electrical machines. II. Experiment.
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- Russian Journal of Nondestructive Testing, 2010, v. 46, n. 4, p. 292, doi. 10.1134/S1061830910040078
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Contact allergy to colophony in soldering flux.
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- Contact Dermatitis (01051873), 1983, v. 9, n. 3, p. 205, doi. 10.1111/j.1600-0536.1983.tb04359.x
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- Article
Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints.
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- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 4, p. 115, doi. 10.4071/001c.57716
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- Article
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications.
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- Energies (19961073), 2023, v. 16, n. 16, p. 5856, doi. 10.3390/en16165856
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- Article