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The Innovation Engine of India Non-uniform energy source / sink influence on magneto-convective CdTe and C/H<sub>2</sub>O suspended Williamson fluid model: Computational approach.
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- Indian Journal of Chemical Technology, 2024, v. 31, n. 3, p. 394, doi. 10.56042/ijct.v31i3.6451
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- Article
Simulation-based inference for parameter estimation of complex watershed simulators.
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- Hydrology & Earth System Sciences, 2024, v. 28, n. 20, p. 4685, doi. 10.5194/hess-28-4685-2024
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- Article
Preparation and Characterization of Lightweight Carbon Foam Derived From Silicon‐Containing Arylacetylene Resin With Antioxidant Properties and Excellent Electromagnetic Interference Shielding Performance.
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- Polymers for Advanced Technologies, 2024, v. 35, n. 10, p. 1, doi. 10.1002/pat.6600
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- Article
A Circular Economy Perspective: Recycling Wastes through the CO 2 Capture Process in Gypsum Products. Fire Resistance, Mechanical Properties, and Life Cycle Analysis.
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- Fire (2571-6255), 2024, v. 7, n. 10, p. 365, doi. 10.3390/fire7100365
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- Article
Cross-Linked Polyimide Aerogels with Excellent Thermal and Mechanical Properties.
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- Gels (2310-2861), 2024, v. 10, n. 10, p. 667, doi. 10.3390/gels10100667
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- Article
Effect of Fiber Characteristics on the Structure and Properties of Quartz Fiber Felt Reinforced Silica-Polybenzoxazine Aerogel Composites.
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- Gels (2310-2861), 2024, v. 10, n. 10, p. 613, doi. 10.3390/gels10100613
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- Article
High-Temperature SHS Heat Insulators Based on Pre-Activated Mineral Raw Materials.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 904, doi. 10.3390/cryst14100904
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- Article
Evaluation of Processing Parameters in the Solvothermal Synthesis of Cu-Rich Tetrahedrites for Potential Application as Thermoelectric Materials.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 888, doi. 10.3390/cryst14100888
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- Article
Correction: Sachhin et al. Darcy–Brinkman Model for Ternary Dusty Nanofluid Flow across Stretching/Shrinking Surface with Suction/Injection. Fluids 2024, 9 , 94.
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- 2024
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- Correction Notice
Synthesis and properties of SWCNT- and MWCNT-reinforced PIR and PUR foam composites.
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- Indian Journal of Chemical Technology, 2024, v. 31, n. 1, p. 125, doi. 10.56042/ijct.v31i1.7608
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- Article
Large-scale conformal synthesis of one-dimensional MAX phases.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-53137-0
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- Article
Low Thermal Conductivity of Epidote and Its Cooling Effect on the Oceanic Crust.
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- Journal of Geophysical Research. Solid Earth, 2024, v. 129, n. 10, p. 1, doi. 10.1029/2024JB029667
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- Article
Parameter Estimations on Measurement Accuracy for Thermal Conductivity of Wood Using the Transient Plane Source Method.
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- Forests (19994907), 2024, v. 15, n. 10, p. 1820, doi. 10.3390/f15101820
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- Article
Possibilities of thermovision application in sport and sport rehabilitation.
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- Vojnosanitetski Pregled: Military Medical & Pharmaceutical Journal of Serbia, 2012, v. 69, n. 10, p. 904, doi. 10.2298/VSP1210904B
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- Article
Electro-magnetic shielding applications.
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- Melliand International, 2020, n. 4, p. 170
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- Article
Spacer fabrics and the effect of plasma treatment on its functional characteristics.
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- Melliand International, 2015, n. 4, p. 267
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- Article
Study on moisture management interlock knitted fabrics.
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- Melliand International, 2010, v. 16, n. 5/6, p. 224
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- Article
Numerical Analysis of Nanofluid Thermal Flows through a Model Heat Exchanger: Effects of Nanoparticle Volume Fraction on Energy Efficiency.
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- Journal of Textile Engineering, 2021, v. 67, n. 4, p. 65, doi. 10.4188/jte.67.65
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- Article
Errata: Polymer/Alumina Nanofiber Composite Sheets with Anisotropic High Thermal Conductivity.
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- Journal of Textile Engineering, 2019, v. 65, n. 6, p. 115
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- Article
Polymer/Alumina Nanofiber Composite Sheets with Anisotropic High Thermal Conductivity.
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- Journal of Textile Engineering, 2019, v. 65, n. 4, p. 67, doi. 10.4188/jte.65.67
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- Publication type:
- Article
Preparation and Thermal Emission Characteristics of [Ca<sub>24</sub>Al<sub>28</sub>O<sub>64</sub>]<sup>4+</sup>:4e<sup>−</sup> Electronic Compounds.
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- Journal of Electronic Materials, 2024, v. 53, n. 11, p. 6711, doi. 10.1007/s11664-024-11353-w
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- Article
Enhanced Thermal Conductivity of EP Composites by Introducing BN-Al<sub>2</sub>O<sub>3</sub> Hybrid.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6403, doi. 10.1007/s11664-024-11285-5
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- Article
Excellent Anti-fouling Properties and High Thermal Conductivity of Superhydrophobic SiC/PU-Coated BNNS Composite Films.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6228, doi. 10.1007/s11664-024-11232-4
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- Article
Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation.
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- Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5519, doi. 10.1007/s11664-024-11281-9
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- Article
Cu<sub>6</sub>GeWS<sub>8</sub>: A Two-Dimensional Quaternary Sulfide with Direct Bandgap and Ultralow Lattice Thermal Conductivity.
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- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3822, doi. 10.1007/s11664-024-11159-w
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- Article
Thermoelectric Properties of Sb<sub>2</sub>Te<sub>3</sub> Ink Fabricated by Screen-Printing Technique.
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- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 4111, doi. 10.1007/s11664-024-10996-z
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- Article
Electrospinning of Bacterial Cellulose Modified with Acetyl Groups for Polymer Electrolyte Li-Ion Batteries.
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- Journal of Electronic Materials, 2024, v. 53, n. 4, p. 2062, doi. 10.1007/s11664-024-10958-5
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- Article
Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1360, doi. 10.1007/s11664-023-10785-0
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- Article
Effect of Composition Regulation on Thermoelectric Properties of Fe<sub>3</sub>Al<sub>2</sub>Si<sub>3</sub>-Based Compounds.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 171, doi. 10.1007/s11664-023-10746-7
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- Article
Ultrahigh Thermoelectric Performance of ZnO-CdO Thin Films.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 188, doi. 10.1007/s11664-023-10761-8
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- Article
First-Principles Analysis of CuMg<sub>2</sub>InS<sub>4</sub>: Insights into Optical, Piezoelectric, and Thermoelectric Properties.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6778, doi. 10.1007/s11664-023-10609-1
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- Article
Ab Initio Study of the Properties of Ti<sub>2</sub>PdFe(Ru)Sb<sub>2</sub> Double Half-Heusler Semiconducting Alloys.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6514, doi. 10.1007/s11664-023-10589-2
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- Article
Enhanced Thermoelectric Performance of a HfS<sub>2</sub> Bilayer by Strain Engineering.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6537, doi. 10.1007/s11664-023-10443-5
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- Article
A Study of Densification and Enhanced Microwave Dielectric Properties of Al<sub>2</sub>O<sub>3</sub>–Polystyrene Ceramic Composites.
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- Journal of Electronic Materials, 2023, v. 52, n. 9, p. 6019, doi. 10.1007/s11664-023-10544-1
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- Article
Porous ZnO with Enhanced Thermoelectric Properties.
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- Journal of Electronic Materials, 2023, v. 52, n. 9, p. 6071, doi. 10.1007/s11664-023-10536-1
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- Article
Effect of Aliovalent Doping on the Thermoelectric Performance of Double Half-Heusler Alloys.
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- Journal of Electronic Materials, 2023, v. 52, n. 8, p. 5473, doi. 10.1007/s11664-023-10478-8
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- Article
Effects of Chain Length, Stretching, and Molecular Groups on the Thermal Conductivity of Single Crosslinked Epoxy Resin Chains.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2831, doi. 10.1007/s11664-023-10246-8
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- Article
First-Principles Study of Lattice Thermal Conductivity in Janus MoSSe Bilayers with Different Stacking Modes.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2458, doi. 10.1007/s11664-022-10199-4
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- Article
Predicting Effective Thermal Conductivity of Sintered Silver by Microstructural-Simulation-Based Machine Learning.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2347, doi. 10.1007/s11664-022-10172-1
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- Article
Thermal and Electrical Conductivities of Platinum/Iridium Microwires.
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- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 2185, doi. 10.1007/s11664-022-10190-z
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- Article
Effect of Single-Walled Carbon Nanotubes on Thermoelectric Properties of SnTe-Based Composites.
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- Journal of Electronic Materials, 2023, v. 52, n. 2, p. 994, doi. 10.1007/s11664-022-10137-4
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- Article
Finite Element Method Analysis of Fatigue and Damage in Low-Temperature-Sintered Nano-silver Soldered Joints.
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- Journal of Electronic Materials, 2023, v. 52, n. 2, p. 760, doi. 10.1007/s11664-022-10097-9
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- Article
Thermoelectric Transport Properties of Double-Filling In<sub>x</sub>La<sub>0.25</sub>Co<sub>4</sub>Sb<sub>12</sub> Skutterudite Materials.
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- Journal of Electronic Materials, 2023, v. 52, n. 2, p. 971, doi. 10.1007/s11664-022-10083-1
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- Article
Hot Extruded Bulk Polycrystalline (Bi<sub>1-x</sub>Sb<sub>x</sub>)<sub>2</sub>(Te<sub>1-y</sub>Se<sub>y</sub>)<sub>3</sub> Alloys: Electron Transport and Lattice Thermal Conductivity.
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- Journal of Electronic Materials, 2023, v. 52, n. 1, p. 707, doi. 10.1007/s11664-022-10041-x
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- Article
Low Thermal Conductivity and Enhancement in Figure-of-Merit in Na and Mg Co-doped β-Zn<sub>4</sub>Sb<sub>3</sub>.
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- Journal of Electronic Materials, 2023, v. 52, n. 1, p. 559, doi. 10.1007/s11664-022-10027-9
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- Article
Preparation of a Wood-Based Thermally Conductive Composite.
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- Journal of Electronic Materials, 2023, v. 52, n. 1, p. 540, doi. 10.1007/s11664-022-10023-z
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- Article
Enhanced Electronic Thermal Conductivity and Heat Capacity of Biased Bilayer Boron Phosphide with Magnetic Field.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 7240, doi. 10.1007/s11664-022-09966-0
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- Article
Enhanced Thermoelectric Properties of Sn<sub>x</sub>Sb<sub>2</sub>S<sub>y</sub> (1 ≤ x ≤ 3, 4 ≤ y ≤ 6) Thin Films.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6770, doi. 10.1007/s11664-022-09936-6
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- Article
Study on Thermal Reliability of Ga-Based Liquid Metal as Thermal Interface Material Encapsulated with Fluororubber.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6975, doi. 10.1007/s11664-022-09927-7
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- Article
Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 7326, doi. 10.1007/s11664-022-09770-w
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- Article