Found: 171
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Solder joint formation simulation and reliability study of quad flat no lead package.
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- Science & Technology of Welding & Joining, 2007, v. 12, n. 1, p. 100, doi. 10.1179/174329306X131857
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- Publication type:
- Article
Wettability of SACR- xNi solder alloy on Cu leading wire with no-clean flux.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 94, doi. 10.1007/s10854-016-5496-z
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- Article
Effect of pulsed voltage on electrochemical migration of tin in electronics.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7997, doi. 10.1007/s10854-015-3454-9
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- Article
Tunability of bulk acoustic wave solidly mounted resonators using passive elements: Concept, design and implementation.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2011, v. 21, n. 5, p. 496, doi. 10.1002/mmce.20554
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- Publication type:
- Article
基于 FPGA 的三维闪电探测仪电路系统设计.
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- Journal of Jilin University (Science Edition) / Jilin Daxue Xuebao (Lixue Ban), 2022, v. 60, n. 4, p. 977, doi. 10.13413/j.cnki.jdxblxb.202141
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- Article
Secure Circuit with Low-power On-chip Temperature Sensor for Detection of Temperature Fault Injection Attacks.
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- Sensors & Materials, 2019, v. 31, n. 5, Part 1, p. 1375, doi. 10.18494/SAM.2019.2258
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- Article
Efficient hybrid group search optimizer for assembling printed circuit boards.
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- AI EDAM, 2019, v. 33, n. 3, p. 259, doi. 10.1017/S0890060418000240
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- Article
Analytical Model on Real Geometries of Magnet Bars of Surface Permanent Magnet Slotless Machine.
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- Progress in Electromagnetics Research B, 2016, v. 66, p. 31, doi. 10.2528/pierb15121503
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- Article
PERFORMANCE ANALYSIS OF A JPEG ENCODER MAPPED ONTO A VIRTUAL MPSoC-NoC ARCHITECTURE USING TLM 2.0.1.
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- Journal of Circuits, Systems & Computers, 2013, v. 22, n. 5, p. -1, doi. 10.1142/S0218126613500369
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- Article
A SELECTIVE READ-BEFORE-WRITE SCHEME FOR ENERGY-AWARE SPIN TORQUE TRANSFER RAM (STT-RAM) CACHE DESIGN.
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- Journal of Circuits, Systems & Computers, 2013, v. 22, n. 5, p. -1, doi. 10.1142/S0218126613500382
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- Publication type:
- Article
Smart Aggregate-Piezoceramic Patch Combination for Health Monitoring of Concrete Structures.
- Published in:
- Journal of Sensors, 2015, p. 1, doi. 10.1155/2016/3270916
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- Article
Digitally Enabled RF Building Blocks Address Emerging EW System Needs.
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- Microwave Journal, 2023, v. 66, n. 9, p. 50
- Publication type:
- Article
The Impact of Topology and Parasitics on SMT Bandpass Filters.
- Published in:
- Microwave Journal, 2023, v. 66, n. 7, p. 58
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- Article
NEW PRODUCTS.
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- 2022
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- Publication type:
- Product Review
NEW PRODUCTS: for more new products, visit www.mwjournal.com/buyersguide featuring vendor view storefronts.
- Published in:
- 2020
- Publication type:
- Product Review
Evolving gas flow, measurement, and control technologies.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 51
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- Publication type:
- Article
The Observation and Simulation of Sn-Ag-Cu Solder Solidification in Chip-Scale Packaging.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2004, v. 56, n. 6, p. 39, doi. 10.1007/s11837-004-0109-3
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- Article
Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2
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- Publication type:
- Article
Rheological characterization and jet printing performance of Sn–58Bi solder pastes.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4575, doi. 10.1007/s10854-017-8408-y
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- Publication type:
- Article
Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.
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- Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810
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- Article
Comments on the IPC Surface Mount Attachment Reliability Guidelines.
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- Quality & Reliability Engineering International, 2005, v. 21, n. 4, p. 345, doi. 10.1002/qre.667
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- Article
TOTAL QUALITY CONTROL FOR A SURFACE MOUNT TECHNOLOGY PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARD ASSEMBLIES.
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- Quality & Reliability Engineering International, 1995, v. 11, n. 5, p. 325, doi. 10.1002/qre.4680110503
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- Article
MIL-HDBK-217 Status.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 5, p. 511
- Publication type:
- Article
Surface Mount Technology Guidelines.
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- Quality & Reliability Engineering International, 1991, v. 7, n. 6, p. 514
- Publication type:
- Article
Surface Mount Technology.
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- Quality & Reliability Engineering International, 1991, v. 7, n. 4, p. 351
- Publication type:
- Article
Multi-Organs-on-Chips: Towards Long-Term Biomedical Investigations.
- Published in:
- Molecules, 2019, v. 24, n. 4, p. 675, doi. 10.3390/molecules24040675
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- Publication type:
- Article
Technical Papers: Development and Some Investigative Testing of Smart Structural FRP Devices with Embedded Fiber Optic Sensor for Health Monitoring of Civil Structures.
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- Advances in Structural Engineering, 2010, v. 13, n. 5, p. 905, doi. 10.1260/1369-4332.13.5.905
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- Publication type:
- Article
Assessment of the Predictive Performance of Existing Analytical Models for Debonding of Near-Surface Mounted FRP Strips.
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- Advances in Structural Engineering, 2010, v. 13, n. 2, p. 299, doi. 10.1260/1369-4332.13.2.299
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- Publication type:
- Article
Ultra-broadband microstrip directional couplers.
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- IET Science, Measurement & Technology (Wiley-Blackwell), 2020, v. 14, n. 9, p. 803, doi. 10.1049/iet-smt.2020.0067
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- Publication type:
- Article
Safety-critical wireless sensor networks under a polyphase spreading sequences scenario.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2017, v. 25, n. 3, p. 2522, doi. 10.3906/elk-1605-307
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- Publication type:
- Article
Influence of yttrium element on the crystallization performance of ZnSb alloy for phase change memory application.
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- European Physical Journal - Applied Physics, 2023, v. 98, n. 1, p. 1, doi. 10.1051/epjap/2023230054
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- Article
Modelling cross‐regulation in a single switched capacitor DC‐DC converter.
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- International Journal of Circuit Theory & Applications, 2018, v. 46, n. 6, p. 1272, doi. 10.1002/cta.2472
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- Publication type:
- Article
Automatic generation of IC component configuration data.
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- Electrical Engineering in Japan, 2008, v. 165, n. 4, p. 76, doi. 10.1002/eej.20686
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- Publication type:
- Article
Development and assembly of Radio Frequency Module using components with SMD technology for educational purposes.
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- Latin-American Journal of Physics Education, 2017, v. 11, n. 1, p. 1
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- Publication type:
- Article
Rapid fault cause identification in surface mount technology processes based on factory-wide data analysis.
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- International Journal of Distributed Sensor Networks, 2019, v. 15, n. 2, p. 1, doi. 10.1177/1550147719832802
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- Publication type:
- Article
Design and FE Analysis of BLDC Motor for Electro-Mechanical Actuator.
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- Journal of Electrical Systems, 2015, v. 11, n. 1, p. 76
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- Publication type:
- Article
THE DEVELOPMENT OF A BPN DATA MINING CALIBRATION SYSTEM IN A SMT PCB ASSEMBLY LINE.
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- International Journal of Electronic Business Management, 2009, v. 7, n. 4, p. 286
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- Publication type:
- Article
A New Washable UHF RFID Tag: Design, Fabrication, and Assessment.
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- Sensors (14248220), 2020, v. 20, n. 12, p. 3451, doi. 10.3390/s20123451
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- Publication type:
- Article
A Multi-Channel, Flex-Rigid ECoG Microelectrode Array for Visual Cortical Interfacing.
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- Sensors (14248220), 2015, v. 15, n. 1, p. 832, doi. 10.3390/s150100832
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- Publication type:
- Article
Mercury Systems' Phoenix Advanced Microelectronics Center.
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- Microwave Journal, 2017, v. 60, n. 12, p. 130
- Publication type:
- Article
New Products.
- Published in:
- 2015
- Publication type:
- Product Review
Surface Mount Diplexers with Variable Crossover Attenuation.
- Published in:
- 2014
- Publication type:
- Product Review
The Future of mm-wave Packaging.
- Published in:
- Microwave Journal, 2014, v. 57, n. 2, p. 24
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- Publication type:
- Article
Fusion Processing of Surface Mount Components to Mitigate Tin Whiskers.
- Published in:
- Microwave Journal, 2013, v. 56, n. 10, p. 144
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- Publication type:
- Article
Resolving the Complexity of Hermetic RF Hybrid Housings.
- Published in:
- 2013
- Publication type:
- Product Review
MAKING CENTS.
- Published in:
- Microwave Journal, 2012, v. 55, n. 7, p. 32
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- Publication type:
- Article
Sources.
- Published in:
- 2012
- Publication type:
- Product Review
Available Plastic, Ceramic, Hermetic SMT & Connectorized Module Packages.
- Published in:
- Microwave Journal, 2012, p. 52
- Publication type:
- Article
CLOCKS & TIMING ICs: SMT & Chip (Die) Products.
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- Microwave Journal, 2012, p. 35
- Publication type:
- Article
RF & MICROWAVE ICs: SMT & Chip (Die) Products.
- Published in:
- Microwave Journal, 2012, p. 7
- Publication type:
- Article