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Performance of Open Double Stirrups as Punching-Shear Reinforcement.
- Published in:
- ACI Structural Journal, 2024, v. 121, n. 6, p. 145, doi. 10.14359/51740870
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- Article
Effect of Cast-in-Place Concrete and Stirrups on Shear Capacity of Precast Composite Hollow-Core Slabs.
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- ACI Structural Journal, 2024, v. 121, n. 6, p. 75, doi. 10.14359/51742141
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- Article
Effect of Aramid Fiber Processing with Nanotubes on Shear Strength at the Matrix/Fiber Interface.
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- Russian Journal of General Chemistry, 2024, v. 94, n. 9, p. 2551, doi. 10.1134/S1070363224090330
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- Article
Numerical investigation of friction-heating-pressurization and its control parameters in the shear band of high-speed landslides.
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- Journal of Mountain Science, 2024, v. 21, n. 10, p. 3380, doi. 10.1007/s11629-024-8772-z
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- Article
The Influence of Erbium Laser Pretreatment on Dentin Shear Bond Strength and Bond Failure Modes: A Systematic Review and Network Meta-Analysis.
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- Journal of Adhesive Dentistry, 2024, v. 26, n. 1, p. 147, doi. 10.3290/j.jad.b5378611
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- Article
Effects of Surface Textures Created Using Additive Manufacturing on Shear Bond Strength Between Resin and Zirconia.
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- Journal of Adhesive Dentistry, 2024, v. 26, n. 1, p. 79, doi. 10.3290/j.jad.b5053367
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- Article
Bond Strength, Microleakage, Microgaps, and Marginal Adaptation of Self-adhesive Resin Composites to Tooth Substrates with and without Preconditioning with Universal Adhesives.
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- Journal of Adhesive Dentistry, 2024, v. 26, n. 1, p. 53, doi. 10.3290/j.jad.b4949691
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- Article
Different Wire Surface Treatments on Adhesion Efficacy of Orthodontic Fixed Retainer: An In Vitro Study.
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- Journal of Contemporary Dental Practice, 2024, v. 25, n. 7, p. 677, doi. 10.5005/jp-journals-10024-3726
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- Article
Enhancing Shear Bond Strength in Lithium Silicate Glass Ceramics: Surface Treatment Optimization for Reseating Protocols.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 856, doi. 10.3390/cryst14100856
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- Article
海洋环境用CFRP 筋的力学性能和耐久性能研究.
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- Plastics Science & Technology / Suliao Ke-Ji, 2024, v. 52, n. 9, p. 107, doi. 10.15925/j.cnki.issn1005-3360.2024.09.020
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- Article
Comparative Evaluation of Various Antioxidants on the Shear Bond Strength of Composite Resin to Bleached Enamel -- An In Vitro Study.
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- Indian Journal of Dental Research, 2024, v. 35, n. 2, p. 227, doi. 10.4103/ijdr.ijdr_893_23
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- Article
Global and Local Shear Behavior of the Frozen Soil–Concrete Interface: Effects of Temperature, Water Content, Normal Stress, and Shear Rate.
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- Buildings (2075-5309), 2024, v. 14, n. 10, p. 3319, doi. 10.3390/buildings14103319
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- Article
Numerical Modeling of Distributed Macro-Synthetic Fiber and Deformed Bar Reinforcement to Resist Shear.
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- Buildings (2075-5309), 2024, v. 14, n. 10, p. 3247, doi. 10.3390/buildings14103247
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- Article
Optimization of Shear Resistance in Horizontal Joints of Prefabricated Shear Walls through Post-Cast Epoxy Resin Concrete Applications.
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- Buildings (2075-5309), 2024, v. 14, n. 10, p. 3119, doi. 10.3390/buildings14103119
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- Article
Statistical Evaluation and Reliability Analysis of Interface Shear Capacity in Ultra-High-Performance Concrete Members.
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- Buildings (2075-5309), 2024, v. 14, n. 10, p. 3064, doi. 10.3390/buildings14103064
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- Article
Investigation of Indirect Shear Strength of Black Shale for Urban Deep Excavation.
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- Buildings (2075-5309), 2024, v. 14, n. 10, p. 3050, doi. 10.3390/buildings14103050
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- Article
Phase‐Transition Variations in Granular Materials Under Multi‐Period Vibrations: Implications for Triggering Landslides After Multiple Earthquakes.
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- Journal of Geophysical Research. Solid Earth, 2024, v. 129, n. 10, p. 1, doi. 10.1029/2024JB030206
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- Article
The Effect of Hydrate Formation Conditions on the Mechanics of Laboratory Methane Hydrate‐Bearing Sediments.
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- Journal of Geophysical Research. Solid Earth, 2024, v. 129, n. 10, p. 1, doi. 10.1029/2024JB029217
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- Article
Effect of Bamboo Nodes on the Mechanical Properties of Phyllostachys iridescens.
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- Forests (19994907), 2024, v. 15, n. 10, p. 1740, doi. 10.3390/f15101740
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- Article
Shear bond strength to sound and caries-affected dentin of simplified "etch-and-rinse" and "self-etch" adhesives and the hybrid layer micromorphology.
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- Vojnosanitetski Pregled: Military Medical & Pharmaceutical Journal of Serbia, 2019, v. 76, n. 7, p. 675, doi. 10.2298/VSP161220146D
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- Article
Influence of wool/polyester blend percentage on formability of worsted suiting fabric.
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- Melliand International, 2018, n. 4, p. 210
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- Article
Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z
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- Article
The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints.
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- Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5534, doi. 10.1007/s11664-024-11294-4
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- Article
Behavior of Different Ultrasonically Bonded Aluminum Heavy Wires in the Shear Test.
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- Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5479, doi. 10.1007/s11664-024-11131-8
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- Article
Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.
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- Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8
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- Article
Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3049, doi. 10.1007/s11664-024-11029-5
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- Article
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2703, doi. 10.1007/s11664-024-10970-9
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- Article
A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1414, doi. 10.1007/s11664-023-10881-1
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- Article
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1223, doi. 10.1007/s11664-023-10850-8
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- Article
Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1313, doi. 10.1007/s11664-023-10822-y
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- Article
Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1360, doi. 10.1007/s11664-023-10785-0
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- Article
Particle Size Effects of Nano-Ag Films on the Interface Sintered Bonding for Die Attachment.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 473, doi. 10.1007/s11664-023-10786-z
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- Article
Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 228, doi. 10.1007/s11664-023-10763-6
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- Article
Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?
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- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7475, doi. 10.1007/s11664-023-10677-3
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- Article
Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging.
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- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7607, doi. 10.1007/s11664-023-10656-8
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- Article
Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3903, doi. 10.1007/s11664-023-10358-1
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- Article
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x
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- Article
Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 7326, doi. 10.1007/s11664-022-09770-w
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- Article
Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering.
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- Journal of Electronic Materials, 2022, v. 51, n. 11, p. 6310, doi. 10.1007/s11664-022-09849-4
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- Article
Effect of Various Parameters on the Shear Strength of Solid-State Nanoporous Cu Bonding in Cu–Cu Disks for Power Device Packaging.
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- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3851, doi. 10.1007/s11664-022-09634-3
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- Article
Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding.
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- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2617, doi. 10.1007/s11664-022-09501-1
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- Article
Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints.
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- Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1597, doi. 10.1007/s11664-021-09426-1
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- Article
Reduction Behavior of Surface Oxide on Submicron Copper Particles for Pressureless Sintering Under Reducing Atmosphere.
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- Journal of Electronic Materials, 2022, v. 51, n. 1, p. 1, doi. 10.1007/s11664-021-09274-z
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- Article
Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 7283, doi. 10.1007/s11664-021-09257-0
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- Article
Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6597, doi. 10.1007/s11664-021-09221-y
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- Article
Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process.
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- Journal of Electronic Materials, 2021, v. 50, n. 11, p. 6372, doi. 10.1007/s11664-021-09143-9
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- Article
IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints.
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- Journal of Electronic Materials, 2021, v. 50, n. 6, p. 3326, doi. 10.1007/s11664-021-08844-5
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- Article
Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 914, doi. 10.1007/s11664-020-08698-3
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- Article
Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 855, doi. 10.1007/s11664-020-08641-6
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- Article
Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 217, doi. 10.1007/s11664-020-08504-0
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- Article