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Improving the Uniform Distribution of Nano-Ag in Al-Doped ZnO Film to Enhance Its Application in Soft Touch Sensing Electrodes.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 12, p. 7907, doi. 10.1007/s11664-023-10704-3
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- Article
Reduced Threading Dislocation Density in a Ge Epitaxial Film on a Submicron-Patterned Si Substrate Grown by Chemical Vapor Deposition.
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- Journal of Electronic Materials, 2023, v. 52, n. 8, p. 5059, doi. 10.1007/s11664-023-10302-3
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- Article
Influence of Dry and Wet Etching on AlInSb Contact Resistivity, Transfer Length, and Sheet Resistance Using Circular Transmission Model.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2718, doi. 10.1007/s11664-023-10234-y
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- Article
Microwave Plasma Etching Treatment for Single Crystal Diamond.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4995, doi. 10.1007/s11664-022-09735-z
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- Article
Dry Etching Damage and Alloy Composition Analysis of GaN-Based Semiconductors Using Electron Energy-Loss Spectroscopy.
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- Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4230, doi. 10.1007/s11664-021-08946-0
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- Article
Characterization of As-Grown and Regrown GaN-on-GaN Structures for Vertical p-n Power Devices.
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- Journal of Electronic Materials, 2021, v. 50, n. 5, p. 2637, doi. 10.1007/s11664-021-08769-z
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- Article
Analysis by HR-STEM of the Strain Generation in InP after SiNx Deposition and ICP Etching.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5226, doi. 10.1007/s11664-020-08312-6
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- Article
Removal of Dry-Etch-Induced Surface Layer Damage from p-GaN by Photoelectrochemical Etching.
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- Journal of Electronic Materials, 2020, v. 49, n. 6, p. 3481, doi. 10.1007/s11664-020-07986-2
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- Article
Towards Long‐Term Photostability of Nickel Hydroxide/BiVO<sub>4</sub> Photoanodes for Oxygen Evolution Catalysts via In Situ Catalyst Tuning.
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- Angewandte Chemie, 2020, v. 132, n. 15, p. 6272, doi. 10.1002/ange.201915671
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- Article
Influence of the Chemical Composition and Topography of the Ti6Al7Nb Surface Etched in Fluorine Plasma on Its Selected Properties.
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- Advanced Engineering Materials, 2023, v. 25, n. 19, p. 1, doi. 10.1002/adem.202300507
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- Article
Dielectric Metalens by Multilayer Nanoimprint Lithography and Solution Phase Epitaxy.
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- Advanced Engineering Materials, 2023, v. 25, n. 16, p. 1, doi. 10.1002/adem.202201824
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- Article
Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass.
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- Advanced Engineering Materials, 2021, v. 23, n. 6, p. 1, doi. 10.1002/adem.202001336
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- Article
Low Cost and High‐Aspect Ratio Micro/Nano Device Fabrication by Using Innovative Metal‐Assisted Chemical Etching Method.
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- Advanced Engineering Materials, 2019, v. 21, n. 8, p. N.PAG, doi. 10.1002/adem.201900490
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- Article
Run-to-run process control of a plasma etch process with neural network modelling.
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- Quality & Reliability Engineering International, 1998, v. 14, n. 4, p. 247, doi. 10.1002/(SICI)1099-1638(199807/08)14:4<247::AID-QRE188>3.0.CO;2-V
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- Article
Morphology and mechanical properties of polypropylene micro-arrays by micro-injection molding.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 40, n. 5/6, p. 490, doi. 10.1007/s00170-007-1364-6
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- Article
Microembossed copper microchannel heat sink for high-density cooling in electronics.
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- Micro & Nano Letters (Wiley-Blackwell), 2019, v. 14, n. 12, p. 1258, doi. 10.1049/mnl.2019.0198
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- Article
Metal-assisted chemical etching for realisation of deep silicon microstructures.
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- Micro & Nano Letters (Wiley-Blackwell), 2019, v. 14, n. 10, p. 1083, doi. 10.1049/mnl.2019.0113
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- Article
Inductively coupled CH<sub>4</sub>/H<sub>2</sub> plasma etching process for mesa delineation of InAs/GaSb type-II superlattice pixels.
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- Micro & Nano Letters (Wiley-Blackwell), 2019, v. 14, n. 7, p. 753, doi. 10.1049/mnl.2018.5549
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- Article
Vacuum-free photolithographic patterning of conducting polymer film.
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- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 12, p. 807, doi. 10.1049/mnl.2016.0479
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- Article
Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer.
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- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 619, doi. 10.1049/mnl.2016.0267
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- Article
Development of thin quartz glass utilising through-glass-via (TGV) formation by dry etching technology.
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- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 568, doi. 10.1049/mnl.2016.0242
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- Article
Controlling Vertical Asymmetry of Nanocrystals Through Anisotropic Etching‐Assisted Nanosphere Lithography.
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- Small Structures, 2024, v. 5, n. 3, p. 1, doi. 10.1002/sstr.202300300
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- Article
In Situ Reconnection of Nanoelectrodes Over 20 nm Gaps on Polyimide Substrate.
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- Small Structures, 2024, v. 5, n. 2, p. 1, doi. 10.1002/sstr.202300283
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- Article
In Situ Reconnection of Nanoelectrodes Over 20 nm Gaps on Polyimide Substrate.
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- Small Structures, 2024, v. 5, n. 2, p. 1, doi. 10.1002/sstr.202300283
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- Article
微热辅助低温等离子体杀菌技术对榨菜贮藏期品质劣变的影响.
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- China Brewing, 2023, v. 42, n. 2, p. 151, doi. 10.11882/j.issn.0254-5071.2023.02.025
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- Article
Towards practical quantum computers: transmon qubit with a lifetime approaching 0.5 milliseconds.
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- NPJ Quantum Information, 2022, v. 8, n. 1, p. 1, doi. 10.1038/s41534-021-00510-2
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- Article
Preliminary simulation of Magnetron sputtering using Pegasus software.
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- Electrotechnica & Electronica (E+E), 2018, v. 53, n. 7/8, p. 181
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- Article
基于电感耦合等离子体刻蚀的 LNOI脊形微结构制备.
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- Piezoelectrics & Acoustooptics, 2023, v. 45, n. 2, p. 239, doi. 10.11977/j.issn.1004-2474.2023.02.01
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- Article
基于电感耦合等离子体刻蚀的LNOI脊形微结构制备.
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- Piezoelectrics & Acoustooptics, 2023, v. 45, n. 2, p. 239, doi. 10.11977/j.issn.1004-2474.2023.02.014
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- Article
„DIE VORNEHMSTEN PLÄTZE UND GEBÄUDE, DIE IN DANZIG ZU SEHEN SIND". AEGIDIUS DICKMANS ANSICHTEN VON DANZIG 1617.
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- Baltic Journal of Art History, 2020, v. 20, p. 81, doi. 10.12697/BJAH.2020.20.03
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- Article
Effect of Etching Methods on Dielectric Losses in Transmons.
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- JETP Letters, 2024, v. 120, n. 4, p. 298, doi. 10.1134/S0021364024602410
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- Article
Influence of the Finite-Size Effect on the Cluster Ion Emission of Silicon Nanostructures.
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- JETP Letters, 2020, v. 111, n. 8, p. 467, doi. 10.1134/S0021364020080123
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- Article
A study of heterogeneous recombination of chlorine atoms on aluminum and copper surfaces in glow discharge plasma.
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- High Energy Chemistry, 2017, v. 51, n. 4, p. 292, doi. 10.1134/S0018143917040130
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- Article
General features of interaction between copper and chlorine-containing gases.
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- High Energy Chemistry, 2017, v. 51, n. 3, p. 224, doi. 10.1134/S0018143917030031
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- Article
Kinetic features of plasma etching of polycarbonate in oxygen plasma.
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- High Energy Chemistry, 2017, v. 51, n. 3, p. 229, doi. 10.1134/S0018143917030134
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- Article
Plasma etching: From micro- to nanoelectronics.
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- High Energy Chemistry, 2009, v. 43, n. 3, p. 204, doi. 10.1134/S0018143909030084
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- Article
Low-temperature plasma surface modification of textiles made from natural fibers and advanced technologies.
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- High Energy Chemistry, 2009, v. 43, n. 3, p. 234, doi. 10.1134/S0018143909030138
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- Article
Diagnostics of plasma processes in micro- and nanoelectronics.
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- High Energy Chemistry, 2009, v. 43, n. 3, p. 196, doi. 10.1134/S0018143909030072
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- Article
The use of low-temperature plasmas in wool finishing.
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- High Energy Chemistry, 2006, v. 40, n. 2, p. 57, doi. 10.1134/S0018143906020019
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- Article
P-65: Study on Resin as Passivation Layer of Retina Display for Mobile Phone Screen.
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- SID Symposium Digest of Technical Papers, 2014, v. 45, n. 1, p. 1222, doi. 10.1002/j.2168-0159.2014.tb00319.x
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- Article
Variable Liquid Crystal Pretilt Angle using Nano-Alignment Surfaces.
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- SID Symposium Digest of Technical Papers, 2012, v. 43, n. 1, p. 289, doi. 10.1002/j.2168-0159.2012.tb05771.x
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- Article
Fluorinated Compounds Emission Reduction Activity of WLICC (World LCD Industry Cooperation Committee).
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- SID Symposium Digest of Technical Papers, 2012, v. 43, n. 1, p. 838, doi. 10.1002/j.2168-0159.2012.tb05916.x
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- Article
A Thorough Review of Emerging Technologies in Micro- and Nanochannel Fabrication: Limitations, Applications, and Comparison.
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- Micromachines, 2024, v. 15, n. 10, p. 1274, doi. 10.3390/mi15101274
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- Article
The Synthesis and Assembly Mechanism of Micro/Nano-Sized Polystyrene Spheres and Their Application in Subwavelength Structures.
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- Micromachines, 2024, v. 15, n. 7, p. 841, doi. 10.3390/mi15070841
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- Article
Fabrication of Bulk Tungsten Microstructure Arrays for Hydrophobic Metallic Surfaces Using Inductively Coupled Plasma Deep Etching.
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- Micromachines, 2024, v. 15, n. 6, p. 807, doi. 10.3390/mi15060807
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- Article
A Study on the Surface Quality and Damage Properties of Single-Crystal Silicon Using Different Post-Treatment Processes.
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- Micromachines, 2024, v. 15, n. 1, p. 145, doi. 10.3390/mi15010145
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- Article
Editorial for the Special Issue on Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication.
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- 2023
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- Publication type:
- Editorial
Surface Modification of Silicon Carbide Wafers Using Atmospheric Plasma Etching: Effects of Processing Parameters.
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- Micromachines, 2023, v. 14, n. 7, p. 1331, doi. 10.3390/mi14071331
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- Article
Design and Manufacture of Polarization-Independent 3D SOI Vertical Optical Coupler.
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- Micromachines, 2023, v. 14, n. 6, p. 1268, doi. 10.3390/mi14061268
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- Article
Study of Atmospheric Pressure Plasma Temperature Based on Silicon Carbide Etching.
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- Micromachines, 2023, v. 14, n. 5, p. 992, doi. 10.3390/mi14050992
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- Article