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Sticking in Shaft Furnace and Fluidized Bed Ironmaking Processes: A Comprehensive Review Focusing on the Effect of Coating Materials.
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- Metallurgical & Materials Transactions. Part B, 2024, v. 55, n. 5, p. 2977, doi. 10.1007/s11663-024-03188-x
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- Article
Thermal Stability Enhancement in Epitaxial Alpha Tin Films by Strain Engineering.
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- Advanced Engineering Materials, 2019, v. 21, n. 10, p. N.PAG, doi. 10.1002/adem.201900410
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- Article
Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9584, doi. 10.1007/s10854-016-5012-5
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- Article
Tin whisker growth on electroplated Sn multilayers.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6411, doi. 10.1007/s10854-015-3230-x
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- Article
Thermodynamic reaction mechanism of the intermetallic compounds of SnNd and GaNd in soldered joint of Sn-9Zn-1Ga-0.5Nd.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 3064, doi. 10.1007/s10854-015-2798-5
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- Article
Preparation and dielectric properties of SiN/SiCw composite ceramic.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 4088, doi. 10.1007/s10854-014-2133-6
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- Publication type:
- Article
Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn, SnBi and Au/Ni coatings.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3520, doi. 10.1007/s10854-014-2049-1
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- Article
Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2671, doi. 10.1007/s10854-014-1927-x
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- Article
Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1222, doi. 10.1007/s10854-014-1713-9
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- Article
Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1685, doi. 10.1007/s10854-011-0346-5
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- Publication type:
- Article
Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6
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- Publication type:
- Article
Whisker nucleation in indentation residual stress field on tin plated component leads.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 599, doi. 10.1007/s10854-007-9153-4
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- Publication type:
- Article
Study of the optimum conditions of whisker growth by the novel ICVI process.
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- Journal of Materials Science Letters, 2003, v. 22, n. 16, p. 1161, doi. 10.1023/A:1025135313312
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- Article
In situ synthesized (TiB + Y<sub>2</sub>O<sub>3</sub>)/Ti composites.
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- Journal of Materials Science Letters, 2003, v. 22, n. 12, p. 877, doi. 10.1023/A:1024458602464
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- Publication type:
- Article
Synthesis and mechanical properties of 40 wt%BAS/Si<sub>3</sub>N<sub>4</sub> ceramic composites.
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- Journal of Materials Science Letters, 2003, v. 22, n. 12, p. 895, doi. 10.1023/A:1024479107007
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- Publication type:
- Article
Blue emission from <100> oriented Y<sub>2</sub>O<sub>3</sub>:Tm whiskers.
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- Journal of Materials Science Letters, 2003, v. 22, n. 9, p. 659, doi. 10.1023/A:1023606725195
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- Publication type:
- Article
WHISKER-LIKE FORMATIONS IN Sn-3.0Ag-Pb ALLOYS.
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- Archives of Metallurgy & Materials, 2017, v. 62, n. 2, p. 1027, doi. 10.1515/amm-2017-0147
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- Publication type:
- Article
Whisker Formation On Galvanic Tin Surface Layer.
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- Archives of Metallurgy & Materials, 2015, v. 60, n. 2, p. 1341, doi. 10.1515/amm-2015-0127
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- Publication type:
- Article
PROPERTIES OF CHITIN REINFORCES COMPOSITES: A REVIEW.
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- Nigerian Journal of Technology, 2017, v. 36, n. 1, p. 57, doi. 10.4314/njt.v36i1.9
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- Publication type:
- Article
Superconductivity and weak localization of Pd<sub>x</sub>Bi<sub>2</sub>Se<sub>3</sub> whiskers at low temperatures.
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- Applied Nanoscience, 2018, v. 8, n. 4, p. 877, doi. 10.1007/s13204-018-0671-6
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- Publication type:
- Article
Current‐Dependent Lithium Metal Growth Modes in "Anode‐Free" Solid‐State Batteries at the Cu|LLZO Interface.
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- Advanced Energy Materials, 2023, v. 13, n. 1, p. 1, doi. 10.1002/aenm.202203174
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- Publication type:
- Article
Linking the Defects to the Formation and Growth of Li Dendrite in All‐Solid‐State Batteries.
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- Advanced Energy Materials, 2021, v. 11, n. 42, p. 1, doi. 10.1002/aenm.202102148
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- Publication type:
- Article
CVD Whiskerization Treatment Process for the Enhancement of Carbon Fiber Composite Flexural Strength.
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- Pertanika Journal of Science & Technology, 2008, v. 16, n. 1, p. 73
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- Publication type:
- Article
Magnetostrictive Bioinspired Whisker Sensor Based on Galfenol Composite Cantilever Beam Realizing Bidirectional Tactile Perception.
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- Applied Bionics & Biomechanics, 2018, p. 1, doi. 10.1155/2018/4250541
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- Article
Merelaniite Inclusions in Tanzanite.
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- Gems & Gemology, 2018, v. 54, n. 2, p. 226
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- Article
Facile Synthesis of Electroconductive AZO@TiO<sub>2</sub> Whiskers and Their Application in Textiles.
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- Journal of Nanomaterials, 2016, p. 1, doi. 10.1155/2016/5940618
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- Publication type:
- Article
Reduction Swelling Mechanism for Different Types of Pellets Based on Continuous Imaging Analysis.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 5, p. 2010, doi. 10.1007/s11837-021-05074-2
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- Publication type:
- Article
Research on Hot Compressive Deformation of TiBw/TA15 Composite Cylindrical Billet with Network-Distributed Reinforcements.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2017, v. 69, n. 10, p. 1830, doi. 10.1007/s11837-017-2477-5
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- Article
Measuring the Stress Dependence of Nucleation and Growth Processes in Sn Whisker Formation.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2015, v. 67, n. 10, p. 2416, doi. 10.1007/s11837-015-1557-7
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- Article
In Situ Synthesis Aluminum Borate Whiskers Reinforced TiB Matrix Composites for Application in Aluminum Reduction Cells.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2013, v. 65, n. 11, p. 1467, doi. 10.1007/s11837-013-0710-4
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- Article
Topics in Lead-Free Solders: Restriction of Hazardous Substances Recast (RoHS2).
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- 2013
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- Publication type:
- Editorial
A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2013, v. 65, n. 10, p. 1350, doi. 10.1007/s11837-013-0717-x
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- Article
Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2012, v. 64, n. 10, p. 1176, doi. 10.1007/s11837-012-0442-x
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- Article
Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2012, v. 64, n. 10, p. 1174, doi. 10.1007/s11837-012-0443-9
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- Publication type:
- Article
Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 62, doi. 10.1007/s11837-011-0178-z
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- Article
Lead-free solders: Reliability, an ongoing saga.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 56, doi. 10.1007/s11837-011-0176-1
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- Publication type:
- Article
Real-time SEM/FIB studies of whisker growth and surface modification.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 7, p. 30, doi. 10.1007/s11837-010-0105-8
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- Publication type:
- Article
High-Temperature Deformation Behavior of Ti-TiB<sub>w</sub> In-Situ Metal-Matrix Composites.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2004, v. 56, n. 5, p. 51, doi. 10.1007/s11837-004-0129-z
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- Publication type:
- Article
Effect of ZnO coating of whiskers on thermal expansion properties of aluminium borate whisker reinforced aluminium composites.
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- Materials Science & Technology, 2009, v. 25, n. 8, p. 1035, doi. 10.1179/174328408X302440
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- Publication type:
- Article
Microstructural characterisation of in situ TiB/Ti matrix composites prepared by mechanical alloying and hot pressing.
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- Materials Science & Technology, 2004, v. 20, n. 9, p. 1205, doi. 10.1179/026708304225012198
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- Publication type:
- Article
Precipitation method to prepare conductive F-doped SnO<sub>2</sub>-coated rutile TiO<sub>2</sub> whisker and its application in coating.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20583, doi. 10.1007/s10854-021-06569-z
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- Publication type:
- Article
Interface energy-driven indium whisker growth on ceramic substrates.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16881, doi. 10.1007/s10854-021-06250-5
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- Publication type:
- Article
Tin whisker growth on immiscible Al–Sn alloy.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1328, doi. 10.1007/s10854-019-02646-6
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- Publication type:
- Article
The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6
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- Publication type:
- Article
Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu low-Ag solder for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 14, p. 10230, doi. 10.1007/s10854-017-6790-0
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- Publication type:
- Article
Spontaneous Sn whisker formation on TiSnC.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 8, p. 5788, doi. 10.1007/s10854-016-6249-8
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- Publication type:
- Article
Morphological and performance characteristics of nanocomposite films based on poly(lactic acid) compounded with nanocrystalline cellulose and chitin whiskers using melt extrusion.
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- Cellulose, 2020, v. 27, n. 13, p. 7523, doi. 10.1007/s10570-020-03197-4
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- Article
Invited Contribution: A New Sr(II) Ion-imprinted Polymer Grafted onto Potassium Titanate Whiskers: Synthesis and Adsorption Performance for the Selective Separation of Strontium Ions.
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- Adsorption Science & Technology, 2010, v. 28, n. 1, p. 23, doi. 10.1260/0263-6174.28.1.23
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- Publication type:
- Article
Dependence of Tin Whisker Growth on Copper and Oxygen Content on the Surface of Tin-Rich Lead Free Alloys.
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- Acta Physica Polonica: A, 2013, v. 123, n. 2, p. 430, doi. 10.12693/APhysPolA.123.430
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- Publication type:
- Article
CORROSION FATIGUE FRACTURE BEHAVIOUR OF A SiC WHISKER–ALUMINIUM MATRIX COMPOSITE UNDER COMBINED TENSION–TORSION LOADING.
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- Fatigue & Fracture of Engineering Materials & Structures, 1998, v. 21, n. 12, p. 1435, doi. 10.1046/j.1460-2695.1998.00127.x
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- Publication type:
- Article