Found: 724
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Enhanced Thermal Conductivity of EP Composites by Introducing BN-Al<sub>2</sub>O<sub>3</sub> Hybrid.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6403, doi. 10.1007/s11664-024-11285-5
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- Article
Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.
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- Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8
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- Article
Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration.
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- Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4410, doi. 10.1007/s11664-024-11107-8
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- Article
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z
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- Article
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2703, doi. 10.1007/s11664-024-10970-9
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- Article
The Effects of Core–Shell-Structured SiO<sub>2</sub>@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1272, doi. 10.1007/s11664-023-10864-2
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- Article
In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1239, doi. 10.1007/s11664-023-10847-3
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- Article
Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 228, doi. 10.1007/s11664-023-10763-6
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- Article
Study of the Rapid Determination of Phosphorus in Electronic Packaging Material by Phosphorus-Molybdenum Yellow Spectrophotometry.
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- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7590, doi. 10.1007/s11664-023-10689-z
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- Article
Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling.
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- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7512, doi. 10.1007/s11664-023-10660-y
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- Article
Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3903, doi. 10.1007/s11664-023-10358-1
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- Article
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x
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- Article
Improved Heat Resistance and Electrical Properties of Epoxy Resins by Introduction of Bismaleimide.
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- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 1865, doi. 10.1007/s11664-022-10017-x
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- Article
Hybrid Solder Joint for Low-Temperature Bonding Application.
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- Journal of Electronic Materials, 2023, v. 52, n. 2, p. 782, doi. 10.1007/s11664-022-10111-0
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- Article
Preventing Void Growth Between Ni<sub>3</sub>Sn<sub>4</sub> and Solder.
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- Journal of Electronic Materials, 2022, v. 51, n. 11, p. 6333, doi. 10.1007/s11664-022-09853-8
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- Article
Microstructure, Tensile Mechanical Properties and Electrical Fatigue Mechanism of a Microalloyed Copper Wire.
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- Journal of Electronic Materials, 2022, v. 51, n. 10, p. 5857, doi. 10.1007/s11664-022-09835-w
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- Article
Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6575, doi. 10.1007/s11664-021-09253-4
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- Article
Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6597, doi. 10.1007/s11664-021-09221-y
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- Article
Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications.
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- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4433, doi. 10.1007/s11664-021-08968-8
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- Article
Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 881, doi. 10.1007/s11664-020-08709-3
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- Publication type:
- Article
Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 217, doi. 10.1007/s11664-020-08504-0
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- Article
Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver.
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- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 5994, doi. 10.1007/s11664-020-08325-1
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- Article
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 212, doi. 10.1007/s11664-019-07681-x
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- Article
A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications.
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- Journal of Electronic Materials, 2019, v. 48, n. 12, p. 7623, doi. 10.1007/s11664-019-07623-7
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- Article
Effect of Sb Additions on the Creep Behaviour of Bi Containing SAC Alloys.
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- Journal of Electronic Materials, 2019, v. 48, n. 9, p. 5562, doi. 10.1007/s11664-019-07410-4
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- Article
Trailer dash [packaging].
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- Electronics Systems & Software, 2006, v. 4, n. 4, p. 12, doi. 10.1049/ess:20060402
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- Article
autodE: Automated Calculation of Reaction Energy Profiles— Application to Organic and Organometallic Reactions.
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- Angewandte Chemie, 2021, v. 133, n. 8, p. 4312, doi. 10.1002/ange.202011941
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- Article
Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging.
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- Advanced Engineering Materials, 2024, v. 26, n. 12, p. 1, doi. 10.1002/adem.202400304
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- Article
Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism.
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- Advanced Engineering Materials, 2024, v. 26, n. 1, p. 1, doi. 10.1002/adem.202301204
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- Article
Investigation of the Long‐Term Storage Stability of Shape Memory Epoxy Prepolymer.
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- Advanced Engineering Materials, 2022, v. 24, n. 4, p. 1, doi. 10.1002/adem.202101023
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- Publication type:
- Article
Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐Printed Substrate.
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- Advanced Engineering Materials, 2021, v. 23, n. 1, p. 1, doi. 10.1002/adem.202000688
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- Article
Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy.
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- Advanced Engineering Materials, 2020, v. 22, n. 12, p. 1, doi. 10.1002/adem.202000179
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- Article
Epoxy‐Based Ceramic‐Polymer Composite with Excellent Millimeter‐Wave Broadband Absorption Properties by Facile Approach.
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- Advanced Engineering Materials, 2019, v. 21, n. 12, p. N.PAG, doi. 10.1002/adem.201900981
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- Article
Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging.
- Published in:
- Advanced Engineering Materials, 2018, v. 20, n. 1, p. 1, doi. 10.1002/adem.201700524
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- Publication type:
- Article
In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging.
- Published in:
- Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 10, p. 5667, doi. 10.1007/s10973-021-10941-w
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- Article
Moisture absorption and diffusion in an underfill encapsulant at T > T and T < T.
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- Journal of Thermal Analysis & Calorimetry, 2013, v. 113, n. 2, p. 461, doi. 10.1007/s10973-013-3074-7
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- Article
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
- Published in:
- Quality & Reliability Engineering International, 2015, v. 31, n. 4, p. 543, doi. 10.1002/qre.1611
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- Article
Comments on the IPC Surface Mount Attachment Reliability Guidelines.
- Published in:
- Quality & Reliability Engineering International, 2005, v. 21, n. 4, p. 345, doi. 10.1002/qre.667
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- Article
International Calendar of Forthcoming Events.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 6, p. 460, doi. 10.1002/qre.4680110611
- Publication type:
- Article
ESD Association ESD Handbook Available.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 6, p. 458
- Publication type:
- Article
CALCE News.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 3, p. 216
- Publication type:
- Article
CALCE Electronic Packaging Research Center.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 3, p. 216
- Publication type:
- Article
Reports from DELTA.
- Published in:
- Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 244
- Publication type:
- Article
Electro-Optics Physics of Failure Project.
- Published in:
- Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 247
- Publication type:
- Article
Materials Database Available.
- Published in:
- Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 525
- Publication type:
- Article
CALCE Electronic Packaging Center Completes Banner Year.
- Published in:
- Quality & Reliability Engineering International, 1993, v. 9, n. 3, p. 229
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- Article
Physics-of-Failure Reliability Programme.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 6, p. 568
- Publication type:
- Article
HUMIDITY ACCELERATION FACTOR FOR PLASTIC PACKAGED ELECTRONIC DEVICES.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 5, p. 365, doi. 10.1002/qre.4680070505
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- Article
Update on the CALCE Center for Electronic Packaging.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 189
- Publication type:
- Article
Electronic Packaging Reliability Assessment.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 1, p. 50
- Publication type:
- Article