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Hierarchical zero- and one-dimensional topological states in symmetry-controllable grain boundary.
- Published in:
- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-53315-0
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Influence Mechanisms of Cold Rolling Reduction Rate on Microstructure, Texture and Magnetic Properties of Non-Oriented Silicon Steel.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 853, doi. 10.3390/cryst14100853
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- Article
Effect of Primary γ′ Phase on High-Temperature Endurance Performance of GH4720Li Superalloy.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 851, doi. 10.3390/cryst14100851
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- Article
Influence of Heat Treatment on Microstructure and Mechanical Properties of Laser Cladding Coatings.
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- Coatings (2079-6412), 2024, v. 14, n. 10, p. 1251, doi. 10.3390/coatings14101251
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- Article
Near-theoretical strength and deformation stabilization achieved via grain boundary segregation and nano-clustering of solutes.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-53349-4
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Nd Isotopic Equilibration During Channelized Melt Transport Through the Lithosphere: A Feasibility Study Using Idealized Numerical Models.
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- Geochemistry, Geophysics, Geosystems: G3, 2024, v. 25, n. 10, p. 1, doi. 10.1029/2024GC011593
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- Article
Phase Composition and Microwave Dielectric Properties of Li<sub>2(1+x)</sub>Mg<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub> Ceramics with Inverse Spinel Structure.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6553, doi. 10.1007/s11664-024-11319-y
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Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm.
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- Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4421, doi. 10.1007/s11664-024-11138-1
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- Article
The Effect of Sintering Temperature on the Microstructure and Electrical Properties of ZnO–Bi<sub>2</sub>O<sub>3</sub> Varistor Ceramics.
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- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3994, doi. 10.1007/s11664-024-11135-4
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Investigation of Filament Formation and Surface Perturbation in Nanoscale-Y<sub>2</sub>O<sub>3</sub> Memristor: A Physical Modeling Approach.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2965, doi. 10.1007/s11664-024-10967-4
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- Article
Dielectric Properties and Magnetodielectric Effect of Co<sub>1−x</sub>Cr<sub>x</sub>Fe<sub>2</sub>O<sub>4</sub>.
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- Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2287, doi. 10.1007/s11664-024-10964-7
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- Article
Improvement of Magnetocaloric Effects and Study of Magneto-Transport Behavior of Lanthanum Strontium Manganites by Grain Boundary Management via Additives.
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- Journal of Electronic Materials, 2023, v. 52, n. 12, p. 8250, doi. 10.1007/s11664-023-10748-5
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- Article
Effect of Grain Size on Resistivity and Voltage-Dependent Dynamic Conductance in Nano-crystalline Nd0.6Sr0.4CoO3.
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- Journal of Electronic Materials, 2023, v. 52, n. 12, p. 8263, doi. 10.1007/s11664-023-10751-w
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- Article
Molybdenum Concentration-Induced Texture and Grain Boundary Engineering of Electrodeposited Tin-Molybdenum Coatings for Enhanced Corrosion Resistance.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3797, doi. 10.1007/s11664-023-10352-7
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- Article
A Novel Data-Driven Emulator for Predicting Electromigration-Mediated Damage in Polycrystalline Interconnects.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2746, doi. 10.1007/s11664-023-10237-9
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- Article
Impedance and Electrical Properties of Nd<sub>x</sub>Gd<sub>y</sub>Ce<sub>1−(x+y)</sub>O<sub>2−δ</sub>.
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- Journal of Electronic Materials, 2022, v. 51, n. 10, p. 5704, doi. 10.1007/s11664-022-09847-6
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- Article
Role of Deep Defects on the Transport Properties of Polycrystalline Thermoelectric Alloys and Composites.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4816, doi. 10.1007/s11664-022-09748-8
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- Article
Grain Size Dependence of the Thermoelectric Performance in Cu<sub>2.98</sub>Co<sub>0.02</sub>SbSe<sub>4</sub>.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4846, doi. 10.1007/s11664-022-09718-0
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Synthesis and Characterization of Sr<sub>0.85</sub>Pb<sub>0.15</sub>Mn<sub>1−x</sub>Sn<sub>x</sub>O<sub>3</sub> Perovskite Manganite Nanostructures: Structural, Electrical, and Magnetic Properties.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 5322, doi. 10.1007/s11664-022-09733-1
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A Microwave Dielectric Ceramic with Ultra-low Dielectric Constant Prepared by Reaction Sintering Method.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 5026, doi. 10.1007/s11664-022-09630-7
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ALD-Assisted Graphene Functionalization for Advanced Applications.
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- Journal of Electronic Materials, 2022, v. 51, n. 6, p. 2766, doi. 10.1007/s11664-021-09266-z
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- Article
Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes.
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- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2433, doi. 10.1007/s11664-022-09503-z
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- Article
Enhanced Thermoelectric Performance of p-Type Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> Nanocomposites Through Nanoflower Morphology.
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- Journal of Electronic Materials, 2022, v. 51, n. 2, p. 508, doi. 10.1007/s11664-021-09312-w
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- Article
NH<sub>3</sub><sup>+</sup>-Functionalized PAMAM Dendrimers Enhancing Power Conversion Efficiency and Stability of Perovskite Solar Cells.
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- Journal of Electronic Materials, 2021, v. 50, n. 11, p. 6414, doi. 10.1007/s11664-021-09169-z
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- Article
Dielectric Properties and DC Bias Characteristics of BaTi<sub>1-m</sub>Zr<sub>m</sub>O<sub>3</sub>-x mol.% MgO-4.5 mol.% Gd<sub>2</sub>O<sub>3</sub>-2 mol.% SiO<sub>2</sub> Ceramics.
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- Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5946, doi. 10.1007/s11664-021-09103-3
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- Article
Enhanced Thermoelectric Properties of Graphene/Cu3SbSe4 Composites.
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- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4880, doi. 10.1007/s11664-021-09030-3
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- Article
Effect of Sr Doping on Nonlinear Current–Voltage Properties of ZnO-Based Ceramics.
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- Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4096, doi. 10.1007/s11664-021-08960-2
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- Article
Effects of Dy2O3 on the Electrical Properties of a (Nb2O5-Dy2O3-SiO2) Co-doped TiO2 Varistor.
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- Journal of Electronic Materials, 2021, v. 50, n. 4, p. 1963, doi. 10.1007/s11664-020-08727-1
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Surface Morphology and Sputtering Mechanism of Etched Areas of a Metallic Target by Magnetron Sputtering.
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- Journal of Electronic Materials, 2021, v. 50, n. 4, p. 2409, doi. 10.1007/s11664-020-08726-2
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- Article
Dielectric Relaxation Mechanism in High-Pressure Synthesized BiCr0.5Mn0.5O3.
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- Journal of Electronic Materials, 2021, v. 50, n. 4, p. 1615, doi. 10.1007/s11664-020-08408-z
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- Article
Electrical Activity of Crystal Defects in Multicrystalline Si.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5091, doi. 10.1007/s11664-020-08119-5
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- Article
Investigation of the Effects of CaO Doping on the Microstructure and Electrical Properties of ZnO-Based Linear Resistance Ceramics.
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- Journal of Electronic Materials, 2020, v. 49, n. 8, p. 4864, doi. 10.1007/s11664-020-08209-4
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- Article
Effect of Minor Addition of Ni on the Microstructure and Properties of Zn-Based High-Temperature Solder.
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- Journal of Electronic Materials, 2020, v. 49, n. 6, p. 3990, doi. 10.1007/s11664-020-08089-8
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- Article
On the Threshold Voltage and Performance of ZnO-Based Thin-Film Transistors with a ZrO2 Gate Dielectric.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3156, doi. 10.1007/s11664-020-08055-4
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- Article
Tm3+ Modifying Er3+ Red Emission and Dielectric Properties of Tm3+-Doped LaErO3 Perovskite.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3096, doi. 10.1007/s11664-020-08052-7
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- Article
Preparation and Thermoelectric Performance of BaTiO3/Bi0.5Sb1.5Te3 Composite Materials.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2794, doi. 10.1007/s11664-019-07851-x
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- Article
Effect of Structural Water on the Dielectric Properties of Hydrated Tungsten Trioxide.
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- Journal of Electronic Materials, 2020, v. 49, n. 4, p. 2556, doi. 10.1007/s11664-020-07948-8
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- Article
Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces.
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- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1512, doi. 10.1007/s11664-019-07838-8
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Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 888, doi. 10.1007/s11664-019-07797-0
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- Article
Complex Dielectric, Impedance, and Electric Modulus of CuMn2O4.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 842, doi. 10.1007/s11664-019-07698-2
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- Article
Influence of Microstructure Length Scale on the Tensile Properties and Superplasticity of Cu-Doped Sn-34Bi TIM Alloy.
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- Journal of Electronic Materials, 2019, v. 48, n. 12, p. 7662, doi. 10.1007/s11664-019-07586-9
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- Article
Comparative Study of Thin-Film-Based Planar and Vertical Devices Towards Isopropyl Alcohol Sensing.
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- Journal of Electronic Materials, 2019, v. 48, n. 11, p. 7292, doi. 10.1007/s11664-019-07554-3
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- Article
Enhancing the Ferroelectric Coupling of Multifunctional Spinel–Perovskite Composite.
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- Journal of Electronic Materials, 2019, v. 48, n. 10, p. 6460, doi. 10.1007/s11664-019-07434-w
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- Article
Hermetic Sealant Material Possibilities for IR Sensor Packaging.
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- Journal of Electronic Materials, 2019, v. 48, n. 10, p. 6470, doi. 10.1007/s11664-019-07427-9
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- Article
Nonlinear Electrical Properties of ZnO-V<sub>2</sub>O<sub>5</sub> Based Rare Earth (Er<sub>2</sub>O<sub>3</sub>) Added Varistors.
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- Journal of Electronic Materials, 2019, v. 48, n. 9, p. 5650, doi. 10.1007/s11664-019-07394-1
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- Article
Phase Evolution, Microstructure, Conductivity Behavior and Microwave Dielectric Properties of Li<sub>2</sub>O-2MgO-Al<sub>2</sub>O<sub>3</sub>-6MoO<sub>3</sub> Ceramics.
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- Journal of Electronic Materials, 2019, v. 48, n. 9, p. 5672, doi. 10.1007/s11664-019-07382-5
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- Article
High Permittivity, Low Dielectric Loss and Impedance Characteristics of Li<sub>0.5</sub>La<sub>0.5</sub>Cu<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub> Ceramics by a Sol–Gel Technique.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 5333, doi. 10.1007/s11664-019-07344-x
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- Article
Improved Microwave Dielectric Properties of LiNb<sub>0.6</sub>Ti<sub>0.5</sub>O<sub>3</sub> Ceramics with Zr Substitutions.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 5080, doi. 10.1007/s11664-019-07314-3
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- Article
Rashba Interaction in Polysilicon Layers SemOI-Structures.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 4934, doi. 10.1007/s11664-019-07290-8
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- Article
Elimination of Grain Boundary Defects in Zeolitic Imidazolate Framework ZIF‐95 Membrane via Solvent‐Free Secondary Growth.
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- Angewandte Chemie, 2021, v. 133, n. 48, p. 25667, doi. 10.1002/ange.202110828
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- Article