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A comprehensive review of radiation effects on solder alloys and solder joints.
- Published in:
- Defence Technology, 2024, v. 39, p. 86, doi. 10.1016/j.dt.2024.02.007
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- Article
The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 26, p. 1, doi. 10.1007/s10854-024-13421-7
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- Article
Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z
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- Article
Effect of Sn Orientation on Electromigration Failure in CuSn Solders.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8
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- Article
Dry Sliding Friction and Wear Characteristics of Cu-Sn Alloy Containing Molybdenum Disulfide.
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- Tribology & Lubrication Technology, 2013, v. 69, n. 9, p. 54
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- Article
Impact of multiple reflow on intermetallic compound of nickel‐doped tin‐silver‐copper on ENImAg substrate.
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- Materialwissenschaft und Werkstoffechnik, 2020, v. 51, n. 6, p. 780, doi. 10.1002/mawe.201900246
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- Article
Solid solubility extension of copper‐tin immiscible system during mechanical alloying.
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- Materialwissenschaft und Werkstoffechnik, 2018, v. 49, n. 1, p. 54, doi. 10.1002/mawe.201700125
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- Article
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag<sub>3</sub>Sn Phase.
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- Advanced Engineering Materials, 2024, v. 26, n. 13, p. 1, doi. 10.1002/adem.202400660
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- Article
Effects of Ti<sub>2</sub>SnC MAX Phase on Microstructure, Mechanical, Electrical, and Wear Properties of Stir‐Extruded Copper Matrix Composite.
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- Advanced Engineering Materials, 2023, v. 25, n. 9, p. 1, doi. 10.1002/adem.202201463
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- Article
Effect of Al Bronze Interlayer on Liquid-Solid Compound Interface of Sn Bronze/Steel.
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- Advanced Engineering Materials, 2023, v. 25, n. 6, p. 1, doi. 10.1002/adem.202201227
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- Article
Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn-3.5 wt% Ag Solder Alloy.
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- Advanced Engineering Materials, 2023, v. 25, n. 6, p. 1, doi. 10.1002/adem.202201270
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- Article
Effect of SiC Particles Content on Microstructure and Shear Strength of the Al<sub>2</sub>O<sub>3</sub>/Zn5Al−xSiC/2024Al Joint.
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- Advanced Engineering Materials, 2022, v. 24, n. 11, p. 1, doi. 10.1002/adem.202200371
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- Article
A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints.
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- Advanced Engineering Materials, 2022, v. 24, n. 1, p. 1, doi. 10.1002/adem.202100679
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- Article
Microstructure and Properties of SnO<sub>2</sub>‐rGO Reinforced Copper Matrix Composites Fabricated by Molecular‐Level Mixing Method and Spark Plasma Sintering.
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- Advanced Engineering Materials, 2021, v. 23, n. 9, p. 1, doi. 10.1002/adem.202100268
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- Article
Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy.
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- Advanced Engineering Materials, 2020, v. 22, n. 12, p. 1, doi. 10.1002/adem.202000179
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- Article
Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4839, doi. 10.1007/s10854-016-4366-z
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- Article
Low temperature chip on film bonding technology for 20 µm pitch applications.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7
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- Article
Electromigration in reduced-height solder joints with Cu pillars.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3715, doi. 10.1007/s10854-015-4213-7
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- Article
The effect of Cu substrate texture on the intermetallic compounds (IMCs) growth at a Sn3.5Ag-Cu interface.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3854, doi. 10.1007/s10854-015-4233-3
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- Article
Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4313, doi. 10.1007/s10854-015-2984-5
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- Article
Creep failure mechanism and life prediction of lead-free solder joint.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 267, doi. 10.1007/s10854-014-2394-0
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- Article
In situ study on growth behavior of CuSn during solidification with an applied DC in RE-doped Sn-Cu solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4538, doi. 10.1007/s10854-014-2201-y
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- Article
Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2416, doi. 10.1007/s10854-014-1883-5
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- Article
The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1446, doi. 10.1007/s10854-014-1749-x
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- Article
Effect of heat-treatment on the structural and optical properties of CuS thin films deposited by CBD method.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 824, doi. 10.1007/s10854-013-1652-x
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- Article
Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3905, doi. 10.1007/s10854-013-1337-5
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- Article
Suppression of CuSn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 56, doi. 10.1007/s10854-011-0412-z
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- Article
Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 94, doi. 10.1007/s10854-011-0469-8
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- Article
The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1378, doi. 10.1007/s10854-011-0317-x
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- Article
Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 631, doi. 10.1007/s10854-010-0188-6
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- Article
Recent advances on Sn-Cu solders with alloying elements: review.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 565, doi. 10.1007/s10854-011-0291-3
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- Article
A novel method of reducing melting temperatures in SnAg and SnCu solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 281, doi. 10.1007/s10854-010-0128-5
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- Article
Levels and Factors of the Accumulation of Metals and Metalloids in Roadside Soils, Road Dust, and Their PM<sub>10</sub> Fraction in the Western Okrug of Moscow.
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- Eurasian Soil Science, 2022, v. 55, n. 5, p. 556, doi. 10.1134/S1064229322050118
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- Article
Effect of Microwave Hybrid Heating on Mechanical Properties and Microstructure of Sn3.0Ag0.5Cu/Cu Solder Joints.
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- International Journal of Automotive & Mechanical Engineering, 2023, v. 20, n. 3, p. 10736, doi. 10.15282/ijame.20.3.2023.15.0829
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- Article
SN-PD-NI ELECTROPLATING ON BI<sub>2</sub>TE<sub>3</sub>-BASED THERMOELECTRIC ELEMENTS FOR DIRECT THERMOCOMPRESSION BONDING AND CREATION OF A RELIABLE BONDING INTERFACE.
- Published in:
- Archives of Metallurgy & Materials, 2021, v. 66, n. 4, p. 963, doi. 10.24425/amm.2021.136406
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- Article
ASSESSMENT OF THE CHANGE IN THE TIN CONCENTRATION IN BRONZES TO THE BASIC COMPONENTS OF THE SOUND OF BELLS.
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- Archives of Metallurgy & Materials, 2021, v. 66, n. 2, p. 531, doi. 10.24425/amm.2021.135889
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- Article
NON-WETTING TO WETTING TRANSITION TEMPERATURES OF LIQUID TIN ON SURFACES OF DIFFERENT STEEL SAMPLES CORRESPONDING TO THEIR SPONTANEOUS DEOXIDATION.
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- Archives of Metallurgy & Materials, 2021, v. 66, n. 2, p. 469, doi. 10.24425/amm.2021.135880
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- Article
RELIABILITY EXAMINATIONS OF SAC LEAD FREE SOLDER MATERIAL.
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- Archives of Metallurgy & Materials, 2019, v. 64, n. 3, p. 925, doi. 10.24425/amm.2019.129474
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- Article
INFLUENCE OF THE REPETITIVE CORRUGATION ON THE MECHANISM OCCURING DURING PLASTIC DEFORMATION OF CuSn6 ALLOY.
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- Archives of Metallurgy & Materials, 2016, v. 61, n. 3, p. 915, doi. 10.1515/amm-2016-0208
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- Article
Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites.
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- Applied Nanoscience, 2023, v. 13, n. 12, p. 7387, doi. 10.1007/s13204-023-02898-z
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- Article
Hybrid solder joints: the effect of nanosized ZrO<sub>2</sub> particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints.
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- Applied Nanoscience, 2023, v. 13, n. 11, p. 7379, doi. 10.1007/s13204-023-02912-4
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- Article
Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles.
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- Applied Nanoscience, 2022, v. 12, n. 4, p. 977, doi. 10.1007/s13204-021-01750-6
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- Article
Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping.
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- Applied Nanoscience, 2020, v. 10, n. 12, p. 4943, doi. 10.1007/s13204-020-01398-8
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- Article
Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
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- Applied Nanoscience, 2020, v. 10, n. 12, p. 4603, doi. 10.1007/s13204-020-01325-x
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- Article
Time-of-flight neutron diffraction applied to the identification of crystalline phases in historical mosaic glasses.
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- Physics & Chemistry of Glasses: European Journal of Glass Science & Technology Part B, 2023, v. 64, n. 2, p. 52, doi. 10.13036/17533562.64.2.21
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- Article
Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders.
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- Journal of the Institute of Engineering, 2019, v. 15, n. 1, p. 37, doi. 10.3126/jie.v15i1.27702
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- Article
3D sputtering simulations of the CZTS, Si and CIGS thin films using Monte-Carlo method.
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- Monte Carlo Methods & Applications, 2021, v. 27, n. 4, p. 373, doi. 10.1515/mcma-2021-2094
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- Article
Superscalar Phase Boundaries Derived Multiple Active Sites in SnO<sub>2</sub>/Cu<sub>6</sub>Sn<sub>5</sub>/CuO for Tandem Electroreduction of CO<sub>2</sub> to Formic Acid.
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- Advanced Energy Materials, 2023, v. 13, n. 13, p. 1, doi. 10.1002/aenm.202203506
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- Article
Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air.
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- Advances in Mechanical Engineering (Sage Publications Inc.), 2020, v. 12, n. 10, p. 1, doi. 10.1177/1687814020966532
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- Article
Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate.
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- International Journal of Modern Physics C: Computational Physics & Physical Computation, 2020, v. 31, n. 09, p. N.PAG, doi. 10.1142/S0129183120501193
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- Article