Found: 107
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Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7044, doi. 10.1007/s11664-024-11379-0
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- Article
In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint.
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- Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1568, doi. 10.1007/s11664-021-09390-w
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- Article
A scheduling problem for PCB assembly: a case with multiple lines.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 43, n. 11/12, p. 1189, doi. 10.1007/s00170-008-1797-6
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- Article
Optimization of PCB component placements for the collect-and-place machines.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 7/8, p. 828, doi. 10.1007/s00170-007-1014-z
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- Article
Experimental studies on cryogenic recycling of printed circuit board.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 7/8, p. 657, doi. 10.1007/s00170-006-0634-z
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- Article
INTELLECTUAL SYSTEM FOR PRINTED CIRCUIT BOARD MANUFACTURE BASED ON MIRAE MX-200.
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- Electronics & Control Systems, 2021, v. 68, n. 2, p. 38, doi. 10.18372/1990-5548.68.16090
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- Article
End-to-end deep learning framework for printed circuit board manufacturing defect classification.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-16302-3
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- Article
CONSIDERATIONS ABOUT COOPER ETCHING BY PHOTOCHEMICAL MACHINING.
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- Nonconventional Technologies Review / Revista de Tehnologii Neconventionale, 2022, v. 26, n. 1, p. 3
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- Article
Hardware-in-the-Loop Simulation System Based on Unity3D for Winding Machine.
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- Journal of Donghua University (English Edition), 2024, v. 41, n. 3, p. 298, doi. 10.19884/j.1672-5220.202311003
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- Article
Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method.
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- Journal of Donghua University (English Edition), 2023, v. 40, n. 5, p. 525, doi. 10.19884/j.1672-5220.202209003
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- Article
Wetting metamorphosis of hydrophobic fluoropolymer coatings submerged in water and ultrasonically vibrated.
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- Journal of Coatings Technology & Research, 2020, v. 17, n. 3, p. 633, doi. 10.1007/s11998-019-00250-1
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- Article
High copper recovery from scrap printed circuit boards using poly(ethylene glycol)/sodium hydroxide treatment.
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- Environmental Chemistry Letters, 2018, v. 16, n. 1, p. 311, doi. 10.1007/s10311-017-0676-5
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- Article
Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards.
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- Polymers for Advanced Technologies, 2016, v. 27, n. 12, p. 1577, doi. 10.1002/pat.3833
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- Article
A Study on the Fabrication Parameters and Dielectric Properties of PTFE Composites Filled with Al2O3 and SiO2 Nanoparticles.
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- Journal of Industrial Textiles, 2011, v. 40, n. 4, p. 361, doi. 10.1177/1528083710379448
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- Article
A new approach to designing easily recyclable printed circuit boards.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-26677-y
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- Article
Transcriptome Analysis of Cyanide-Treated Rice Seedlings: Insights into Gene Functional Classifications.
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- Life (2075-1729), 2022, v. 12, n. 11, p. 1701, doi. 10.3390/life12111701
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- Article
Burn-in Test Detection Method for Electronic Products based on VFSA--ELM.
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- Journal of Engineering Science & Technology Review, 2018, v. 11, n. 4, p. 40, doi. 10.25103/jestr.114.05
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- Article
A note on a motion control problem for a placement machine.
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- OR Spectrum, 2008, v. 30, n. 3, p. 535, doi. 10.1007/s00291-007-0088-1
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- Article
A Branch-and-price algorithm for placement routing for a multi-head beam-type component placement tool.
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- OR Spectrum, 2008, v. 30, n. 3, p. 515, doi. 10.1007/s00291-007-0085-4
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- Article
Mathematical methods for physical layout of printed circuit boards: an overview.
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- OR Spectrum, 2008, v. 30, n. 3, p. 453, doi. 10.1007/s00291-007-0080-9
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- Article
Selecting the nozzle assortment for a Gantry-type placement machine.
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- OR Spectrum, 2008, v. 30, n. 3, p. 493, doi. 10.1007/s00291-007-0108-1
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- Article
A GA-based solution approach for balancing printed circuit board assembly lines.
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- OR Spectrum, 2008, v. 30, n. 3, p. 469, doi. 10.1007/s00291-007-0101-8
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- Article
Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6086, doi. 10.1007/s11664-016-4965-8
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- Article
Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments.
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- Journal of Electronic Materials, 2012, v. 41, n. 3, p. 611, doi. 10.1007/s11664-011-1799-2
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- Article
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
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- Article
A compact slot antenna configuration for ultrawideband (UWB) terminals and mobile phones.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2018, v. 28, n. 8, p. 1, doi. 10.1002/mmce.21400
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- Article
Millimeter-wave planar high gain SIW antenna using half elliptic radiation slots.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2015, v. 25, n. 8, p. 709, doi. 10.1002/mmce.20913
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- Article
Frequency Shift in Microwave Circuits Manufactured with Circuit Board Plotters: Case Study of a Parallel Coupled Lines Filter.
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- Electronics (2079-9292), 2024, v. 13, n. 15, p. 3100, doi. 10.3390/electronics13153100
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- Article
Energy Selective Filter with Power-Dependent Transmission Effectiveness in Waveguide.
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- Electronics (2079-9292), 2019, v. 8, n. 2, p. 236, doi. 10.3390/electronics8020236
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- Article
A Novel Double-layer Low-profile Multiband Frequency Selective Surface for 4G Mobile Communication System.
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- Applied Computational Electromagnetics Society Journal, 2022, v. 37, n. 4, p. 420, doi. 10.13052/2022.ACES.J.370407
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- Article
Passively aligned multichannel fiber-pigtailing of planar integrated optical waveguides.
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- Optical Engineering, 2017, v. 56, n. 2, p. 1, doi. 10.1117/1.OE.56.2.026115
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- Article
Design of Printed Circuit Board Production using Water Jet Technology.
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- TEM Journal, 2019, v. 8, n. 4, p. 1313, doi. 10.18421/TEM84-30
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- Article
Wideband Branch Line Coupler with Open Circuit Coupled Lines.
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- International Journal of Electrical & Computer Engineering (2088-8708), 2017, v. 7, n. 2, p. 888, doi. 10.11591/ijece.v7i2.pp888-893
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- Article
Reflection Phase Shift for PWB and PCBA Production Testing.
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 1, p. 1, doi. 10.4071/imaps.315
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- Article
NEW NASA METHOD SPOTS FAILING INFRASTRUCTURE FROM SPACE.
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- Advanced Materials & Processes, 2019, v. 177, n. 6, p. 12
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- Article
Printed Circuits: Reliability for All: Still, faulty operation in elevators must always be recognized as a possibility.
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- Elevator World, 2021, v. 69, n. 8, p. 78
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GAL Goes Lean and Green.
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- Elevator World, 2011, v. 60, n. 3, p. 136
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- Article
Small-size printed loop-type antenna integrated with two stacked coupled-fed shorted strip monopoles for eight-band LTE/GSM/UMTS operation in the mobile phone.
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- Microwave & Optical Technology Letters, 2010, v. 52, n. 7, p. 1471, doi. 10.1002/mop.25257
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- Article
DEVELOPMENT OF A MICROCONTROLLER DEVICE FOR REPRODUCING AUDIO INFORMATION.
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- Eurasian Physical Technical Journal, 2023, v. 20, n. 3, p. 70, doi. 10.31489/2023No3/70-79
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- Article
Improved Mixed-Integer Linear Programming Model for Short-Term Scheduling of the Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
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- Mathematics (2227-7390), 2021, v. 9, n. 21, p. 2653, doi. 10.3390/math9212653
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- Article
Mixed-Integer Linear Programming Model and Heuristic for Short-Term Scheduling of Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
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- Mathematics (2227-7390), 2021, v. 9, n. 6, p. 653, doi. 10.3390/math9060653
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- Article
Substrate-integrated photonic doping for near-zero-index devices.
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- Nature Communications, 2019, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41467-019-12083-y
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- Article
A TABU SEARCH FOR TIME MINIMIZATION IN PRINTED CIRCUIT BOARD ASSEMBLY.
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- Academic Journal of Manufacturing Engineering, 2021, v. 19, n. 2, p. 5
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- Article
THE OPTIMIZATED STUDY ON PREPARATION PROCESS OF NANO TIRE PRESSURE SENSOR USED IN AUTO.
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- Academic Journal of Manufacturing Engineering, 2017, v. 15, n. 1, p. 97
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- Article
A Low Cost Instantaneous Frequency Measurement System.
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- Progress in Electromagnetics Research M, 2017, v. 59, p. 171, doi. 10.2528/pierm17060512
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- Article
A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice.
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- International Journal of Electrical Engineering Education, 2017, v. 54, n. 3, p. 208, doi. 10.1177/0020720916673650
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- Article
Laser Printing Circuit Boards and Electronics.
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- Journal of Imaging Science & Technology, 2012, v. 56, n. 4, p. 1, doi. 10.2352/J.ImagingSci.Technol.2012.56.4.040503
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- Article
COPPER RECOVERY FROM WASTE PRINTED CIRCUIT BOARDS AND THE CORRELATION OF Cu, Pb, Zn BY IONIC LIQUID.
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- Environment Protection Engineering, 2017, v. 43, n. 4, p. 55, doi. 10.5277/epe170405
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- Article
Nanotechnology: Etch a circuit sketch.
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- Nature, 2009, v. 457, n. 7233, p. 1061, doi. 10.1038/4571061a
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- Article
Fully integrated wideband phased array with large scan range and 5:1 bandwidth.
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- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2021, v. 15, n. 14, p. 1799, doi. 10.1049/mia2.12196
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- Article