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Diamond-like carbon (DLC) surface treatment decreases biofilm burden by S. aureus on titanium alloy in vitro— a pilot study.
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- European Journal of Orthopaedic Surgery & Traumatology, 2024, v. 34, n. 8, p. 3989, doi. 10.1007/s00590-024-04093-4
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Performance Assessment on the Manufacturing of Zn-22Al-2Cu Alloy Foams Using Barite by Melt Route.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 872, doi. 10.3390/cryst14100872
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Thermal Processing Map Study of the GH99 Nickel-Based Superalloy Based on Different Instability Criteria.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 869, doi. 10.3390/cryst14100869
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Ductility Index for Refractory High Entropy Alloys.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 838, doi. 10.3390/cryst14100838
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- Article
Near-theoretical strength and deformation stabilization achieved via grain boundary segregation and nano-clustering of solutes.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-53349-4
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- Article
Uticaj metal-keramičkih zubnih nadoknada na pojavu prebojenosti gingive.
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- Vojnosanitetski Pregled: Military Medical & Pharmaceutical Journal of Serbia, 2006, v. 63, n. 4, p. 409, doi. 10.2298/VSP0604409R
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Changed Clinical Chemistry Pattern in Blood After Removal of Dental Amalgam and other Metal Alloys Supported by Antioxidant Therapy.
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- Biological Trace Element Research, 2007, v. 120, n. 1-3, p. 163, doi. 10.1007/s12011-007-8026-2
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Conference Diary.
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- Physical Separation in Science & Engineering, 2003, v. 12, n. 3, p. 201, doi. 10.1080/14786470310001637084
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- Article
An Electrode Based on Ca:Au Alloy and Atomic Layer Deposition for a Transparent Flexible OLED Device.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2955, doi. 10.1007/s11664-024-11064-2
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- Article
Formation of Spontaneous Lateral Heterostructures in High Al content Al<sub>x</sub>Ga<sub>1−x</sub>N Alloys Grown by High-Temperature Plasma-Assisted Molecular Beam Epitaxy.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2789, doi. 10.1007/s11664-024-10952-x
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- Article
A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1414, doi. 10.1007/s11664-023-10881-1
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1284, doi. 10.1007/s11664-023-10866-0
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- Article
In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1239, doi. 10.1007/s11664-023-10847-3
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- Article
Heat Transport in Hot Extruded Bulk Polycrystalline Thermoelectric Alloys Based on Bi<sub>2</sub>Te<sub>3</sub>.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6929, doi. 10.1007/s11664-023-10624-2
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- Article
High Thermoelectric Performance of Large Size Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> Alloy Ingots.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6682, doi. 10.1007/s11664-023-10590-9
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Ab Initio Study of the Properties of Ti<sub>2</sub>PdFe(Ru)Sb<sub>2</sub> Double Half-Heusler Semiconducting Alloys.
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- Journal of Electronic Materials, 2023, v. 52, n. 10, p. 6514, doi. 10.1007/s11664-023-10589-2
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Temperature-and Composition-Dependent Band Gap Energy and Electron–Phonon Coupling in InAs<sub>1−x</sub>Sb<sub>x</sub> Semiconductors Alloys for Infrared Photodetection.
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- Journal of Electronic Materials, 2023, v. 52, n. 9, p. 6031, doi. 10.1007/s11664-023-10546-z
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Stability and Thermoelectric Properties of FeZrTe Alloy.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3931, doi. 10.1007/s11664-023-10369-y
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- Article
Anomalous Growth of the Alloy Whiskers and Hillocks in a Sn-Pb Coating on Al Substrate.
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- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 1977, doi. 10.1007/s11664-022-10160-5
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Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder.
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- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 2116, doi. 10.1007/s11664-022-10159-y
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Assessing Sb Cross Incorporation in InAs/InAsSb Superlattices.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6784, doi. 10.1007/s11664-022-09952-6
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Microstructure, Tensile Mechanical Properties and Electrical Fatigue Mechanism of a Microalloyed Copper Wire.
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- Journal of Electronic Materials, 2022, v. 51, n. 10, p. 5857, doi. 10.1007/s11664-022-09835-w
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Protecting Li Metal Anode While Suppressing "Shuttle Effect" of Li-S Battery Through Localized High-Concentration Electrolyte.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4772, doi. 10.1007/s11664-022-09751-z
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Role of Deep Defects on the Transport Properties of Polycrystalline Thermoelectric Alloys and Composites.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4816, doi. 10.1007/s11664-022-09748-8
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- Article
Investigation of the Microstructure and Electrical Performance of Ag/SnO<sub>2</sub>In<sub>2</sub>O<sub>3</sub> Contacts with Nickel Addition Fabricated by Internal Oxidation.
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- Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4918, doi. 10.1007/s11664-022-09717-1
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- Article
Electronic Properties of Zinc Blende ZnO<sub>x</sub>S<sub>1−x</sub> Alloys in the S-Rich Range: First-Principles Calculation.
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- Journal of Electronic Materials, 2022, v. 51, n. 8, p. 4486, doi. 10.1007/s11664-022-09698-1
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Impact of Substrates on the Electronic and Mechanical Properties of Al<sub>x</sub>In<sub>1−x</sub>P<sub>y</sub>Sb<sub>1−y</sub> Alloys.
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- Journal of Electronic Materials, 2022, v. 51, n. 6, p. 3150, doi. 10.1007/s11664-022-09545-3
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Lattice-Dynamical, Elastic and Thermo-Dynamical Properties of GaAs, InAs, and their Mixed Ga<sub>1-x</sub>In<sub>x</sub>As Alloys.
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- Journal of Electronic Materials, 2022, v. 51, n. 6, p. 3033, doi. 10.1007/s11664-022-09524-8
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On the Study of "Further Meyer–Neldel Rule" in Thermally Activated High Field Conduction of Se-Te-Pb Glassy Alloys.
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- Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1089, doi. 10.1007/s11664-021-09360-2
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Controlling the Electrical Properties of Reactively Sputtered High Entropy Alloy CrFeNiCoCu Films.
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- Journal of Electronic Materials, 2022, v. 51, n. 2, p. 803, doi. 10.1007/s11664-021-09343-3
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Electronic Structure Study of Ni-B Alloy Coatings by XAFS Technique.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 7000, doi. 10.1007/s11664-021-09203-0
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Effect of ECAP Processing on Hardness, Electrical Conductivity, and Precipitation Kinetics of the Cu-0.81Cr-0.07Zr Alloy.
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- Journal of Electronic Materials, 2021, v. 50, n. 11, p. 6171, doi. 10.1007/s11664-021-09144-8
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- Article
Effect of La Doping on the Microwave Absorption Performance of Dy<sub>2</sub>Co<sub>17</sub> Alloys.
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- Journal of Electronic Materials, 2021, v. 50, n. 11, p. 6159, doi. 10.1007/s11664-021-09133-x
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- Article
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires.
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- Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5955, doi. 10.1007/s11664-021-09119-9
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- Article
Effect of Ni Substitution for Si Element on Thermal and Soft Magnetic Properties of Fe73.5NixSi15.5-xB7Nb3Cu1 Nanocrystalline Alloys.
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- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4577, doi. 10.1007/s11664-021-09004-5
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- Article
Effect of Fe Content on the Microwave Performance of HoNi2 Alloys.
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- Journal of Electronic Materials, 2021, v. 50, n. 4, p. 1996, doi. 10.1007/s11664-020-08713-7
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Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 881, doi. 10.1007/s11664-020-08709-3
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- Article
Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 903, doi. 10.1007/s11664-020-08693-8
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Overview of the Role of Alloying Modifiers on the Performance of Phase Change Memory Materials.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 1, doi. 10.1007/s11664-020-08590-0
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- Article
A Review of the Mg2(Si,Sn) Alloy System as Emerging Thermoelectric Material: Experimental and Modeling Aspects.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 25, doi. 10.1007/s11664-020-08591-z
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Effect of Thermal Oxidation on the Structural and Magnetic Properties of TbFe2 Alloys.
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- Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6528, doi. 10.1007/s11664-020-08423-0
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- Article
Effect of Different Ni Contents on Thermal Stability of Cu(Ni) Alloy Film.
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- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 5674, doi. 10.1007/s11664-020-08340-2
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- Article
4O10Cd Clustering in ZnBVI-Rich CdxZn1−xOyB1−yVI (BVI = S, Se, Te) Highly Lattice-Mismatched Alloys.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5167, doi. 10.1007/s11664-020-08302-8
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- Article
DFT Study of Structural and Electronic Properties of MgZnO Alloy.
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- Journal of Electronic Materials, 2020, v. 49, n. 8, p. 4569, doi. 10.1007/s11664-020-08066-1
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Dielectric Parameters Study of GaAs1−xSbx Alloy from Optical Interband Transition.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3149, doi. 10.1007/s11664-020-08037-6
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- Article
Effect of ECAP Process and Subsequent Annealing on Microstructure and Properties of Cu-0.25Se-0.25Te Alloy.
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- Journal of Electronic Materials, 2020, v. 49, n. 4, p. 2617, doi. 10.1007/s11664-020-07975-5
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On the Melting of Defective FCC Interstitial Alloy γ-FeC under Pressure up to 100 GPa.
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- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 910, doi. 10.1007/s11664-019-07829-9
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Preparation and Microwave Absorption Properties of Melt-Spun Nd2Co17 Alloys with Different Post-Treatment Processes.
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- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1167, doi. 10.1007/s11664-019-07818-y
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Structural, Electronic and Thermoelectric Properties of Pb1−xSnxTe Alloys.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 586, doi. 10.1007/s11664-019-07715-4
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Structural, Electronic, Mechanical, Thermodynamic, and Linear and Nonlinear Optical Properties of MoS<sub>2</sub>, MoSe<sub>2</sub>, and their MoS<sub>2x</sub>Se<sub>2(1−x)</sub> Alloys: Ab Initio Calculations.
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- Journal of Electronic Materials, 2019, v. 48, n. 12, p. 7977, doi. 10.1007/s11664-019-07611-x
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- Article