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Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites.
- Published in:
- Applied Nanoscience, 2023, v. 13, n. 12, p. 7387, doi. 10.1007/s13204-023-02898-z
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- Article
Hybrid solder joints: the effect of nanosized ZrO<sub>2</sub> particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints.
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- Applied Nanoscience, 2023, v. 13, n. 11, p. 7379, doi. 10.1007/s13204-023-02912-4
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- Article
Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles.
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- Applied Nanoscience, 2022, v. 12, n. 4, p. 977, doi. 10.1007/s13204-021-01750-6
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- Article
Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
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- Applied Nanoscience, 2020, v. 10, n. 12, p. 4603, doi. 10.1007/s13204-020-01325-x
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- Article
Lightweight magnesium nanocomposites: electrical conductivity of liquid magnesium doped by CoPd nanoparticles.
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- Applied Nanoscience, 2019, v. 9, n. 5, p. 1119, doi. 10.1007/s13204-018-0789-6
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- Article
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength.
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- Journal of Electronic Materials, 2016, v. 45, n. 8, p. 4390, doi. 10.1007/s11664-016-4584-4
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- Article
The liquid AlCu4TiMg alloy: thermophysical and thermodynamic properties.
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- High Temperatures - High Pressures, 2020, v. 49, n. 1/2, p. 61, doi. 10.32908/hthp.v49.847
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- Article
AlCoCrCuFeNi-Based High-Entropy Alloys: Correlation Between Molar Density and Enthalpy of Mixing in the Liquid State.
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- Metallurgical & Materials Transactions. Part A, 2018, v. 49, n. 12, p. 6544, doi. 10.1007/s11661-018-4925-4
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- Article
Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States.
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- Metals (2075-4701), 2023, v. 13, n. 6, p. 1093, doi. 10.3390/met13061093
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- Article