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Nanocrystalline Ti-Al-Mo-Zr-Si Alloy (TC11) by Laser Powder Bed Fusion In-situ Alloying.
- Published in:
- Advanced Engineering Materials, 2024, v. 26, n. 10, p. 1, doi. 10.1002/adem.202301445
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- Article
L-Cysteine-Encapsulated MXene Nanosheet Possessing Ultra-Antioxidation in Aqueous Suspension for Electrophoretic Deposition Assisted Carbon-Fiber-Surface Modification.
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- Advanced Materials Interfaces, 2024, v. 11, n. 7, p. 1, doi. 10.1002/admi.202300851
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- Article
Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi 9 Microwire and Au Microlayer.
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- Micromachines, 2021, v. 12, n. 1, p. 51, doi. 10.3390/mi12010051
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- Article
Correction to "Electrohydrodynamic Printing of Ultrafine and Highly Conductive Ag Electrodes for Various Flexible Electronics".
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- 2024
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- Correction Notice
Electrohydrodynamic Printing of High‐Resolution Self‐Reduced Soldered Silver Nanowire Pattern for Wearable Flexible Strain Sensors.
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- Advanced Materials Technologies, 2023, v. 8, n. 19, p. 1, doi. 10.1002/admt.202300759
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- Article
Electrohydrodynamic Printing of Ultrafine and Highly Conductive Ag Electrodes for Various Flexible Electronics.
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- Advanced Materials Technologies, 2023, v. 8, n. 16, p. 1, doi. 10.1002/admt.202300080
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- Article
Self-Driven Ni-Based Electrochromic Devices for Energy-Efficient Smart Windows.
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- Advanced Materials Technologies, 2023, v. 8, n. 8, p. 1, doi. 10.1002/admt.202201688
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- Article
A Ferroelectric p–i–n Heterostructure for Highly Enhanced Short‐Circuit Current Density and Self‐Powered Photodetection.
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- Advanced Electronic Materials, 2022, v. 8, n. 9, p. 1, doi. 10.1002/aelm.202101385
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- Article
Surface display of the COE antigen of porcine epidemic diarrhoea virus on Bacillus subtilis spores.
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- Microbial Biotechnology, 2024, v. 17, n. 7, p. 1, doi. 10.1111/1751-7915.14518
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- Article
Determination of the Elastic Properties of Au<sub>5</sub>Sn and AuSn from Ab Initio Calculations.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 968, doi. 10.1007/s11664-008-0453-0
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- Article
Determination of the Elastic Properties of Cu<sub>3</sub>Sn Through First-Principles Calculations.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 477, doi. 10.1007/s11664-007-0358-3
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- Publication type:
- Article
Impacts of climate change on the distribution of Sichuan snub-nosed monkeys ( Rhinopithecus roxellana) in Shennongjia area, China.
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- American Journal of Primatology, 2015, v. 77, n. 2, p. 135, doi. 10.1002/ajp.22317
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- Article
Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 1, p. 55, doi. 10.4071/imaps.433
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- Article
A dual-functional sensor based on PEDOT:PSS for sensing temperature and ammonia fabricated by electrohydrodynamic printing.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 27, p. 1, doi. 10.1007/s10854-024-13555-8
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- Article
Microstructure of Ag Nano Paste Joint and Its Influence on Reliability.
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- Crystals (2073-4352), 2021, v. 11, n. 12, p. 1537, doi. 10.3390/cryst11121537
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- Article
A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing.
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- Coatings (2079-6412), 2024, v. 14, n. 5, p. 625, doi. 10.3390/coatings14050625
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- Article
Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices.
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- Coatings (2079-6412), 2023, v. 13, n. 4, p. 748, doi. 10.3390/coatings13040748
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- Publication type:
- Article
In-Situ Observation on Microfracture Behavior Ahead of the Crack Tip in 63Sn37Pb Solder Alloy.
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- Metallurgical & Materials Transactions. Part A, 2006, v. 37, n. 3A, p. 1017, doi. 10.1007/s11661-006-0074-2
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- Article
Enhanced shear strength of Cu-Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process.
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- Journal of Materials Science, 2017, v. 52, n. 4, p. 1943, doi. 10.1007/s10853-016-0483-6
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- Article
Microconfined Assembly of High‐Resolution and Mechanically Robust EGaIn Liquid Metal Stretchable Electrodes for Wearable Electronic Systems.
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- Advanced Science, 2024, v. 11, n. 34, p. 1, doi. 10.1002/advs.202402818
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- Article
Are Sulfide‐Based Solid‐State Electrolytes the Best Pair for Si Anodes in Li‐Ion Batteries? (Adv. Energy Mater. 40/2024).
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- Advanced Energy Materials, 2024, v. 14, n. 40, p. 1, doi. 10.1002/aenm.202470176
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- Article
Are Sulfide‐Based Solid‐State Electrolytes the Best Pair for Si Anodes in Li‐Ion Batteries?
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- Advanced Energy Materials, 2024, v. 14, n. 40, p. 1, doi. 10.1002/aenm.202402048
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- Article
Is Soft Carbon a More Suitable Match for SiO<sub>x</sub> in Li‐Ion Battery Anodes? (Small 37/2023).
- Published in:
- Small, 2023, v. 19, n. 37, p. 1, doi. 10.1002/smll.202302644
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- Article
Is Soft Carbon a More Suitable Match for SiO<sub>x</sub> in Li‐Ion Battery Anodes?
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- Small, 2023, v. 19, n. 37, p. 1, doi. 10.1002/smll.202302644
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- Article
Carbon Microstructure Dependent Li‐Ion Storage Behaviors in SiO<sub>x</sub>/C Anodes (Small 25/2023)
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- Small, 2023, v. 19, n. 25, p. 1, doi. 10.1002/smll.202300759
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- Article
Carbon Microstructure Dependent Li‐Ion Storage Behaviors in SiO<sub>x</sub>/C Anodes (Small 25/2023).
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- Small, 2023, v. 19, n. 25, p. 1, doi. 10.1002/smll.202300759
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- Publication type:
- Article
Carbon Microstructure Dependent Li‐Ion Storage Behaviors in SiO<sub>x</sub>/C Anodes.
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- Small, 2023, v. 19, n. 25, p. 1, doi. 10.1002/smll.202300759
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- Article
Insights into the Potassium Ion Storage Behavior and Phase Evolution of a Tailored Yolk–Shell SnSe@C Anode.
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- Small, 2022, v. 18, n. 39, p. 1, doi. 10.1002/smll.202203459
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- Article
Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 28, p. 1, doi. 10.1007/s10854-023-11395-6
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- Article
Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27373, doi. 10.1007/s10854-021-07113-9
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- Article
Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 6890, doi. 10.1007/s10854-021-05395-7
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- Article
Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 6497, doi. 10.1007/s10854-020-03207-y
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- Article
Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7787, doi. 10.1007/s10854-019-01094-6
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- Article
Robust tuning of Kirkendall void density in circuit interconnections through substrate strain annealing.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8287, doi. 10.1007/s10854-018-8837-2
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- Article
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11583, doi. 10.1007/s10854-016-5289-4
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- Article
Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 6809, doi. 10.1007/s10854-016-4631-1
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- Article
Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2674, doi. 10.1007/s10854-015-2736-6
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- Article
Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 4170, doi. 10.1007/s10854-014-2145-2
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- Article
Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3905, doi. 10.1007/s10854-013-1337-5
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- Article
Formation of AuSn IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 217, doi. 10.1007/s10854-012-0715-8
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- Article
Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 136, doi. 10.1007/s10854-011-0538-z
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- Article
Investigation on Sn grain number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 11, p. 1174, doi. 10.1007/s10854-009-0042-x
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- Article
Microstructural characterization and mechanical properties of AlMg alloy fabricated by additive friction stir deposition.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 5/6, p. 2733, doi. 10.1007/s00170-023-10952-x
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- Article
Relationship between dynamic resistance and welding quality during resistance spot welding for micron AuNi<sub>9</sub> wire.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 9/10, p. 6605, doi. 10.1007/s00170-022-08980-0
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- Publication type:
- Article
A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package.
- Published in:
- Applied Sciences (2076-3417), 2018, v. 8, n. 11, p. 2188, doi. 10.3390/app8112188
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- Article
Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock.
- Published in:
- Applied Sciences (2076-3417), 2018, v. 8, n. 11, p. 2056, doi. 10.3390/app8112056
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- Article
A Solution Processed Flexible Nanocomposite Substrate with Efficient Light Extraction via Periodic Wrinkles for White Organic Light‐Emitting Diodes.
- Published in:
- Advanced Optical Materials, 2018, v. 6, n. 23, p. N.PAG, doi. 10.1002/adom.201801015
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- Article
Preparation of activated carbon spheres and their electrochemical properties as supercapacitor electrode.
- Published in:
- Carbon Letters, 2021, v. 31, n. 4, p. 667, doi. 10.1007/s42823-021-00241-6
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- Article
Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications (Adv. Mater. Interfaces 9/2022).
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 9, p. 1, doi. 10.1002/admi.202270045
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- Article
Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 9, p. 1, doi. 10.1002/admi.202101724
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- Article