Found: 2

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  • Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging.

    Published in:
    Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2889, doi. 10.18494/SAM.2018.1948
    By:
    • Jenn-Ming Song;
    • Sin-Yong Liang;
    • Zong-Yu Xie;
    • Po-Hao Chiang;
    • Shang-Kun Huang;
    • Ying-Ta Chiu;
    • David Tarng;
    • Chih-Pin Hung;
    • Jing-Yuan Lin
    Publication type:
    Article

  • Light enhanced direct Cu bonding for advanced electronic assembly.

    Published in:
    Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 14144, doi. 10.1007/s10854-018-9547-5
    By:
    • Liang, Sin-Yong;
    • Song, Jenn-Ming;
    • Huang, Shang-Kun;
    • Chiu, Ying-Ta;
    • Tarng, David;
    • Hung, Chih-Pin
    Publication type:
    Article