Found: 14
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Weakening of the Cu/Cu<sub>3</sub>Sn(100) Interface by Bi Impurities.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1277, doi. 10.1007/s11664-010-1196-2
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- Publication type:
- Article
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 333, doi. 10.1007/s11664-009-1026-6
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- Publication type:
- Article
Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2470, doi. 10.1007/s11664-009-0857-5
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- Publication type:
- Article
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2506, doi. 10.1007/s11664-009-0896-y
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- Publication type:
- Article
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2579, doi. 10.1007/s11664-009-0894-0
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- Publication type:
- Article
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2398, doi. 10.1007/s11664-009-0917-x
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- Publication type:
- Article
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 3, p. 425, doi. 10.1007/s11664-008-0594-1
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- Publication type:
- Article
Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 10, p. 1372, doi. 10.1007/s11664-007-0206-5
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- Publication type:
- Article
Interfacial Segregation of Bi during Current Stressing of Sn-Bi/Cu Solder Interconnect.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1363, doi. 10.1007/s11664-005-0191-5
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- Publication type:
- Article
Cyclic Softening of the Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy with Equiaxed Grain Structure.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 62, doi. 10.1007/s11664-005-0181-7
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- Publication type:
- Article
Effects of nitrogen doping on optical properties of TiO<sub>2</sub> thin films.
- Published in:
- Applied Physics A: Materials Science & Processing, 2005, v. 81, n. 7, p. 1411, doi. 10.1007/s00339-004-3101-4
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- Publication type:
- Article
Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1234, doi. 10.1007/s10854-011-0292-2
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- Publication type:
- Article
Crack propagation of single crystal β-Sn during in situ TEM straining.
- Published in:
- Journal of Electron Microscopy, 2010, v. 59, n. S1, p. S61, doi. 10.1093/jmicro/dfq054
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- Publication type:
- Article
Acid-mediated sol–gel synthesis of visible-light active photocatalysts.
- Published in:
- 2006
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- Publication type:
- Letter