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Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.
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- Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4
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- Article
The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature.
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- Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6746, doi. 10.1007/s11664-020-08426-x
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- Article
Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish.
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- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6073, doi. 10.1007/s11664-020-08338-w
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- Article
Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions.
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- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1527, doi. 10.1007/s11664-019-07863-7
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- Article
Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability.
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- Advanced Engineering Materials, 2023, v. 25, n. 10, p. 1, doi. 10.1002/adem.202201635
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- Article
Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy.
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- Advanced Engineering Materials, 2020, v. 22, n. 12, p. 1, doi. 10.1002/adem.202000179
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- Article
Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 885, doi. 10.1007/s10854-008-9811-1
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- Article
Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 17, doi. 10.1007/s10854-008-9588-2
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- Article
Characteristics of environmental factor for electrochemical migration on printed circuit board.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 952, doi. 10.1007/s10854-007-9421-3
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- Article
Effect of underfill on bending fatigue behavior of chip scale package.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 406, doi. 10.1007/s10854-007-9354-x
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- Article
Electrical properties and interfacial reaction of BGA package with underfill.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 75, doi. 10.1007/s10854-007-9282-9
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- Article
Investigation of interfacial reaction and joint reliability between eutectic Snâ3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 5, p. 559, doi. 10.1007/s10854-006-9085-4
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- Article
Effects of fine fiber structures on the mechanical and electrical properties of cold rolled Cu-Ag sheet.
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- Journal of Materials Science Letters, 2003, v. 22, n. 24, p. 1751, doi. 10.1023/B:JMSL.0000005412.91868.71
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- Article
Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications.
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- Advanced Materials Technologies, 2023, v. 8, n. 19, p. 1, doi. 10.1002/admt.202300602
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- Article
Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles.
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- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1746, doi. 10.1007/s11664-018-06882-0
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- Article
Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure.
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- Journal of Electronic Materials, 2018, v. 47, n. 12, p. 7323, doi. 10.1007/s11664-018-6672-0
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- Article
Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock.
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- Journal of Electronic Materials, 2018, v. 47, n. 7, p. 4165, doi. 10.1007/s11664-018-6224-7
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- Article
Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB.
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- Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5895, doi. 10.1007/s11664-016-4803-z
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- Article
Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test.
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- Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3651, doi. 10.1007/s11664-016-4517-2
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- Article
Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes.
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- Journal of Electronic Materials, 2015, v. 44, n. 11, p. 4637, doi. 10.1007/s11664-015-4024-x
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- Article
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint.
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- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1950, doi. 10.1007/s11664-011-1686-x
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- Article
Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 224, doi. 10.1007/s11664-010-1423-x
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- Article
Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern.
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- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 35, doi. 10.1007/s11664-010-1408-9
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- Article
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2489, doi. 10.1007/s11664-009-0916-y
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- Article
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 902, doi. 10.1007/s11664-009-0737-z
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- Article
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5
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- Article
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 46, doi. 10.1007/s11664-008-0543-z
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- Article
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 118, doi. 10.1007/s11664-007-0301-7
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- Article
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 84, doi. 10.1007/s11664-007-0262-x
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- Article
Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 9, doi. 10.1007/s11664-007-0252-z
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- Article
Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1510, doi. 10.1007/s11664-007-0211-8
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- Article
Behavior of Anisotropic Conductive Film Joints Bonded with Various Forces under Temperature Fluctuation.
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- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1199, doi. 10.1007/s11664-007-0191-8
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- Article
Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method.
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- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 690, doi. 10.1007/s11664-007-0140-6
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- Article
Evaluation of Solder Joint Reliability in Flip-Chip Packages during Accelerated Testing.
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- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1550, doi. 10.1007/s11664-005-0164-8
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- Article
Reliability of In-48Sn Solder/Au/Ni/Cu BGA Packages during Reflow Process.
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- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1565, doi. 10.1007/s11664-005-0166-6
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- Article
The Effect of Isothermal Aging on the Thickness of Intermetallic Compound Layer Growth between Low Melting Point Solders and Ni-Plated Cu Substrate.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1561, doi. 10.1007/s11664-004-0099-5
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- Article
Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1190, doi. 10.1007/s11664-004-0122-x
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- Article
Interfacial Reactions and Shear Strengths between Sn-Ag--based Pb-Free Solder Balls and Au/EN/Cu Metallization.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1182, doi. 10.1007/s11664-004-0121-y
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- Article
Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods.
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- Scientific Reports, 2017, p. 41992, doi. 10.1038/srep41992
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- Article
Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes.
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- Surface & Interface Analysis: SIA, 2018, v. 50, n. 11, p. 1046, doi. 10.1002/sia.6419
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- Article
Adhesion of PDMS substrates assisted by Plasma Graft Polymerization.
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- Surface & Interface Analysis: SIA, 2016, v. 48, n. 7, p. 597, doi. 10.1002/sia.5985
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- Article
Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation.
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- Crystals (2073-4352), 2024, v. 14, n. 5, p. 465, doi. 10.3390/cryst14050465
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- Article
Water‐Triggered Self‐Healing of Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub> MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process.
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- Small, 2024, v. 20, n. 20, p. 1, doi. 10.1002/smll.202306434
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- Article
MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER.
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- Surface Review & Letters, 2007, v. 14, n. 4, p. 827, doi. 10.1142/S0218625X07010111
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- Article
SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO<sub>2</sub> LAYER WITH UNDERFILL.
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- Surface Review & Letters, 2007, v. 14, n. 4, p. 849, doi. 10.1142/S0218625X07010160
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- Article
Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain‐Insensitivity, and Reproducibility.
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- Advanced Science, 2024, v. 11, n. 35, p. 1, doi. 10.1002/advs.202405374
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- Article
FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2009, v. 23, n. 6/7, p. 1809, doi. 10.1142/S0217979209061664
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- Article
Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands.
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- Macromolecular Rapid Communications, 2007, v. 28, n. 5, p. 634, doi. 10.1002/marc.200600757
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- Article
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 7, p. 1, doi. 10.1007/s10854-024-12203-5
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- Article
Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 4, p. 1, doi. 10.1007/s10854-023-11913-6
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- Article