Found: 18
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Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1
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- Article
Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 745, doi. 10.1007/s10854-010-0204-x
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- Article
Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 790, doi. 10.1007/s10854-010-0213-9
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- Article
Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 1, p. 84, doi. 10.1007/s10854-010-0089-8
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- Article
Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 885, doi. 10.1007/s10854-008-9811-1
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- Article
Characteristics of environmental factor for electrochemical migration on printed circuit board.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 952, doi. 10.1007/s10854-007-9421-3
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- Article
Effect of underfill on bending fatigue behavior of chip scale package.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 406, doi. 10.1007/s10854-007-9354-x
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- Article
Electrical properties and interfacial reaction of BGA package with underfill.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 75, doi. 10.1007/s10854-007-9282-9
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- Article
No borna disease virus-specific RNA detected in blood of race horses and jockeys.
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- Acta Neuropsychiatrica, 2006, v. 18, n. 3/4, p. 177, doi. 10.1111/j.1601-5215.2006.00118.x
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- Article
Thermal oxidative stability of corn oil in ultra-high temperature short-time processed seasoned laver.
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- Food Science & Biotechnology, 2015, v. 24, n. 3, p. 947, doi. 10.1007/s10068-015-0122-z
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- Article
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint.
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- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1950, doi. 10.1007/s11664-011-1686-x
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- Article
Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 224, doi. 10.1007/s11664-010-1423-x
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- Article
Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern.
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- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 35, doi. 10.1007/s11664-010-1408-9
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- Article
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 902, doi. 10.1007/s11664-009-0737-z
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- Article
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 46, doi. 10.1007/s11664-008-0543-z
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- Article
Role of NADPH Oxidase 4 in Corneal Endothelial Cells Is Mediated by Endoplasmic Reticulum Stress and Autophagy.
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- Antioxidants, 2023, v. 12, n. 6, p. 1228, doi. 10.3390/antiox12061228
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- Article
A p-Tyr42 RhoA Inhibitor Promotes the Regeneration of Human Corneal Endothelial Cells by Ameliorating Cellular Senescence.
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- Antioxidants, 2023, v. 12, n. 6, p. 1186, doi. 10.3390/antiox12061186
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- Article
SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO<sub>2</sub> LAYER WITH UNDERFILL.
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- Surface Review & Letters, 2007, v. 14, n. 4, p. 849, doi. 10.1142/S0218625X07010160
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- Article