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Effect of Bi Segregation on the Asymmetrical Growth of Cu-Sn Intermetallic Compounds in Cu/Sn-58Bi/Cu Sandwich Solder Joints During Isothermal Aging.
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- Journal of Electronic Materials, 2013, v. 42, n. 12, p. 3567, doi. 10.1007/s11664-013-2749-y
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- Article
Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate.
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- Applied Physics A: Materials Science & Processing, 2016, v. 122, n. 4, p. 1, doi. 10.1007/s00339-016-9893-1
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- Article
Effect of Cu<sub>6</sub>Sn<sub>5</sub> nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14726, doi. 10.1007/s10854-019-01844-6
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- Article
Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1434, doi. 10.1007/s10854-018-0413-2
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- Article
A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5140, doi. 10.1007/s10854-015-3042-z
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- Article
Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2416, doi. 10.1007/s10854-014-1883-5
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- Article
Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 57, doi. 10.1007/s10854-013-1548-9
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- Article
Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2027, doi. 10.1007/s10854-012-1052-7
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- Article