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The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2006, v. 58, n. 6, p. 67, doi. 10.1007/s11837-006-0186-6
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- Article
Egomotion estimation with optic flow and air velocity sensors.
- Published in:
- Biological Cybernetics, 2011, v. 104, n. 6, p. 351, doi. 10.1007/s00422-011-0440-z
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- Article