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The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1464, doi. 10.1007/s10854-021-07638-z
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- Article
Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15575, doi. 10.1007/s10854-020-04121-z
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- Article
Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15184, doi. 10.1007/s10854-019-01891-z
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- Article
Rural district hospitals - essential cogs in the district health system - and primary healthcare re-engineering.
- Published in:
- SAMJ: South African Medical Journal, 2015, v. 105, n. 6, p. 440, doi. 10.7196/SAMJ.9284
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- Article