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Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15575, doi. 10.1007/s10854-020-04121-z
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- Article
Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15184, doi. 10.1007/s10854-019-01891-z
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- Publication type:
- Article
Distinct migration mechanisms of stepped FCC/BCC martensitic interfaces associated with typical orientation relationships: a molecular dynamics study.
- Published in:
- Journal of Materials Science, 2022, v. 57, n. 42, p. 19857, doi. 10.1007/s10853-022-07894-2
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- Article