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Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6432, doi. 10.1007/s11664-024-11341-0
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- Article
Research on axial cutting force fluctuation and periodicity in helical milling of CFRP.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 9/10, p. 4823, doi. 10.1007/s00170-024-13783-6
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- Article
Vacuum preloading hydrostatic support technology for mirror milling of thin-walled parts.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 5/6, p. 2583, doi. 10.1007/s00170-024-13934-9
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- Article
ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS MEASUREMENT USING THREE-POINT-SUPPORT METHOD.
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- Metrology & Measurement Systems, 2015, v. 22, n. 4, p. 531, doi. 10.1515/mms-2015-0052
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- Article
A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut.
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- Scientific Reports, 2015, p. 16395, doi. 10.1038/srep16395
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- Article
The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim.
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- Advances in Mechanical Engineering (Sage Publications Inc.), 2021, v. 13, n. 10, p. 1, doi. 10.1177/16878140211050488
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- Article
Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond.
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- Friction (2223-7704), 2024, v. 12, n. 6, p. 1119, doi. 10.1007/s40544-023-0760-8
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- Article
On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning.
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- Journal of Intelligent Manufacturing, 2022, v. 33, n. 3, p. 675, doi. 10.1007/s10845-020-01669-9
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- Article
Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZnTe crystals.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 47, n. 9-12, p. 1065, doi. 10.1007/s00170-009-2253-y
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- Article
Nanoscale machinability and subsurface damage machined by CMP of soft-brittle CdZnTe crystals.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 47, n. 9-12, p. 1105, doi. 10.1007/s00170-009-2225-2
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- Article
An Elementary Approximation of Dwell Time Algorithm for Ultra-Precision Computer-Controlled Optical Surfacing.
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- Micromachines, 2021, v. 12, n. 5, p. 471, doi. 10.3390/mi12050471
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- Article
A New Method for Precision Measurement of Wall-Thickness of Thin-Walled Spherical Shell Parts.
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- Micromachines, 2021, v. 12, n. 5, p. 467, doi. 10.3390/mi12050467
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- Article
Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching.
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- Micromachines, 2021, v. 12, n. 1, p. 77, doi. 10.3390/mi12010077
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- Article
SIMULATION ON THE GROUND WAFER SHAPE IN WAFER ROTATIONAL GRINDING.
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- Journal of Advanced Manufacturing Systems, 2011, v. 10, n. 1, p. 175, doi. 10.1142/S0219686711002120
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- Article
Effect of Wheel Path in Raster Grinding on Surface Accuracy of an Off-Axis Parabolic Mirror.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 19, p. 11096, doi. 10.3390/app131911096
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- Article
DESTformer: A Transformer Based on Explicit Seasonal–Trend Decomposition for Long-Term Series Forecasting.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 18, p. 10505, doi. 10.3390/app131810505
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- Article
Study on Characteristics of Tool Wear and Breakage of Ultrasonic Cutting Nomex Honeycomb Core with the Disc Cutter.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 14, p. 8168, doi. 10.3390/app13148168
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- Article
Experimental Study of Ultrasound-Assisted Reaming of Carbon Fiber-Reinforced Plastics/Titanium Alloy Stacks.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 9, p. 5309, doi. 10.3390/app13095309
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- Article
An Improved Cutting Force Model for Ultrasonically Assisted Grinding of Hard and Brittle Materials.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 9, p. 3888, doi. 10.3390/app11093888
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- Article
A Novel Ultrasonic Trepanning Method for Nomex Honeycomb Core.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 1, p. 354, doi. 10.3390/app11010354
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- Article
Atomic Understanding of the Plastic Deformation Mechanism of 4H-SiC Under Different Grain Depth-of-cut During Nano-Grinding.
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- Journal of Electronic Materials, 2023, v. 52, n. 7, p. 4865, doi. 10.1007/s11664-023-10457-z
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- Article
Nanoscale solely amorphous layer in silicon wafers induced by a newly developed diamond wheel.
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- Scientific Reports, 2016, p. 35269, doi. 10.1038/srep35269
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- Article
A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers.
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- Scientific Reports, 2016, p. 26891, doi. 10.1038/srep26891
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- Article
A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors.
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- Scientific Reports, 2016, p. 22466, doi. 10.1038/srep22466
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- Article
Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 5/6, p. 2587, doi. 10.1007/s00170-023-12755-6
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- Article
Material identification method for helical milling of CFRP/Ti stacks based on torque-speed model.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 7/8, p. 3659, doi. 10.1007/s00170-023-12531-6
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- Article
Structural behavior of the deep hole internal grinding machine structure with artificial granite material.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 7/8, p. 3077, doi. 10.1007/s00170-023-12029-1
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- Article
Theoretical and experimental analysis of surface topography and surface roughness evolution in fixed abrasive double-sided planetary lapping of YAG wafers.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 127, n. 1/2, p. 195, doi. 10.1007/s00170-023-11417-x
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- Article
Effect of kinematic parameters considering workpiece rotation on surface quality in YAG double-sided planetary lapping with the trajectory method.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 123, n. 5/6, p. 2679, doi. 10.1007/s00170-022-10288-y
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- Article
Effect of amplitude ratios on hole quality in longitudinal–torsional coupled ultrasonic-assisted drilling of CFRP composites.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 122, n. 7/8, p. 2911, doi. 10.1007/s00170-022-10080-y
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- Article
Effect of grain size on subsurface characterization of pure iron subjected to orthogonal cutting.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 9/10, p. 5793, doi. 10.1007/s00170-022-09156-6
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- Article
Solid-state phase transformation-induced residual stress in selective laser melting of martensitic stainless steel.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 9/10, p. 6747, doi. 10.1007/s00170-022-09139-7
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- Article
Mechanism of gradient strengthening layer formation based on microstructure and microhardness of Inconel 718 grinding surface.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 3/4, p. 2363, doi. 10.1007/s00170-022-08857-2
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- Article
Mechanical model of thrust force and torque in longitudinal-torsional coupled ultrasonic-assisted drilling of CFRP.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 1/2, p. 189, doi. 10.1007/s00170-021-08192-y
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- Article
Precision polishing of the mandrel for X-ray grazing incidence mirrors.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 118, n. 1/2, p. 43, doi. 10.1007/s00170-021-07185-1
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- Article
FEM-based optimization approach to machining strategy for thin-walled parts made of hard and brittle materials.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 110, n. 5/6, p. 1399, doi. 10.1007/s00170-020-05975-7
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- Article
Effects of tool edge radius on chip formation during the micromachining of pure iron.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 7/8, p. 2121, doi. 10.1007/s00170-020-05528-y
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- Article
Study on influence of grinding depth and grain shape on grinding damage of K9 glass by SPH simulation.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 106, n. 1/2, p. 333, doi. 10.1007/s00170-019-04649-3
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- Article
Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 11, p. 4483, doi. 10.1007/s00170-018-03279-5
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- Article
Study of the influence of tool rake angle in ductile machining of optical quartz glass.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 104, n. 1-4, p. 803, doi. 10.1007/s00170-019-03920-x
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- Article
Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 9-12, p. 2257, doi. 10.1007/s00170-018-2256-7
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- Article
A high-efficient precision grinding for fabricating moderately thick plane mirror (MTPM).
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- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 5-8, p. 2559, doi. 10.1007/s00170-018-1793-4
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- Article
Model for surface topography prediction in mirror-milling of aircraft skin parts.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 95, n. 5-8, p. 2259, doi. 10.1007/s00170-017-1368-9
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- Article
Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction.
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- International Journal of Advanced Manufacturing Technology, 2017, v. 93, n. 5-8, p. 2827, doi. 10.1007/s00170-017-0676-4
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- Article
A novel approach of high-performance grinding using developed diamond wheels.
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- International Journal of Advanced Manufacturing Technology, 2017, v. 91, n. 9-12, p. 3315, doi. 10.1007/s00170-017-0037-3
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- Article
Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel.
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- International Journal of Advanced Manufacturing Technology, 2016, v. 83, n. 5-8, p. 1231, doi. 10.1007/s00170-015-7584-2
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- Article
A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad.
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- International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 1-4, p. 107, doi. 10.1007/s00170-014-6438-7
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- Article
A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chemical mechanical polishing.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 69, n. 5-8, p. 1009, doi. 10.1007/s00170-013-5108-5
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- Article
Modeling and investigation on wafer shape in wafer rotational grinding method.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 64, n. 5-8, p. 707, doi. 10.1007/s00170-012-4040-4
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- Article
Study on Adhesion Properties and Process Parameters of Electroless Deposited Ni-P Alloy for PEEK and Its Modified Materials.
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- Coatings (2079-6412), 2023, v. 13, n. 2, p. 388, doi. 10.3390/coatings13020388
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- Article