Found: 28
Select item for more details and to access through your institution.
Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate.
- Published in:
- Journal of Functional Materials / Gongneng Cailiao, 2018, v. 49, n. 2, p. 02163, doi. 10.3969/j.issn.1001-9731.2018.02.028
- By:
- Publication type:
- Article
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint.
- Published in:
- Applied Physics A: Materials Science & Processing, 2020, v. 126, n. 4, p. 1, doi. 10.1007/s00339-020-03483-9
- By:
- Publication type:
- Article
Mechanical properties of CoSn<sub>2</sub> and α-CoSn<sub>3</sub> intermetallic compounds: first-principles calculations and nano-indentation measurements.
- Published in:
- Applied Physics A: Materials Science & Processing, 2019, v. 125, n. 3, p. 1, doi. 10.1007/s00339-019-2517-9
- By:
- Publication type:
- Article
Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu-Co dual-phase substrate.
- Published in:
- Applied Physics A: Materials Science & Processing, 2018, v. 124, n. 7, p. 1, doi. 10.1007/s00339-018-1907-8
- By:
- Publication type:
- Article
Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder.
- Published in:
- Applied Physics A: Materials Science & Processing, 2018, v. 124, n. 4, p. 1, doi. 10.1007/s00339-018-1736-9
- By:
- Publication type:
- Article
Influence of Zn additions on the interfacial reaction and microstructure of Sn37Pb/Cu solder joints.
- Published in:
- Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 10, p. 1, doi. 10.1007/s00339-017-1244-3
- By:
- Publication type:
- Article
Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate.
- Published in:
- Applied Physics A: Materials Science & Processing, 2016, v. 122, n. 4, p. 1, doi. 10.1007/s00339-016-9893-1
- By:
- Publication type:
- Article
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2019, v. 50, n. 1, p. 480, doi. 10.1007/s11661-018-4983-7
- By:
- Publication type:
- Article
Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 2, p. 1, doi. 10.1007/s10854-024-11942-9
- By:
- Publication type:
- Article
Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 20, p. 1, doi. 10.1007/s10854-023-10959-w
- By:
- Publication type:
- Article
Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid–liquid electromigration.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 11, p. 1, doi. 10.1007/s10854-023-10284-2
- By:
- Publication type:
- Article
Research on Bi contents addition into Sn–Cu-based lead-free solder alloy.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15586, doi. 10.1007/s10854-022-08464-7
- By:
- Publication type:
- Article
Enhanced mechanical properties and corrosion behavior of Zn–30Sn–2Cu high-temperature lead-free solder alloy by adding Sm.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6469, doi. 10.1007/s10854-022-07821-w
- By:
- Publication type:
- Article
Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28108, doi. 10.1007/s10854-021-07186-6
- By:
- Publication type:
- Article
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9
- By:
- Publication type:
- Article
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17336, doi. 10.1007/s10854-021-06256-z
- By:
- Publication type:
- Article
Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20232, doi. 10.1007/s10854-020-04543-9
- By:
- Publication type:
- Article
Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16437, doi. 10.1007/s10854-020-04196-8
- By:
- Publication type:
- Article
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2320, doi. 10.1007/s10854-019-02764-1
- By:
- Publication type:
- Article
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7
- By:
- Publication type:
- Article
Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1907, doi. 10.1007/s10854-018-0464-4
- By:
- Publication type:
- Article
Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn-Cu-Ni solders.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 21, p. 18840, doi. 10.1007/s10854-018-0009-x
- By:
- Publication type:
- Article
Effect of Cu<sub>6</sub>Sn<sub>5</sub> nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15983, doi. 10.1007/s10854-018-9684-x
- By:
- Publication type:
- Article
Interfacial microstructure evolution and shear strength of Sn0.7Cu-xNi/Cu solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11314, doi. 10.1007/s10854-018-9219-5
- By:
- Publication type:
- Article
Interfacial reaction between liquid-state Sn-xBi solder and Co substrate.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9155, doi. 10.1007/s10854-018-8943-1
- By:
- Publication type:
- Article
Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8863, doi. 10.1007/s10854-018-8904-8
- By:
- Publication type:
- Article
The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18515, doi. 10.1007/s10854-017-7799-0
- By:
- Publication type:
- Article
Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4245, doi. 10.1007/s10854-016-4288-9
- By:
- Publication type:
- Article