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The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 196, doi. 10.1007/s11664-019-07481-3
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- Publication type:
- Article
Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints.
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- Journal of Electronic Materials, 2019, v. 48, n. 10, p. 6866, doi. 10.1007/s11664-019-07428-8
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- Article
Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development.
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- 2019
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- Publication type:
- Abstract
Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development.
- Published in:
- 2018
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- Publication type:
- Abstract
Refinement of the <italic>β</italic>-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu Solder Joints with Cu-Based and Ni-Based Substrates.
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- Journal of Electronic Materials, 2018, v. 47, n. 5, p. 2911, doi. 10.1007/s11664-018-6162-4
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- Article
Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper.
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- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3934, doi. 10.1007/s11664-015-3865-7
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- Article
Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 757, doi. 10.1007/s11664-012-1925-9
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- Article
Cu Substrates with Different Grain Sizes.
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- Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1549, doi. 10.1007/s11664-011-1646-5
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- Article
Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2558, doi. 10.1007/s11664-010-1370-6
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- Article
Microstructural Variation and Phase Evolution in the Reaction of Sn- xAg-Cu Solders and Cu- yZn Substrates During Reflow.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2627, doi. 10.1007/s11664-010-1349-3
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- Publication type:
- Article
Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- xNi/Au/Ni Sandwich Structures.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2544, doi. 10.1007/s11664-010-1372-4
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- Article
Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2522, doi. 10.1007/s11664-010-1371-5
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- Publication type:
- Article
Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 283, doi. 10.1007/s11664-009-1014-x
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- Article
Interfacial Reaction of Sn and Cu- xZn Substrates After Reflow and Thermal Aging.
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- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 230, doi. 10.1007/s11664-009-0992-z
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- Publication type:
- Article
Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2496, doi. 10.1007/s11664-009-0940-y
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- Article
Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2534, doi. 10.1007/s11664-009-0933-x
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- Publication type:
- Article
Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni- xCu/Ti Underbump Metallization After Various Reflows.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2543, doi. 10.1007/s11664-009-0943-8
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- Article
Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1469, doi. 10.1007/s11664-007-0253-y
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- Publication type:
- Article
Inhibiting AuSn<sub>4</sub> Formation by Controlling the Interfacial Reaction in Solder Joints.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1476, doi. 10.1007/s11664-007-0282-6
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- Article
Diffusion Behavior of Cu in Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints in Flip Chip Technology.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2164, doi. 10.1007/s11664-006-0327-2
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- Article
Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2061, doi. 10.1007/s11664-006-0314-7
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- Publication type:
- Article
Revealing the Nucleation and Growth Mechanism of a Novel Solder Developed from Sn-3.5Ag-0.5Cu Nanoparticles by a Chemical Reduction Method.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1755, doi. 10.1007/s11664-006-0230-x
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- Publication type:
- Article
Influence of Cu Content on Compound Formation near the Chip Side for the Flip-Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1745, doi. 10.1007/s11664-006-0229-3
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- Article
Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1665, doi. 10.1007/s11664-006-0215-9
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- Publication type:
- Article
Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu<sub>6</sub>Sn<sub>5</sub> Addition.
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- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 486, doi. 10.1007/BF02690536
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- Article
Influence of Ni Concentration and Ni<sub>3</sub>Sn<sub>4</sub> Nanoparticles on Morphology of Sn-Ag-Ni Solders by Mechanical Alloying.
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- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 494, doi. 10.1007/BF02690537
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- Article
Phase Distribution and Phase Analysis in Cu<sub>6</sub>Sn<sub>5</sub>, Ni<sub>3</sub>Sn<sub>4</sub>, and the Sn-Rich Corner in the Ternary Sn-Cu-Ni Isotherm at 240°C.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 343, doi. 10.1007/BF02692455
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- Article
Characterization Technique in Phase Distribution during Sample Preparation for Applications to Solder Joints and Wire-Bonding Chips.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 333, doi. 10.1007/BF02692454
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- Article
Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453
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- Publication type:
- Article
Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-Bump Metallization after Various Reflow Cycles.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 81, doi. 10.1007/s11664-006-0188-8
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- Article
Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 7, doi. 10.1007/s11664-006-0177-y
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- Article
Structure and Soft Magnetic Properties of Fe-Co-Ni-Based Multicomponent Thin Films.
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- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1480, doi. 10.1007/s11664-005-0154-x
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- Article
Microstructure Evaluation and Mechanical Properties of Nanolayered Chromium Nitride/Tungsten Nitride Coating.
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- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1533, doi. 10.1007/s11664-005-0161-y
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- Publication type:
- Article
Interfacial Reactions and Compound Formation of Sn-Ag-Cu Solders by Mechanical Alloying on Electroless Ni-P/Cu Under Bump Metallization.
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- Journal of Electronic Materials, 2005, v. 34, n. 8, p. 1129, doi. 10.1007/s11664-005-0241-z
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- Publication type:
- Article
The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 68, doi. 10.1007/s11664-005-0182-6
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- Publication type:
- Article
Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1445, doi. 10.1007/s11664-004-0085-y
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- Publication type:
- Article
Mechanism of Interfacial Reaction for the Sn-Pb Solder Bump with Ni/Cu Under-Bump Metallization in Flip-Chip Technology.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1118, doi. 10.1007/s11664-004-0113-y
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- Publication type:
- Article
The Nanoindentation Characteristics of Cu<sub>6</sub>Sn<sub>5</sub>, Cu<sub>3</sub>Sn, and Ni<sub>3</sub>Sn<sub>4</sub> Intermetallic Compounds in the Solder Bump.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1103, doi. 10.1007/s11664-004-0111-0
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- Article
Soldering-Induced Cu Diffusion and Intermetallic Compound Formation between Ni/Cu Under Bump Metallization and SnPb Flip-Chip Solder Bumps.
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- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 283, doi. 10.1007/s11664-004-0134-6
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- Publication type:
- Article
Nano-to-Microdesign of Marimo-Like Carbon Nanotubes Supported Frameworks via In-spaced Polymerization for High Performance Silicon Lithium Ion Battery Anodes.
- Published in:
- Small, 2015, v. 11, n. 19, p. 2314, doi. 10.1002/smll.201402952
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- Article
Effect of Ag addition on the mechanical properties of Cu/Ni/Sn/Ni/Cu microbump with a sub-10 micron bump thickness.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 28, p. 1, doi. 10.1007/s10854-024-13559-4
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- Publication type:
- Article
Low-Temperature Sintering and Microwave Dielectric Properties of Anorthite-Based Glass-Ceramics.
- Published in:
- Journal of the American Ceramic Society, 2002, v. 85, n. 9, p. 2230, doi. 10.1111/j.1151-2916.2002.tb00440.x
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- Publication type:
- Article
Crystallite Size and Microstrain of Thermally Aged Low-Ceria- and Low-Yttria-Doped Zirconia.
- Published in:
- Journal of the American Ceramic Society, 1998, v. 81, n. 4, p. 853, doi. 10.1111/j.1151-2916.1998.tb02419.x
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- Article
Coprecipitation and Hydrothermal Synthesis of Ultrafine 5.5 mol% CeO<sub>2</sub>-2 mol% YO<sub>1.5</sub>ZrO<sub>2</sub> Powders.
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- Journal of the American Ceramic Society, 1997, v. 80, n. 1, p. 92, doi. 10.1111/j.1151-2916.1997.tb02795.x
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- Publication type:
- Article
Electrical Behavior of Ceria-Stabilized Zirconia with Rare-Earth Oxide Additives.
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- Journal of the American Ceramic Society, 1990, v. 73, n. 4, p. 866, doi. 10.1111/j.1151-2916.1990.tb05127.x
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- Article
Equivalent Circuit Model in Grain-Boundary Barrier Layer Capacitors.
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- Journal of the American Ceramic Society, 1989, v. 72, n. 10, p. 1967, doi. 10.1111/j.1151-2916.1989.tb06008.x
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- Publication type:
- Article
Sintering, Microstructure, Hardness, and Fracture Toughness Behavior of Y<sub>2</sub>O<sub>3</sub>-CeO<sub>2</sub>-ZrO<sub>2</sub>.
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- Journal of the American Ceramic Society, 1988, v. 71, n. 10, p. 813, doi. 10.1111/j.1151-2916.1988.tb07528.x
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- Publication type:
- Article
Ag Whisker Formation in Ag-In-Se Alloys.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2013, v. 44, n. 12, p. 5281, doi. 10.1007/s11661-013-2030-2
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- Publication type:
- Article
Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3016, doi. 10.1007/s10854-021-07501-1
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- Publication type:
- Article
Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 2, p. 2639, doi. 10.1007/s10854-020-05039-2
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- Publication type:
- Article