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Investigation of interfacial reaction and joint reliability between eutectic Snâ3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 5, p. 559, doi. 10.1007/s10854-006-9085-4
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- Article
MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER.
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- Surface Review & Letters, 2007, v. 14, n. 4, p. 827, doi. 10.1142/S0218625X07010111
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- Article