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Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 25, p. 1, doi. 10.1007/s10854-024-13436-0
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- Article
Effects of Tumor Necrosis Factor Inhibitor on Serum Level of HLA-B27 and PDCD-1 in Patients with Ankylosing Spondylitis.
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- Cell Biochemistry & Biophysics, 2014, v. 70, n. 2, p. 1453, doi. 10.1007/s12013-014-0082-6
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- Article
Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4245, doi. 10.1007/s10854-016-4288-9
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- Article
A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5140, doi. 10.1007/s10854-015-3042-z
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- Article
Effect of alloying Cu substrate on microstructure and coarsening behavior of CuSn grains of soldered joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2782, doi. 10.1007/s10854-015-2759-z
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- Article
Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2416, doi. 10.1007/s10854-014-1883-5
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- Article
Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3
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- Article
Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 57, doi. 10.1007/s10854-013-1548-9
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- Article
Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2027, doi. 10.1007/s10854-012-1052-7
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- Article
Optimal Contact Position of Subthalamic Nucleus Deep Brain Stimulation for Reducing Restless Legs Syndrome in Parkinson's Disease Patients: One-Year Follow-Up with 33 Patients.
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- Brain Sciences (2076-3425), 2022, v. 12, n. 12, p. 1645, doi. 10.3390/brainsci12121645
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- Article
Energy Transfer Processes in NaBiF<sub>4</sub> Nanocrystals Co‐Doped with Tb<sup>3+</sup> and Eu<sup>3+</sup> Dispersed in Aqueous Solution.
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- European Journal of Inorganic Chemistry, 2024, v. 27, n. 24, p. 1, doi. 10.1002/ejic.202400144
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- Article
The Effect of High-Frequency Electrical Stimulation of Bilateral Nucleus Accumbens on the Behavior of Morphine-Induced Conditioned Place Preference Rats at Extinction and Reinstatement Phases.
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- Evidence-based Complementary & Alternative Medicine (eCAM), 2020, p. 1, doi. 10.1155/2020/8232809
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- Article
Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 2, p. 1, doi. 10.1007/s10854-024-11942-9
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- Article
Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 20, p. 1, doi. 10.1007/s10854-023-10959-w
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- Article
Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid–liquid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 11, p. 1, doi. 10.1007/s10854-023-10284-2
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- Article
Research on Bi contents addition into Sn–Cu-based lead-free solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15586, doi. 10.1007/s10854-022-08464-7
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- Article
Enhanced mechanical properties and corrosion behavior of Zn–30Sn–2Cu high-temperature lead-free solder alloy by adding Sm.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6469, doi. 10.1007/s10854-022-07821-w
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- Article
Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28108, doi. 10.1007/s10854-021-07186-6
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Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9
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Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17336, doi. 10.1007/s10854-021-06256-z
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Effect of ultrasonic treatment on interfacial reactions and microstructure of SnCr/CuFeNiCoCr solder joints.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 15352, doi. 10.1007/s10854-021-06085-0
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- Article
Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22810, doi. 10.1007/s10854-020-04806-5
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- Article
Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20232, doi. 10.1007/s10854-020-04543-9
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- Article
Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16437, doi. 10.1007/s10854-020-04196-8
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- Article
Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15086, doi. 10.1007/s10854-020-04072-5
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- Article
Influences of different barrier films on microstructures and electrical properties of Bi<sub>2</sub>Te<sub>3</sub>-based joints.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14714, doi. 10.1007/s10854-020-04035-w
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- Article
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11470, doi. 10.1007/s10854-020-03695-y
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- Article
Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 3876, doi. 10.1007/s10854-020-02933-7
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- Article
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2320, doi. 10.1007/s10854-019-02764-1
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- Article
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 24, p. 21126, doi. 10.1007/s10854-019-02483-7
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- Article
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi<sub>2</sub>(Te,Se)<sub>3</sub> thermoelectric material.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6
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- Article
Effect of Cu<sub>6</sub>Sn<sub>5</sub> nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14726, doi. 10.1007/s10854-019-01844-6
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- Article
Effect of flux doped with Cu<sub>6</sub>Sn<sub>5</sub> nanoparticles on the interfacial reaction of lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11552, doi. 10.1007/s10854-019-01512-9
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- Article
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7
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- Article
Effects of co-activator species and transition metal ions doping on structure and fluorescence properties of strontium aluminate phosphors.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3804, doi. 10.1007/s10854-019-00664-y
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- Article
Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1907, doi. 10.1007/s10854-018-0464-4
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- Article
Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1519, doi. 10.1007/s10854-018-0423-0
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- Article
Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1434, doi. 10.1007/s10854-018-0413-2
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Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn-Cu-Ni solders.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 21, p. 18840, doi. 10.1007/s10854-018-0009-x
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- Article
Effect of Cu<sub>6</sub>Sn<sub>5</sub> nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15983, doi. 10.1007/s10854-018-9684-x
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- Article
Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13914, doi. 10.1007/s10854-018-9524-z
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- Article
Interfacial microstructure evolution and shear strength of Sn0.7Cu-xNi/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11314, doi. 10.1007/s10854-018-9219-5
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- Article
Interfacial reaction between liquid-state Sn-xBi solder and Co substrate.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9155, doi. 10.1007/s10854-018-8943-1
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- Article
Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8863, doi. 10.1007/s10854-018-8904-8
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- Article
The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18515, doi. 10.1007/s10854-017-7799-0
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- Article
Prospective study of the effect of teriparatide on pedicle screw loosening after lumbar spinal fusion surgery in postmenopausal women with osteoporosis.
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- Chinese Journal of Osteoporosis, 2014, v. 20, n. 3, p. 285, doi. 10.3969/j.issn.1006-7108.2014.03.016
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- Article
Analysis of Contact Position for Subthalamic Nucleus Deep Brain Stimulation-Induced Hyperhidrosis.
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- Parkinson's Disease (20420080), 2019, p. 1, doi. 10.1155/2019/8180123
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- Article
Programming for Stimulation-Induced Transient Nonmotor Psychiatric Symptoms after Bilateral Subthalamic Nucleus Deep Brain Stimulation for Parkinson’s Disease.
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- Parkinson's Disease (20420080), 2017, p. 1, doi. 10.1155/2017/2615619
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- Article
Heterologous expression and activity studying of a nisin resistance gene in Lactobacillus delbrueckii subsp. bulgaricus.
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- Journal of Experimental & Integrative Medicine, 2013, v. 3, n. 2, p. 145, doi. 10.5455/jeim.130213.or.059
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- Article
Microstructure, Mechanical Properties, and Corrosion Behavior of a Novel Biodegradable Zn–2Sn–0.5Sr Implant Alloy Prepared by Ultrasonic Treatment.
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- International Journal of Metalcasting, 2023, v. 17, n. 4, p. 3104, doi. 10.1007/s40962-023-00993-z
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- Article