Found: 11
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Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for Ultrahigh-Voltage Device Applications.
- Published in:
- Micromachines, 2021, v. 12, n. 12, p. 1575, doi. 10.3390/mi12121575
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- Article
Three‐dimensional printing technologies for terahertz applications: A review.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2020, v. 30, n. 1, p. N.PAG, doi. 10.1002/mmce.21983
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- Article
Boosting the electron beam transmittance of field emission cathode using a self-charging gate.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-45142-0
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- Article
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer.
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- Sensors (14248220), 2020, v. 20, n. 4, p. 1186, doi. 10.3390/s20041186
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- Article
Scale Factor Calibration for a Rotating Accelerometer Gravity Gradiometer.
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- Sensors (14248220), 2018, v. 18, n. 12, p. 4386, doi. 10.3390/s18124386
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- Article
Real‐Time THz Beam Profiling and Monitoring via Flexible Vertically Aligned Carbon Nanotube Arrays.
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- Advanced Optical Materials, 2022, v. 10, n. 21, p. 1, doi. 10.1002/adom.202201363
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- Article
MEMS‐based 3‐C borehole gravimeter development.
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- Geophysical Prospecting, 2023, v. 71, n. 4, p. 734, doi. 10.1111/1365-2478.13272
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- Article
A Flexible and Ultra‐Wideband Terahertz Wave Absorber Based on Pyramid‐Shaped Carbon Nanotube Array via Femtosecond‐Laser Microprocessing and Two‐Step Transfer Technique.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 11, p. 1, doi. 10.1002/admi.202102414
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- Article
Secure thermal infrared communications using engineered blackbody radiation.
- Published in:
- Scientific Reports, 2014, p. 1, doi. 10.1038/srep05245
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- Article
A Broadband Planar Quasi-Yagi Antenna with a Modified Bow-Tie Driver for Multi-Band 3G/4G Applications.
- Published in:
- Progress in Electromagnetics Research C, 2017, v. 71, p. 59, doi. 10.2528/pierc16101601
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- Article
An Ultra-Wideband THz/IR Metamaterial Absorber Based on Doped Silicon.
- Published in:
- Materials (1996-1944), 2018, v. 11, n. 12, p. 2590, doi. 10.3390/ma11122590
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- Article