Found: 5
Select item for more details and to access through your institution.
Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 19, p. 1, doi. 10.1007/s10854-024-13132-z
- By:
- Publication type:
- Article
A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 28, p. 1, doi. 10.1007/s10854-023-11419-1
- By:
- Publication type:
- Article
Comparative study of solder size and volume effect on properties of Sn–3.0Ag–0.5Cu joints during isothermal aging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 16, p. 1, doi. 10.1007/s10854-023-10748-5
- By:
- Publication type:
- Article
Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10002, doi. 10.1007/s10854-022-07991-7
- By:
- Publication type:
- Article
Thermal conductivity enhancement in electrospun poly(vinyl alcohol) and poly(vinyl alcohol)/cellulose nanocrystal composite nanofibers.
- Published in:
- Scientific Reports, 2019, v. 9, n. 1, p. 1, doi. 10.1038/s41598-019-39825-8
- By:
- Publication type:
- Article