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DCTPP1, an Oncogene Regulated by miR-378a-3p, Promotes Proliferation of Breast Cancer via DNA Repair Signaling Pathway.
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- Frontiers in Oncology, 2021, v. 11, p. 1, doi. 10.3389/fonc.2021.641931
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- Article
Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6194, doi. 10.1007/s10854-015-3202-1
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- Article
Creep behavior of SnAgCu solders containing nano-Al particles.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3615, doi. 10.1007/s10854-015-2876-8
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- Article
Wettability optimization analysis of lead-free solders with Taguchi method.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2605, doi. 10.1007/s10854-015-2730-z
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- Article
Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4489, doi. 10.1007/s10854-014-2192-8
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- Article
Reliability behavior of lead-free solder joints in electronic components.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y
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- Article
Effect of Zn on properties and microstructure of SnAgCu alloy.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 11, p. 1950, doi. 10.1007/s10854-012-0686-9
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- Article
Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method.
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- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 6, p. 405, doi. 10.1515/ijnsns-2014-0062
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- Article
Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging.
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- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 3/4, p. 197, doi. 10.1515/ijnsns-2012-0063
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- Article