Found: 2
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Through-Silicon Vias and 3D Inductors for RF Applications.
- Published in:
- Microwave Journal, 2014, v. 57, n. 2, p. 80
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- Publication type:
- Article
A Micromachined Coupled-Cantilever for Piezoelectric Energy Harvesters.
- Published in:
- Micromachines, 2018, v. 9, n. 5, p. 252, doi. 10.3390/mi9050252
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- Publication type:
- Article