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Atomistic simulation of mechanical behavior of Cu/Cu<sub>3</sub>Sn solder interface with Kirkendall void under shear and tensile deformation.
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- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 4, p. 1, doi. 10.1007/s00339-023-06558-5
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- Article
Effects of sp<sup>3</sup> bond ratio and modulation ratios on nanotribology behaviors of diamond-like carbon coatings investigated using atomistic nanoscratching simulations.
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- Journal of Molecular Modeling, 2024, v. 30, n. 2, p. 1, doi. 10.1007/s00894-024-05832-4
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- Article
Simulation and experimental analysis of nanoindentation and mechanical properties of amorphous NiAl alloys.
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- Journal of Molecular Modeling, 2015, v. 21, n. 6, p. 1, doi. 10.1007/s00894-015-2714-1
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- Article