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Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 257, doi. 10.1007/s11664-019-07752-z
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- Publication type:
- Article
Biomimetic Syntheses of (±)‐Isopalhinine A, (±)‐Palhinine A, and (±)‐Palhinine D.
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- Angewandte Chemie, 2018, v. 130, n. 47, p. 15798, doi. 10.1002/ange.201809130
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- Article
71‐3: Static Laser Phosphor for Projectors with Rotating Tilted Mirror.
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- SID Symposium Digest of Technical Papers, 2022, v. 53, n. 1, p. 956, doi. 10.1002/sdtp.15654
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- Publication type:
- Article
Biomimetic Syntheses of (±)‐Isopalhinine A, (±)‐Palhinine A, and (±)‐Palhinine D.
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- Angewandte Chemie International Edition, 2018, v. 57, n. 47, p. 15572, doi. 10.1002/anie.201809130
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- Article
Glycoproteomic analysis and molecular modeling of haptoglobin multimers.
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- Electrophoresis, 2011, v. 32, n. 12, p. 1422, doi. 10.1002/elps.201000464
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- Article
Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration.
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- Scientific Reports, 2023, v. 12, n. 1, p. 1, doi. 10.1038/s41598-023-27669-2
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- Publication type:
- Article
Primary Tumor Volume Is an Independent Predictor of Outcome Within pT4a-Staged Tongue Carcinoma.
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- Annals of Surgical Oncology: An Oncology Journal for Surgeons, 2011, v. 18, n. 5, p. 1447, doi. 10.1245/s10434-010-1489-y
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- Article
Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 170, doi. 10.1007/s11664-018-6577-y
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- Article
Electrodeposition of Ni on BiTe and Interfacial Reaction Between Sn and Ni-Coated BiTe.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 27, doi. 10.1007/s11664-017-5777-1
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- Article
Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6192, doi. 10.1007/s11664-016-4719-7
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- Article
Phase Equilibria of the Fe-Ni-Sn Ternary System at 270°C.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6208, doi. 10.1007/s11664-016-4787-8
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- Publication type:
- Article
Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing.
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- Journal of Electronic Materials, 2016, v. 45, n. 10, p. 4813, doi. 10.1007/s11664-016-4708-x
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- Publication type:
- Article
Interfacial Reactions in Sn/Ni- xW Couples.
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- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 909, doi. 10.1007/s11664-014-3573-8
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- Article
Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn.
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- Journal of Electronic Materials, 2015, v. 44, n. 1, p. 511, doi. 10.1007/s11664-014-3448-z
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- Article
Interfacial Reactions of High-Bi Alloys on Various Substrates.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 155, doi. 10.1007/s11664-013-2703-z
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- Publication type:
- Article
Interfacial Reactions and Mechanical Properties of Bi- x wt.%Sn/Cu Joints ( x = 2, 5, 10).
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- Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3303, doi. 10.1007/s11664-012-2230-3
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- Article
Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2470, doi. 10.1007/s11664-012-2072-z
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- Publication type:
- Article
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing.
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- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1943, doi. 10.1007/s11664-011-1684-z
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- Publication type:
- Article
Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2618, doi. 10.1007/s11664-010-1354-6
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- Article
Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2418, doi. 10.1007/s11664-010-1337-7
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- Article
Foreword.
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- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2211, doi. 10.1007/s11664-009-0935-8
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- Publication type:
- Article
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3
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- Publication type:
- Article
Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress.
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- Journal of Electronic Materials, 2009, v. 38, n. 3, p. 415, doi. 10.1007/s11664-008-0619-9
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- Publication type:
- Article
Foreword.
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- 2009
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- Publication type:
- Editorial
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 61, doi. 10.1007/s11664-008-0554-9
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- Publication type:
- Article
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 193, doi. 10.1007/s11664-008-0564-7
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- Publication type:
- Article
Simultaneous quantification of methylated purines in DNA by isotope dilution LC-MS/MS coupled with automated solid-phase extraction.
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- Analytical & Bioanalytical Chemistry, 2012, v. 402, n. 3, p. 1199, doi. 10.1007/s00216-011-5559-1
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- Publication type:
- Article
Hierarchical Structure-Within-Structure Morphologies in A<sub>2</sub>- star-(B- alt-C) Molecules.
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- ChemPhysChem, 2007, v. 8, n. 18, p. 2588, doi. 10.1002/cphc.200700390
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- Publication type:
- Article
Cover Picture: Hierarchical Structure-Within-Structure Morphologies in A<sub>2</sub>- star-(B- alt-C) Molecules (ChemPhysChem 18/2007).
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- ChemPhysChem, 2007, v. 8, n. 18, p. 2545, doi. 10.1002/cphc.200790061
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- Article
Wnt5a is a crucial regulator of neurogenesis during cerebellum development.
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- Scientific Reports, 2017, p. 42523, doi. 10.1038/srep42523
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- Article
A Combined Preventive Maintenance Strategy for Bearings to Accomplish the Failure Prevention of Rotating Equipment.
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- Journal of Failure Analysis & Prevention, 2022, v. 22, n. 4, p. 1457, doi. 10.1007/s11668-022-01415-8
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- Publication type:
- Article
MRI-derived tumor thickness: an important predictor of outcome for T4a-staged tongue carcinoma.
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- European Archives of Oto-Rhino-Laryngology, 2012, v. 269, n. 3, p. 959, doi. 10.1007/s00405-011-1685-9
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- Publication type:
- Article
Real-Time Video Smoke Detection Based on Deep Domain Adaptation for Injection Molding Machines.
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- Mathematics (2227-7390), 2023, v. 11, n. 17, p. 3728, doi. 10.3390/math11173728
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- Article
Enhancing programming learning performance through a Jigsaw collaborative learning method in a metaverse virtual space.
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- International Journal of STEM Education, 2024, v. 11, n. 1, p. 1, doi. 10.1186/s40594-024-00495-2
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- Article
Recent advances in total synthesis of natural products by masked ortho‐benzoquinones.
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- Journal of the Chinese Chemical Society, 2022, v. 69, n. 8, p. 1210, doi. 10.1002/jccs.202200276
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- Article
An experimental study on the torsional stiffness and limit torque of a jaw coupling with consideration of spacer's hardness and installation methods.
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- Journal of Mechanics, 2022, v. 38, p. 195, doi. 10.1093/jom/ufac018
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- Publication type:
- Article
Natural product myricetin is a pan-KDM4 inhibitor which with poly lactic-co-glycolic acid formulation effectively targets castration-resistant prostate cancer.
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- Journal of Biomedical Science, 2022, v. 29, n. 1, p. 1, doi. 10.1186/s12929-022-00812-3
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- Article
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers.
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- Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 8, p. 3971, doi. 10.1007/s11661-016-3591-7
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- Article
Strong Anisotropic Effects of p-Type BiTe Element on the BiTe/Sn Interfacial Reactions.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 6, p. 2372, doi. 10.1007/s11661-015-2853-0
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- Article
Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 5, p. 1834, doi. 10.1007/s11661-015-2825-4
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- Publication type:
- Article
Retardation of the CuZn Phase Fracture and Improvement of Shear Strength of the Sn-9 wt pct Zn/Cu Interface by Inserting an Electroless Palladium Layer.
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- Metallurgical & Materials Transactions. Part A, 2013, v. 44, n. 1, p. 125, doi. 10.1007/s11661-012-1377-0
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- Article
Phase Equilibria of Sn-Co-Cu Ternary System.
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- Metallurgical & Materials Transactions. Part A, 2012, v. 43, n. 10, p. 3586, doi. 10.1007/s11661-012-1192-7
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- Publication type:
- Article
Effect of Sn Grain Orientation on the CuSn Formation in a Sn-Based Solder Under Current Stressing.
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- Metallurgical & Materials Transactions. Part A, 2012, v. 43, n. 8, p. 2571, doi. 10.1007/s11661-012-1276-4
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- Publication type:
- Article
BER Analysis Using Beat Probability Method of 3D Optical CDMA Networks with Double Balanced Detection.
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- Mathematical Problems in Engineering, 2015, v. 2015, p. 1, doi. 10.1155/2015/456829
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- Publication type:
- Article
A novel concept for finding proper orthogonal wavelets effectively to solve a large object scattering problem.
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- Radio Science, 2003, v. 38, n. 2, p. n/a, doi. 10.1029/2001RS002475
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- Article
Ion Extrusion Systems in Bacteria.
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- Annals of the New York Academy of Sciences, 1985, v. 456, n. 1, p. 235, doi. 10.1111/j.1749-6632.1985.tb14870.x
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- Article
Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 9, p. 3012, doi. 10.1007/s11837-019-03576-8
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- Publication type:
- Article
Thermal and angular dependence of next‐generation photovoltaics under indoor lighting.
- Published in:
- Progress in Photovoltaics, 2020, v. 28, n. 2, p. 111, doi. 10.1002/pip.3211
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- Article
Cover Image.
- Published in:
- Progress in Photovoltaics, 2020, v. 28, n. 2, p. i, doi. 10.1002/pip.3247
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- Publication type:
- Article
Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore.
- Published in:
- Progress in Photovoltaics, 2015, v. 23, n. 1, p. 106, doi. 10.1002/pip.2407
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- Publication type:
- Article