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Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications.
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- Advanced Engineering Materials, 2023, v. 25, n. 20, p. 1, doi. 10.1002/adem.202300439
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- Article
Assessing Current‐Carrying Capacity of Aerosol Jet Printed Conductors.
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- Advanced Engineering Materials, 2020, v. 22, n. 11, p. 1, doi. 10.1002/adem.202000520
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- Article
Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling.
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- Journal of Electronic Materials, 2018, v. 47, n. 5, p. 2752, doi. 10.1007/s11664-018-6129-5
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- Article
A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 5, p. 2526, doi. 10.1007/s11664-018-6121-0
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- Article
Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4472, doi. 10.1007/s11664-014-3436-3
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- Article
Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on CuSn Voiding.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 302, doi. 10.1007/s11664-011-1764-0
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- Article
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 241, doi. 10.1007/s11664-011-1762-2
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- Article
The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 78, doi. 10.1007/s11837-011-0180-5
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- Article
Early transient creep of single crystal SnAgCu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13657, doi. 10.1007/s10854-022-08300-y
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- Article