Found: 5
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The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics.
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- Journal of Engineering Education, 2000, v. 89, n. 4, p. 423, doi. 10.1002/j.2168-9830.2000.tb00547.x
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- Article
Co‐design of micro‐fluidic heat sink and thermal through‐silicon‐vias for cooling of three‐dimensional integrated circuit.
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- IET Circuits, Devices & Systems (Wiley-Blackwell), 2013, v. 7, n. 5, p. 223, doi. 10.1049/iet-cds.2013.0026
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- Article
Superlattice-based thin-film thermoelectric modules with high cooling fluxes.
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- Nature Communications, 2016, v. 7, n. 1, p. 10302, doi. 10.1038/ncomms10302
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- Article
Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 22, p. 11071, doi. 10.3390/app112211071
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- Article
Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 3, p. 77, doi. 10.4071/imaps.456518
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- Article