Found: 5
Select item for more details and to access through your institution.
Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 7, p. 4655, doi. 10.1007/s11664-023-10394-x
- By:
- Publication type:
- Article
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x
- By:
- Publication type:
- Article
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB).
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 263, doi. 10.1007/s11664-020-08525-9
- By:
- Publication type:
- Article
A review of technology, materials and R&D challenges of upper limb prosthesis for improved user suitability.
- Published in:
- Journal of Orthopaedics, 2021, v. 23, p. 88, doi. 10.1016/j.jor.2020.12.009
- By:
- Publication type:
- Article
Effect of Relative Density on Compressive Load Response of Crumpled Aluminium Foil Mesh.
- Published in:
- Materials (1996-1944), 2019, v. 12, n. 23, p. 4018, doi. 10.3390/ma12234018
- By:
- Publication type:
- Article