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- Title
PCB 化学镀镍层改性对置换镀金的影响.
- Authors
郑沛峰; 胡光辉; 路培培; 崔子雅; 潘湛昌; 张波
- Abstract
Prior to immersion gold plating, the electrolessly plated Ni coating or Pd coating was modified with a solution composed of chloric acid and copper(II) chloride, a solution composed sulfuric acid and hydrogen peroxide, or a cerium(IV) sulfate solution. The effects of the solution composition, temperature, and time for the modification on the thickness of Au coating (i.e. Au deposition rate) were studied. The optimized modification temperature and time were 50 °C and 4 min, respectively. The micromorphologies and phase structure of Au coating deposited on the Ni coating modified with different solutions were compared. The results showed that the surface modification of Ni coating had not only no corrosive attack to itself, but also no impact on the preferred orientation of Au coating, while had certain influence on the average grain size of Au coating. The deposition of gold during immersion plating could be increased significantly if the Ni coating was modified with the solution composed of chloric acid and copper(II) chloride or the cerium(IV) sulfate solution.
- Subjects
NICKEL-plating; GOLD; COPPER chlorides; HYDROGEN peroxide; GRAIN size; CERIUM; SURFACE coatings
- Publication
Electroplating & Finishing, 2022, Vol 41, Issue 17, p1256
- ISSN
1004-227X
- Publication type
Article
- DOI
10.19289/j.1004-227x.2022.17.011