Found: 175
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Statistical Analysis of Thermal Treatment Effect of SMD Ni-RTD Batch Sensors and Its Direct Application Without Packaging for a Contact Thermometer.
- Published in:
- Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1481, doi. 10.1007/s11664-022-09440-x
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- Publication type:
- Article
Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.
- Published in:
- Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810
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- Publication type:
- Article
Comments on the IPC Surface Mount Attachment Reliability Guidelines.
- Published in:
- Quality & Reliability Engineering International, 2005, v. 21, n. 4, p. 345, doi. 10.1002/qre.667
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- Publication type:
- Article
TOTAL QUALITY CONTROL FOR A SURFACE MOUNT TECHNOLOGY PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARD ASSEMBLIES.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 5, p. 325, doi. 10.1002/qre.4680110503
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- Publication type:
- Article
MIL-HDBK-217 Status.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 5, p. 511
- Publication type:
- Article
Surface Mount Technology Guidelines.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 6, p. 514
- Publication type:
- Article
Surface Mount Technology.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 4, p. 351
- Publication type:
- Article
Scientific Guide to Surface Mount Technology (Book).
- Published in:
- 1989
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- Publication type:
- Book Review
Surface Mount Technology.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 4, p. 367
- Publication type:
- Article
THE EFFECT OF PRETINNING ON THE STRENGTH OF A CHIP CARRIER SOLDER JOINT.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 3, p. 215, doi. 10.1002/qre.4680040304
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- Publication type:
- Article
APPLICATION OF TAGUCHI METHODS TO SURFACE MOUNT PROCESSES.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 2, p. 171, doi. 10.1002/qre.4680040212
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- Publication type:
- Article
News Digest.
- Published in:
- Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 203, doi. 10.1002/qre.4680030311
- Publication type:
- Article
SURFACE MOUNT DIGITAL PACKAGE RELIABILITY.
- Published in:
- Quality & Reliability Engineering International, 1986, v. 2, n. 4, p. 229, doi. 10.1002/qre.4680020404
- By:
- Publication type:
- Article
Determining the RF resistance and Q-factor of air-core inductors.
- Published in:
- Microwave & Optical Technology Letters, 2001, v. 29, n. 2, p. 89, doi. 10.1002/mop.1093
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- Publication type:
- Article
Broadband array using surface-mounted monopole concept.
- Published in:
- Microwave & Optical Technology Letters, 1998, v. 19, n. 6, p. 455, doi. 10.1002/(SICI)1098-2760(19981220)19:6<455::AID-MOP19>3.0.CO;2-W
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- Publication type:
- Article
Surface-mounted monopole antenna.
- Published in:
- Microwave & Optical Technology Letters, 1997, v. 16, n. 6, p. 349, doi. 10.1002/(SICI)1098-2760(19971220)16:6<349::AID-MOP8>3.0.CO;2-K
- By:
- Publication type:
- Article
A genetic-based algorithm for the operational sequence of a high speed chip placement machine.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 9/10, p. 918, doi. 10.1007/s00170-006-0918-3
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- Publication type:
- Article
Design and control of a novel linear wire bonding head.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9
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- Publication type:
- Article
Automated inspection of PCB components using a genetic algorithm template-matching approach.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 3/4, p. 293, doi. 10.1007/s00170-006-0730-0
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- Publication type:
- Article
Printed circuit board scheduling in an openshop manufacturing environment.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 980, doi. 10.1007/s00170-005-2584-2
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- Publication type:
- Article
Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 5/6, p. 561, doi. 10.1007/s00170-004-2233-1
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- Publication type:
- Article
Locating and checking of BGA pins’ position using gray level.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 491, doi. 10.1007/s00170-003-1617-y
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- Publication type:
- Article
Optimal parameter design for chip-on-film technology using the Taguchi method.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 1/2, p. 145, doi. 10.1007/s00170-003-1824-6
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- Publication type:
- Article
Design of a Multi-Mode Hybrid Micro-Gripper for Surface Mount Technology Component Assembly.
- Published in:
- Micromachines, 2023, v. 14, n. 7, p. 1464, doi. 10.3390/mi14071464
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- Publication type:
- Article
Design and Characterization of a Planar Micro-Conveyor Device Based on Cooperative Legged Piezoelectric MEMS Resonators.
- Published in:
- Micromachines, 2022, v. 13, n. 8, p. 1202, doi. 10.3390/mi13081202
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- Publication type:
- Article
Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization.
- Published in:
- Micromachines, 2022, v. 13, n. 6, p. 908, doi. 10.3390/mi13060908
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- Publication type:
- Article
Collaborative Optimization of a Matrix Manufacturing System Based on Overall Equipment Effectiveness.
- Published in:
- Chinese Journal of Mechanical Engineering, 2024, v. 37, n. 1, p. 1, doi. 10.1186/s10033-024-01100-x
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- Publication type:
- Article
Multi Variant Surface Mounted Metal-Organic Frameworks.
- Published in:
- Advanced Functional Materials, 2013, v. 23, n. 30, p. 3790, doi. 10.1002/adfm.201202996
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- Publication type:
- Article
Ultra-broadband microstrip directional couplers.
- Published in:
- IET Science, Measurement & Technology (Wiley-Blackwell), 2020, v. 14, n. 9, p. 803, doi. 10.1049/iet-smt.2020.0067
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- Publication type:
- Article
THE DEVELOPMENT OF A BPN DATA MINING CALIBRATION SYSTEM IN A SMT PCB ASSEMBLY LINE.
- Published in:
- International Journal of Electronic Business Management, 2009, v. 7, n. 4, p. 286
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- Publication type:
- Article
A Calculation of the Magnetic Characteristics of Surface Mounted PMSMs Under Heavy Load Conditions Considering the Cross-Magnetizing Effect.
- Published in:
- International Review of Electrical Engineering, 2013, v. 8, n. 4, p. 1181
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- Publication type:
- Article
Performances Comparison of Two Surface-Mounted Permanent Magnet Generators with Fractional - Slot Windings.
- Published in:
- International Review of Electrical Engineering, 2013, v. 8, n. 1, p. 75
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- Publication type:
- Article
High-Precision Control for a Surface-Mounted Permanent Magnet Synchronous Motor Based on Inverse System Approach.
- Published in:
- International Review of Electrical Engineering, 2012, v. 7, n. 4, p. 4885
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- Publication type:
- Article
Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 3, p. 2073, doi. 10.1007/s11664-017-6014-7
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- Publication type:
- Article
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2628, doi. 10.1007/s11664-009-0923-z
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- Publication type:
- Article
The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5
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- Publication type:
- Article
Reliability Testing of WLCSP Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564
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- Publication type:
- Article
Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1550, doi. 10.1007/s11664-004-0097-7
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- Publication type:
- Article
Secure Circuit with Low-power On-chip Temperature Sensor for Detection of Temperature Fault Injection Attacks.
- Published in:
- Sensors & Materials, 2019, v. 31, n. 5, Part 1, p. 1375, doi. 10.18494/SAM.2019.2258
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- Publication type:
- Article
Applying Machine Learning to Construct a Printed Circuit Board Gold Finger Defect Detection System.
- Published in:
- Electronics (2079-9292), 2024, v. 13, n. 6, p. 1090, doi. 10.3390/electronics13061090
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- Publication type:
- Article
Influence of a PCB Layout Design on the Efficiency of Heat Dissipation and Mutual Thermal Couplings between Transistors.
- Published in:
- Electronics (2079-9292), 2023, v. 12, n. 19, p. 4116, doi. 10.3390/electronics12194116
- By:
- Publication type:
- Article
Experimental Implementation of a Low-Cost, Fully-Analog Self-Jamming Canceller for UHF RFID Devices.
- Published in:
- Electronics (2079-9292), 2020, v. 9, n. 5, p. 786, doi. 10.3390/electronics9050786
- By:
- Publication type:
- Article
High dynamic range image acquisition method using proportion integration differentiation controller.
- Published in:
- Optical Engineering, 2015, v. 54, n. 2, p. 1, doi. 10.1117/1.OE.54.2.023105
- By:
- Publication type:
- Article
Influence of yttrium element on the crystallization performance of ZnSb alloy for phase change memory application.
- Published in:
- European Physical Journal - Applied Physics, 2023, v. 98, n. 1, p. 1, doi. 10.1051/epjap/2023230054
- By:
- Publication type:
- Article
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 2, p. 82, doi. 10.4071/001c.81981
- By:
- Publication type:
- Article
Design of Solder Connections for Self-Assembly of Optoelectronic Devices.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 1, doi. 10.4071/imaps.739404
- By:
- Publication type:
- Article
Development and assembly of Radio Frequency Module using components with SMD technology for educational purposes.
- Published in:
- Latin-American Journal of Physics Education, 2017, v. 11, n. 1, p. 1
- By:
- Publication type:
- Article
Shanghai BST's New Plant.
- Published in:
- Elevator World, 2012, v. 60, n. 5, p. 134
- Publication type:
- Article
THE MANY FUNCTIONS OF FIXTURES.
- Published in:
- 2010
- Publication type:
- Product Review
ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTION.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 14, doi. 10.31399/asm.edfa.2024-3.p014
- By:
- Publication type:
- Article