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- Title
Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/ Transparent Thin-film Electronics.
- Authors
Chi Hwan Lee; Jae-Han Kim; Chenyu Zou; In Sun Cho; Weisse, Jeffery M.; Nemeth, William; Qi Wang; van Duin, Adri C. T.; Taek-Soo Kim; Xiaolin Zheng
- Abstract
Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the water-assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 ∼ 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-and-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices
- Subjects
TRANSFER printing; NICKEL films; ATOMIC force microscopy; POLYIMIDE films; SCANNING electron microscopy; PLASMA-enhanced chemical vapor deposition; SPIN coating
- Publication
Scientific Reports, 2013, p1
- ISSN
2045-2322
- Publication type
Article
- DOI
10.1038/srep02917