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- Title
Thermal and Damp Heat Stability of High‐Mobility In<sub>2</sub>O<sub>3</sub>‐Based Transparent Conducting Films Fabricated at Low Process Temperatures.
- Authors
Koida, Takashi; Ueno, Yuko
- Abstract
Thermal and Damp Heat Stability of High-Mobility In2O3-Based Transparent Conducting Films Fabricated at Low Process Temperatures B Transparent Conductive Oxide b Polycrystalline In SB 2 sb O SB 3 sb :Me (Me: W, Ce) and solid-phase crystallized In SB 2 sb O SB 3 sb :Me,H films with high electron mobility can be fabricated at low process temperatures of 200 °C by ion plating with DC arc discharge, known as high-density plasma enhanced evaporation or reactive plasma deposition (RPD). More details can be found in article number 2000487 by Takashi Koida and Yuko Ueno.
- Subjects
LOW temperatures; HEAT; ION plating; ELECTRIC arc; PLASMA deposition
- Publication
Physica Status Solidi. A: Applications & Materials Science, 2021, Vol 218, Issue 4, p1
- ISSN
1862-6300
- Publication type
Article
- DOI
10.1002/pssa.202000487