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- Title
Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints.
- Authors
Xue, Peng; Xue, Song-bai; Shen, Yi-fu; Long, Fei; Zhu, Hong
- Abstract
Growth kinetics of intermetallic compound layers (IMCs) formed between SnZnGa/SnZnGaNd solders for re-flow soldering and Cu substrate during aging was investigated at temperatures between 100 and 150 °C. The CuZn IMCs could be found by reacting SnZnGa/SnZnGaNd solders on Cu substrate, and it was found that the addition of rare earth Nd can decrease the thickness of the IMCs of SnZn/Cu solder joints. The apparent activation energies of CuZn which were calculated as 48.76 kJ/mol (SnZnGa) and 56.99 kJ/mol (SnZnGaNd). The shear force of Sn9Zn0.5Ga0.08Nd solder joint after aging treatment was remarkably higher than those of Sn-9Zn and Sn9Zn0.5Ga solder joints. The results would provide support to the superiority of Sn9ZnGaNd solder which can be used in the electronic packaging instead of traditional SnPb solder.
- Subjects
INTERMETALLIC compounds; TIN compounds; SOLDER joints; EFFECT of temperature on metals; ELECTRONIC packaging
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 10, p4219
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-2152-3