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- Title
INTERACTION OF BIAG11 SOLDER WITH CU, AG AND NI SUBSTRATES.
- Authors
Chachula, Michal; Kolenak, Roman; Kolenakova, Monika
- Abstract
The aim of this contribution is to look at the interactions between BiAg11 solder and Cu, Ag and Ni substrates in detail. A degree of interaction was determined on the basis of wetting angles. The best wetting angle of 18° was measured in the case of Ag substrate with the application of flux. Unsatisfactory wetting angle of 146° was attained in case of Ni substrate with the application of flux. The sizes of wavy interfaces were determined by the EDX microanalysis and this experiment was aimed at finding in which cases the application of substrates resulted in the formation of intermetallic compounds and when only a eutectic reaction occurred. The intermetallic compound was created only during the application of Ni substrate. The results showed that shorter endurance and addition of flux resulted in better interaction between BiAg11 solder and Cu or Ag substrates. On the contrary, longer time of endurance without the application of flux caused better interaction between Ni substrate and the solder used.
- Subjects
SUBSTRATES (Materials science); COPPER; SILVER; NICKEL; WETTING; MICROCHEMISTRY; INTERMETALLIC compounds
- Publication
Annals of DAAAM & Proceedings, 2011, p1009
- ISSN
1726-9679
- Publication type
Article