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- Title
Substrate temperature influenced ZrO<sub>2</sub> films for MOS devices.
- Authors
Kondaiah, Paruchuri; Jagadeesh Chandra, S.V.; Fortunato, Elvira; Chel Jong, Choi; Mohan Rao, G.; Koti Reddy, D.V. Rama; Uthanna, S.
- Abstract
The effect of substrate temperature on the direct current magnetron‐sputtered zirconium oxide (ZrO2) dielectric films was investigated. Stoichiometric of the ZrO2 thin films was obtained at an oxygen partial pressure of 4.0 × 10−2 Pa. X‐ray diffraction studies revealed that the crystallite size in the layer was increased from 4.8 to 16.1 nm with increase of substrate temperature from 303 to 673 K. Metal‐oxide‐semiconductor devices were fabricated on ZrO2/Si stacks with Al gate electrode. The dielectric properties of ZrO2 layer and interface quality at ZrO2/Si were significantly influenced by the substrate temperature. The dielectric constant increased from 15 to 25, and the leakage current density decreased from 0.12 × 10−7 to 0.64 × 10−9 A cm−2 with the increase of substrate temperature from 303 to 673 K.
- Subjects
DIELECTRIC films; PERMITTIVITY; DIELECTRIC properties; METAL oxide semiconductor field-effect transistors; ZIRCONIUM oxide; PARTIAL pressure; METAL oxide semiconductor capacitors
- Publication
Surface & Interface Analysis: SIA, 2020, Vol 52, Issue 9, p541
- ISSN
0142-2421
- Publication type
Article
- DOI
10.1002/sia.6775