Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleShallow trench isolation structure design for through‐silicon vias stress reduction.AuthorsWang, Fengjuan; Liu, Suiyang; Yin, Xiangkun; Yu, Ningmei; Yang, YuanPublicationInternational Journal of Numerical Modelling, 2022, Vol 35, Issue 4, p1ISSN0894-3370Publication typeArticleDOI10.1002/jnm.2988